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Adhesives Ingredients

Epon™ Resin 825

Technical DataSheet | Supplied by Hexion

High purity, low viscosity bisphenol A epichlorohydrin epoxy resin. As a result, the viscosity of this product is lower than standard bisphenol A liquid resins without the use of diluents or modifiers. Offers greater clarity, chemical resistance, higher heat distortion temperature and lower electrical conductivity than can be obtained with most other standard resins. Reacts with a full range of curing agents. Produces high-strength cured systems resistant to chemical attack. Used in aerospace and specialty adhesives.

Epon™ Resin 825 Product details

Product Type
xxxxxxxxxxxxxxxxxxxxxxxxx
Chemical Composition
xxxxxxxxxxxxxxxxxxxxxxxxx
Product Status
xxxxxxxxxx
Applications/ Recommended for
  • xxxxxxxxx
  • xxxxxxxxxxxxxxxxxxxxxxxxx
Food contact approval
xxx
Bio Based
xx

Epon™ Resin 825 Properties

Property

Value & Unit
Test Condition
Test Method
Density @ 25°C
xxxxxxxxx lb/gal
Saponifiable chloride
xxxxxx %wt
Sodium
xxxxx ppm
Last edited Dec 18, 2017
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