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Adhesives Ingredients
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Adhesives Ingredients
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Epon™ Resin 1007F

Technical Datasheet | Supplied by Hexion
Phenol, 4,4’-(1-methylethylidene)bis-, polymer with 2,2’-[(1 methylethylidene)bis(4,1-phenyleneoxymethylene)]bis(oxirane). Moderately high molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. Provides unique melt viscosity characteristics. Used in hot melt adhesives.
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Product Type
Epoxies (EP) > Bisphenol A-based
Chemical Composition
Phenol, 4,4’-(1-methylethylidene)bis-, polymer with 2,2’-[(1-methylethylidene)bis(4,1-phenyleneoxymethylene)]bis(oxirane)
CAS Number
25036-25-3
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