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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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SP 1056

Technical Datasheet
Brominated octylphenol/formaldehyde heat reactive resin. Used in pressure sensitive adhesives. Provides improved cohesive strength and little color to the finished adhesive.
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Product Type
Aminoplastes / Phenoplastes (UF, MUF) > Phenol Formaldehydes
Chemical Composition
Brominated octylphenol and formaldehyde
Physical Form
Flakes
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