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Adhesives Ingredients
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Adhesives Ingredients
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Skybond® 703

Technical Datasheet | Supplied by Industrial Summit Technology
BTDA/MDA based aromatic polyimide solution. Used in structural composites and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion and toughness and good modulus/flexural strength.
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Product Type
Polyimides
Chemical Composition
Polyimide
CAS Number
65701-06-6
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Last edited September 27, 2023
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