TEGO® Antifoam KS 53 by Evonik is a self-emulsifying organic antifoam concentrate based on a food grade vegetable oil, containing small amounts of organo-modified. It is APEO-free grade designed for... view more

TEGO® Antifoam KS 6 by Evonik is a self-emulsifying organic antifoam concentrate, containing small amounts of polysiloxanes for enhancing the efficiency. It is used in water-based adhesives. TEGO®... view more

TEGO® Antifoam KS 95 by Evonik is an organic self-emulsifier, containing small amounts of organo-siloxanes. It is used as antifoam for water-based adhesives. It offers good dispersibility... view more

TEGO® Antifoam LP 121 by Evonik is a self-emulsifying, organic, silicon-free concentrate. It is used as antifoam for water-based adhesives. TEGO® Antifoam LP 121 may be used for foam control in a... view more

TEGO® Antifoam LP 132 by Evonik is a medium viscosity emulsion based on white oil and wax. It is used as antifoam for water-based adhesives. It provides reliable foam control and long-term... view more

TEGO® Antifoam P 205 by Evonik is a powder based on organo-modified siloxane. It used as an antifoam in dispersion powder for adhesives and sealing. TEGO® Antifoam P 205 provides destruction or... view more

TEGO® Photo Compound 750 by Evonik is a mixture of silicate acrylate and an oligomeric alpha-cleavage photoinitiator. It is used in release coatings for self adhesive products, such as self adhesive... view more

TEGO® RC 706 by Evonik is solvent-free silicone acrylate. It is used for the manufacture of release coatings with controlled release properties for self adhesive products such as self adhesive... view more

TEGO® RC 709 by Evonik is a solvent-free silicone acrylate. It is used for the manufacture of release coatings with controlled release properties for self adhesive products such as self adhesive... view more

TEGO® RC 711 by Evonik is a solvent-free silicone acrylate. It can be cured by either electron beam or ultraviolet radiation. It provides high release values and very good ageing characteristics... view more

TEGO® RC 715 by Evonik is solvent-free silicone acrylate. It is used for the manufacture of self adhesive products such as self adhesive labels, tapes and hygiene products. It offers the ability to... view more

TEGO® RC 722 by Evonik is a solvent-free, radical curing silicone acrylate grade. It exhibits increased abrasion resistance, scratch resistance, improved rub-off and low blend viscosity. It provides... view more

TEGO® RC 902 by Evonik acts as releasing agent. It is solvent-free, silicone acrylate. It shows easy release properties for self-adhesive products such as self-adhesive labels, tapes, and hygiene... view more

TEGO® Surten W 111 by Evonik is a solvent- and silicone- free, non-ionic organic surfactant. It is used as a foam inhibiting wetting agent for water based systems. It is suitable for pressure... view more

Tego® Surten W 125 by Evonik is a polyether siloxane copolymer. It is used as wetting agent for applications of pressure sensitive adhesives under high dynamics. Use level of Tego® Surten W 125 is... view more

TEGO® Surten W 130 by Evonik is a low foaming, solvent- and silicone- free, non-ionic organic surfactant. It is used as wetting agent for water based systems. TEGO® Surten W 130 is suitable for... view more

TEGO® Surten W 133 by Evonik is a solvent- and silicone- free, non-ionic organic surfactant. It is used as a foam inhibiting wetting agent for water based systems. It is suitable for pressure... view more

TEGO® Surten W 5840 by Evonik is a polyether siloxane. It is solvent free, non-ionic surfactant. It shows excellent surface wetting in adhesive applications, where the coating of difficult... view more

Tego® Surten W 5878 by Evonik is a non-ionic polyether siloxane. It is compatible with cationic, anionic, non-ionic and amphoteric surfactants. It shows excellent surface wetting in adhesive... view more

TEGOPREN® 5840 by Evonik is a non-ionic solvent-free, easy to handle polyether siloxane. It reduces the surface tension of water-based systems. It enhances the spreading on non-polar surfaces such... view more

TEGOPREN® 5847 by Evonik is a polyether siloxane. It is a non-ionic solvent-free, easy to handle liquid with 100% active content. It is suitable for adhesives used in the paper, wood and furniture... view more

TEGOPREN® 5890 by Evonik is an organo-modified siloxane. It is a solvent-free, easy to handle liquid, acts as an anti-foaming and wetting agent. It is highly efficient in fighting dry foam and shows... view more

VESTAMELT® 171 by Evonik is a high-viscosity polyamide hot-melt adhesive. It improves the resistance to strike back in pastes. It provides benefits such as very good adhesion, improved resistance to... view more

