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Adhesives Ingredients

Eponol™ Resin 53-BH-35

Technical DataSheet | Supplied by Hexion

Ultra high molecular weight epoxy resin cut to 35% weight in a blend of solvents. This blend is methyl ethyl ketone (MEK) and propylene glycol methyl ether (PGME) in a ratio of 75/25 by weight. Is derived from bisphenol-A and epichlorohydrin. Imparts the flexibility and modifies the flow properties. Can be used as a modifier in epoxy adhesives and electrical laminates.

Eponol™ Resin 53-BH-35 Product details

Product Type
xxxxxxxxxxxxxxxxxxxxxxxxx
Chemical Composition
xxxxxxxxxxx
CAS Number
25036-25-3
Product Status
xxxxxxxxxx
Applications/ Recommended for
xxxxxxxxx
Food contact approval
xx
Bio Based
xx

Eponol™ Resin 53-BH-35 Properties

Property

Value & Unit
Test Condition
Test Method
Solids
xxxx %volume
Density
xxx lbs/gal
Vapor pressure @ 68°F
xx mmHg
Specific gravity @ 25°C
xxxxx
Flash point, Setaflash
xxxx °F
Evaporation rate
xxx
Last edited Dec 18, 2017
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