Energy savings plus mechanical reinforcement and rheology control

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ECMS -227

Technical Datasheet | Supplied by Gelest (Mitsubishi Chemical)

ECMS -227 by Gelest (Mitsubishi Chemical) is 2-3% [(Epoxycyclohexyl) ethyl] methylsiloxane-dimethylsiloxane copolymer. It can be cured either by cationic UV photo initiators or conventional epoxy hardeners. In cationic UV-cure systems this cycloaliphatic epoxy silicone combines the properties of reactive diluents with surfactant properties. The release properties can be employed to make parting layers for multilayer films. If high levels of epoxy functional silicones are used in UV cure formulations, cationic photo initiators with hydrophobic substitution are preferred. Offers controlled release, outstanding weathering characteristic, coefficient of friction and excellent electrical properties. ECMS -227 is used in encapsulant applications.

Compatiblity with other products

Find products that are predicted to be compatible with ECMS -227.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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Compatible Products Based on HSP Distance

HSP distance provides an indication of compatibility. It is based upon the “like seeks like” principle. The smaller the distance between ingredients, the more compatible they are predicted to be.

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