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Adhesives Ingredients

SST -3PM4

Technical DataSheet | Supplied by Gelest

(40% penyl- 45% methylsilsesquioxane)-(5% phenylmethylsiloxane) (10% diphenylsiloxane) tetrapolymer. This T-resin is an alternate designation which indicates that there are three (tri-substituted) oxygens substituting the silicon. SST -3PM4 is a highly cross-linked material with empirical formula RSiO1.5. . It is named from the organic group as well as its one and half (sesqui) stoichiometry of oxygen is bound to silicon. Polysilsesquioxane resins containing silanols (hydroxyls) can be cured at elevated temperatures. Its formulation and catalysis is generally performed at room-temperature or below. The condensation of silanols leads to cure and the resins become tough binders or films. The cure is usually accelerated by the addition of 0.1-0.5% of a catalyst such as dibutyltindiacetate, zinc acetate or zinc 2-ethylhexanoate. This resin as dielectric, planarization and reactive ion etch resistant layers finds application in microelectronics. It is also used in encapsulants and sealants.

SST -3PM4 Product details

Product Type
xxxxxxxxxxxxxx
Chemical Composition
xxxxxxxxxxxxxxxxxxxxxxxxx
CAS Number
181186-36-7
Product Status
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Applications/ Recommended for
  • xxxxxxxxx
  • xxxxxxxx
Labels/Agency Rating
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SST -3PM4 Properties

Property

Value & Unit
Test Condition
Test Method
Silsesquioxane
xx %
Siloxane
xx %
Molecular weight, M.W. (approximate)
xxxxxxxxxx
Specific gravity
xxxx
OH
xxxxx %
Last edited Dec 18, 2017
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