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Adhesives Ingredients
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Adhesives Ingredients
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Epikote™ Resin 235

Technical Datasheet | Supplied by Hexion
Diluent-free, low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin). Contains no diluent. Provides good pigment wetting and good resistance to filler settling. Does not crystallise on storage. Imparts high mechanical performance. Used in building and civil engineering industries e.g. flooring compounds, adhesives, mortars and grouts.
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Product Type
  • Epoxies (EP) > Bisphenol F-based
  • Epoxies (EP) > Bisphenol A-based
Chemical Composition
Epoxy resin
Product Status
COMMERCIAL
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