The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Eponol™ Resin 53-BH-35

Technical Datasheet | Supplied by Hexion
Ultra high molecular weight epoxy resin cut to 35% weight in a blend of solvents. This blend is methyl ethyl ketone (MEK) and propylene glycol methyl ether (PGME) in a ratio of 75/25 by weight. Is derived from bisphenol-A and epichlorohydrin. Imparts the flexibility and modifies the flow properties. Can be used as a modifier in epoxy adhesives and electrical laminates.
Product Type
Epoxies (EP) > Bisphenol A-based
Chemical Composition
Epoxy resin
CAS Number
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