VESTAMELT® 171-P1 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more

VESTAMELT® 230 by Evonik is copolyamide hotmelt adhesive. It offers high resistance to heat and low viscosity. It provides very good resistance to washing to 90°C, steam and dry-cleaning. VESTAMELT®... view more

VESTAMELT® 230-P1 by Evonik is a copolyamide hotmelt adhesive. It offers high resistance to heat and low viscosity. It provides very good resistance to washing to 90°C, steam and dry-cleaning... view more

VESTAMELT® 250 by Evonik is a copolyamide hotmelt adhesive. It is used in paste dot, double dot-lower dot, powder dot, front fixing for garments, uniforms and car interiors. VESTAMELT® 250 offers... view more

VESTAMELT® 250-P1 by Evonik is a copolyamide hotmelt adhesive. It offers advantages such as high melting point and high melt viscosity, very good resistance to strike back and very good resistance... view more

VESTAMELT® 250-P2 C by Evonik is a copolyamide hotmelt adhesive. It offers benefits such as high resistance to temperature, washing and dry cleaning, good adhesion and higher fusing temperatures... view more

VESTAMELT® 250-P816 by Evonik is copolyamide Hotmail adhesive. It offers high resistance to heat and good adhesion. It provides very good resistance to washing to 90°C, steam and dry-cleaning. It... view more

VESTAMELT® 251 by Evonik is a copolyamide hotmelt adhesive. It is used in paste dot, double dot-lower dot, powder dot, front fixing for garments, uniforms and car interiors. VESTAMELT® 251 offers... view more

VESTAMELT® 253 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It offers benefits such as very good resistance to washing, resistance to sand-washing, good resistance to heat and low... view more

VESTAMELT® 3041 by Evonik is copolyamide hot-melt adhesive. It is used in automotive industry for filter bonding and in hot-melt print. VESTAMELT® 3041 offers good resistance to diesel fuel and... view more

VESTAMELT® 3261 by Evonik is copolyamide hot-melt adhesive. It is used in automotive industry for filter bonding, hot-melt print and bonding generator rotors. VESTAMELT® 3261 possesses temperature... view more

VESTAMELT® 350 by Evonik is a multi-purpose copolyamide hotmelt adhesive. It is used in textile and garment industries like paste dot, powder dot, powder scattering, multi-purpose and general front... view more

VESTAMELT® 350-P1 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more

VESTAMELT® 350-P2 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more

VESTAMELT® 350-P3 by Evonik is a multi-purpose copolyamide hotmelt adhesive. It is used in industrial textiles and garment industry. VESTAMELT® 350-P3 offers good resistance to heat and special... view more

VESTAMELT® 350-P4 by Evonik is a multi-purpose copolyamide hot-melt adhesive. It offers good resistance to heat. It provides good resistance to washing to 60°C, satisfactory resistance to steam and... view more

VESTAMELT® 350-P816 by Evonik is a multi-purpose copolyamide hot-melt adhesive. It offers good resistance to heat. It provides good resistance to washing to 60°C, satisfactory resistance to steam... view more

VESTAMELT® 351 by Evonik is a multi-purpose copolyamide hot-melt adhesive. Used in the textile and garment industries like paste dot, powder dot, powder scattering and general front fixing... view more

VESTAMELT® 353 by Evonik is a multi-purpose copolyamide hot-melt adhesive. It is used in textile and garment industries like paste dot, powder dot, powder scattering and general front fixing... view more

VESTAMELT® 357 by Evonik is a multi-purpose copolyamide hotmelt adhesive. It is used in textile and garment industries like paste dot, powder dot, powder scattering and general front fixing... view more

VESTAMELT® 4280 by Evonik is a thermoplastic copolyester hot-melt adhesive for textile bonding. It offers very good resistance to washing to 60° and steam and good resistance to dry-cleaning... view more

VESTAMELT® 430 by Evonik is copolyamide hot-melt adhesive. It is used in non-woven textile and nets like upper dot-DD, powder dot, pressure and temperature sensitive outerwear, seam bonding and... view more

VESTAMELT® 430-P1 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It is used in pressure-sensitive and thermally sensitive face fabrics. VESTAMELT® 430-P1 offers benefits such as low... view more

VESTAMELT® 430-P2 by Evonik is thermoplastic copolyamide hot-melt adhesive. It possesses low melt viscosity. VESTAMELT® 430-P2 is used in good face fabrics and ladies wear... view more

VESTAMELT® 430-P816 by Evonik is a low melting temperature, low-viscosity copolyamide. It is used for manufacture of hot-melt adhesive for non-woven textile and nets. It provides good resistance to... view more

