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Adhesives Ingredients
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Adhesives Ingredients
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Epi-rez™ WD-510

Technical Datasheet | Supplied by Hexion
Liquid, bisphenol A type epoxy resin specifically designed for water dilution. Acts as a binder for sealers. Is alkylphenol ethoxylates free. Forms uniform dispersions in water in combination with aliphatic amine curing agents, including adducts, amidoamines, polyamides, and accelerated amines. Can be thinned with epoxy diluent modifiers including HELOXY™ modifier 8, HELOXY modifier 62 or CARDURA™ E-10 to facilitate mixing and handling.
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Product Type
Epoxies (EP) > Bisphenol A-based
Chemical Composition
Bisphenol A type epoxy resin
Physical Form
Liquid
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