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Adhesives Ingredients
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Adhesives Ingredients
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L-MODU™ S400

Technical Datasheet | Supplied by Idemitsu Kosan
L-MODU™ S400 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky properties. It shows compatibility with polypropylene. It exhibits good flexibility, high adhesive strength, slow crystallization and high thermal decomposition stability. It offers good sprayability, long open time, transparency and low VOC. L-MODU™ S400 is designed for hot-melt adhesives. It is recommended for packaging, woodworking, nonwoven fabrics and hygiene applications.
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L-MODU™ S400
Technical Datasheet | Supplied by Idemitsu Kosan
REQUEST A SAMPLE ORIGINAL DATASHEET CONTACT SUPPLIER
Product Type
Polyolefins > Polypropylene & Derivatives
Chemical Composition
Polyolefin
Appearance
Transparent, Colorless
Product Status
COMMERCIAL
Applications/ Recommended for
  • Adhesives > Hot-melts
  • Non-woven
  • Papers & Packagings
  • Wood & Related Industries

L-MODU™ S400 Properties

Property

Value & Unit
Test Condition
Test Method
Molecular Weight
45000
(Weight Average (Mw). Gel Permeation Chromatography)
Idemitsu Method
Viscosity
8500 mPa-s
(At 190°C. Apparent Value. Type-B Viscometer)
Idemitsu Method
Density
870 kg/m3
ISO 1183

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