VESTAMELT® 431 by Evonik is a low-viscosity copolyamide. It is used in manufacture of hot-melt adhesive for non-woven textile and nets, upper dot-DD, powder dot, pressure and temperature sensitive... view more

VESTAMELT® 432 by Evonik is thermoplastic copolyamide hot-melt adhesive. It is used in coated fabric and non-woven fabrics for reinforcing lining, laminates for the shoe and leather industry... view more

VESTAMELT® 4481-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive for bonding textiles. It offers good resistance to washing to 60° and steam and satisfactory resistance to dry-cleaning... view more

VESTAMELT® 450 by Evonik is copolyamide hot-melt adhesive. It is used in textile industry like paste dot, powder dot and front fixing in garment industry. VESTAMELT® 450 offers benefits such as low... view more

VESTAMELT® 450-P1 by Evonik is thermoplastic copolyamide hot-melt adhesive. It offers benefits such as low melting point, low fusing temperature and good resistance to strike back... view more

VESTAMELT® 450-P2 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It possesses low melting point, good resistance to strike back and low fusing temperature... view more

VESTAMELT® 450-P3 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It offers benefits such as low melting point, good resistance to strike back and low fusing temperature. VESTAMELT®... view more

VESTAMELT® 451 Copolyamide hotmelt adhesive. It offers benefits such as low melting point, good resistance to hydrolysis and multi-purpose for low fixing temperatures. VESTAMELT® 451 is used in... view more

VESTAMELT® 4580-P1 by Evonik is thermoplastic copolyester hot-melt adhesive. It gives a wide fixing range. It offers good resistance to washing to 60° and dry-cleaning and very good resistance to... view more

VESTAMELT® 4580-P816 by Evonik is a thermoplastic copolyester hot-melt adhesive. It gives a wide fixing range. It offers good resistance to washing to 60°C and dry-cleaning and very good resistance... view more

VESTAMELT® 4581-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive. It gives a wide fixing range. Offers good resistance to washing to 60° and dry-cleaning and very good resistance to... view more

VESTAMELT® 4680-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive. It used for textile bonding. Gives low melting temperature. It offers good resistance to washing to 60°C and... view more

VESTAMELT® 4680-P2 by Evonik is a thermoplastic copolyester hot-melt adhesive. VESTAMELT® 4680-P2 offers benefits such as low fusing temperature, good adhesive strength and fusing with hand iron... view more

VESTAMELT® 4681-P1 by Evonik is a thermoplastic copolyester hot-melt adhesive. It is used for textile bonding. It gives low melting temperature. It offers good resistance to washing to 60°C and... view more

VESTAMELT® 470 by Evonik is copolyamide hot-melt adhesive. It used in the manufacture of films like pastes, paste dot and powder dot. VESTAMELT® 470 offers benefits such as low viscosity and... view more

VESTAMELT® 470-P1 by Evonik is a copolyamide hot-melt adhesive. It offers benefits such as low melting point, high melt viscosity and improved resistance to strike back... view more

VESTAMELT® 471 by Evonik is a copolyamide hot-melt adhesive. It used in manufacture of films and in pastes, paste dot and powder dot. VESTAMELT® 471 offers improved resistance to strike back in... view more

VESTAMELT® 640 by Evonik is a copolyamide hot-melt adhesive. It is used in temperature-sensitive materials such as leather and furs, paste dot and powder dot. VESTAMELT® 640 offers benefits such as... view more

VESTAMELT® 640-P1 by Evonik is a thermoplastic copolyamide hot-melt adhesive. It provides very low melting point for leather and furs... view more

VESTAMELT® 722 by Evonik is copolyamide hot-melt adhesive. It offers benefits such as low melting point and low viscosity for good adhesion on difficult surfaces... view more

VESTAMELT® 730 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, upper dot-DD, scattering, seating upholstery, difficult surfaces, shoulder padding, furs, aluminum films with... view more

VESTAMELT® 730-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, low melt viscosity and very good adhesion to surfaces difficult to fuse and to silicon... view more

VESTAMELT® 730-P816 by Evonik is copolyamide hot-melt adhesive. It offers low melting point and low viscosity. Provides good resistance to washing to 60°C, satisfactory resistance to steam and very... view more

VESTAMELT® 730-P816/20 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, low melt viscosity and very good adhesion to surfaces that are difficult to... view more

VESTAMELT® 732 by Evonik is low melting temperature heat-stabilized copolyamide hotmelt adhesives. It is used in hot-melt dot applications like melt print, aluminum films with textile and easy to... view more

VESTAMELT® 742 by Evonik is a heat-stabilized, copolyamide hot-melt adhesive. It is used in hot-melt dot applications like melt print. VESTAMELT® 742 possesses low melting temperature and slightly... view more

