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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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TEGOPAC® Bond 170

Technical Datasheet | Supplied by Evonik
TEGOPAC® Bond 170 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants with PPG as the backbone polymer. Applications include liquid membranes (for roofing applications), facade sealants (to address ISO 11600 requirements), high modulus adhesives (for assembly of structural elements or sound & vibration dampening), transparent adhesives & sealants (for invisible joints). It is based on a unique polymer technology with lateral crosslinking groups. It exhibits excellent- through cure properties, elastic recovery properties, intercoat-adhesion/overcoatability, improved water & thermal resistance and excellent. Due to the reactive groups in lateral position, curing starts in presence of moisture and a catalyst. Ethanol is released during the curing process. Methanol-free formulations with self-levelling properties or high filler load can be made using TEGOPAC® Bond 170. It is free of solvents or plasticizers. Its high clarity allows formulating very transparent, clear adhesives & sealants with good UV stability. A standard chemical drying agent (e.g. Dynasylan® VTMO or VTEO) can be added to the formulation while processing. It has a shelf life of 6 months.
Product Type
Silyl-modified Polymers (SMP)
Chemical Composition
Silylated polymer
Physical Form
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