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Adhesives Ingredients
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Epon™ Resin 872

Technical Datasheet | Supplied by Hexion
Semi-solid chemically modified bisphenol A based epoxy resin. Can be formulated with other EPON Resins or used as the sole resin to provide varying degrees of flexibility and toughness but reduces elevated temperature performance. Can also be used with all curing agents. May be used to produce potting and encapsulants of high thermal shock resistance.
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Product Type
Epoxies (EP) > Bisphenol A-based
Chemical Composition
Modified bisphenol A-based epoxy resin
Product Status
COMMERCIAL
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