VESTAMELT® 750 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as low melting temperature, wide fixing range, high specific adhesion and reduced tack. VESTAMELT® 750 is used in... view more

VESTAMELT® 750-P1 by Evonik is thermoplastic copolyamide hot-melt adhesives. It possesses good adhesion, good resistance to washing and dry cleaning and decreased tack after coating. VESTAMELT®... view more

VESTAMELT® 750-P2 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, higher melt viscosity and good resistance to strike back. VESTAMELT® 750-P2 shows... view more

VESTAMELT® 750-P3 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point and good resistance to strike back. VESTAMELT® 750-P3 shows good adhesion to face... view more

VESTAMELT® 750-P816/20 by Evonik is a low melting temperature, copolyamide hot-melt adhesive. It offers good adhesion on difficult substrates. It provides good resistance to washing to 60°C... view more

VESTAMELT® 753 by Evonik is copolyamide hot-melt adhesive. It used in textile, automotive, electronics and construction industry... view more

VESTAMELT® 755 by Evonik is copolyamide hot-melt adhesive. It offers benefits such as low melting temperature, high resistance to strike back, good resistance to washing and wide fixing range... view more

VESTAMELT® 755-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, high melt viscosity, good resistance to strike back and well adapted to substrates with... view more

VESTAMELT® 755-P2 by Evonik is a low melting temperature copolyamide hot-melt adhesive. It offers high resistance to strike back. It provides good resistance to washing to 60°C, satisfactory... view more

VESTAMELT® 840 by Evonik is copolyamide hot-melt adhesive. It is used in textile industry like paste dot, upper dot material double dot. VESTAMELT® 840 offers benefits such as high resistance to... view more

VESTAMELT® 840-P1 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as medium melt viscosity, wide fusing range, high resistance to steam and multipurpose. VESTAMELT® 840-P1... view more

VESTAMELT® 840-P2 by Evonik hot-melt adhesive. It provides benefits such as wide fusing range, high resistance to steam, good adhesion strength and multipurpose grade for different interlinings... view more

VESTAMELT® 840-P816 by Evonik is copolyamide hot-melt adhesive. It provides very good resistance to washing to 60°C, steam and dry-cleaning. It contains an optical brightening agent. VESTAMELT®... view more

VESTAMELT® 930 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, double dot, powder scattering, hot-melt print and extrusion. VESTAMELT® 930 offers high resistance to heat and... view more

VESTAMELT® 940 by Evonik is copolyamide hotmelt adhesive. It is used in paste dot, double dot, powder scattering, powder dot, hot-melt print and extrusion. VESTAMELT® 940 offers high resistance to... view more

VESTAMELT® 970 by Evonik is copolyamide hot-melt adhesive. It is used in manufacture of films and pastes, paste dot and powder dot. VESTAMELT® 970 offers improved resistance to strike back... view more

VESTAMELT® X1010 by Evonik is copolyamide hot-melt adhesive. It is used in stoving paints for self-bonding wires for coil manufacture. VESTAMELT® X1010 offers benefits such as amorphous and high... view more

VESTAMELT® X1017/25 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as high resistance to steam, very low viscosity giving good adhesive properties on difficult surfaces and a... view more

VESTAMELT® X1027 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, powder dot and colored interlinings. VESTAMELT® X1027 offers advantages such as wide fixing range, high... view more

VESTAMELT X1038 by Evonik is copolyamide hot-melt adhesive with good washing and steam resistance. It shows good adhesion even to substrates on which bonding is difficult... view more

VESTAMELT® X1077/30 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, double dot, powder scattering, hot-melt print and extrusion. VESTAMELT® X1077/30 offers advantages such as... view more

VESTAMELT® X1301 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as wide fixing range and very good resistance to washing and dry cleaning. VESTAMELT® X1301 shows suitability... view more

VESTAMELT® X1338 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as low melting temperature, wide fixing range, high specific adhesion and reduced tack... view more

VESTAMELT® X4685 by Evonik is an amorphous copolyamide hot-melt adhesive. It is used in wire coating industry and in stoving paint applications in the electronics industry. VESTAMELT® X4685 showsd... view more

VESTAMELT® X7079 by Evonik is copolyamide hot-melt adhesive. It is used in the wire coating industry and stoving paint applications in the electronics industry. VESTAMELT® X7079 possesses high... view more

VESTAMIN® A 139 by Evonik is a liquid, blocked crosslinker for polyisocyanate resins based on a cycloaliphatic diamine. The product exhibits a very low reactivity towards isocyanate groups... view more