The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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4 products match your search
Product Name
Reactive polyamide. Acts as an epoxy curing agent. It provides excellent adhesion to a variety of substrates. Ancamide® 261A is readily compatible with a wide range of solvents. Has high viscosity... view more
N-(2-hydroxy ethyl) diethylene triamine. Acts an ambient or elevated temperature curing agent. It is a two-component (2K) epoxy adhesive in which the term two-component indicates that the curing... view more
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent for epoxy resins. It is based on unmodified aliphatic amine grade. Used in ambient and heat-cured... view more
Blocked aliphatic polyisocyanate (HDI homopolymer). Used as a crosslinker in solvent-based adhesives for automotive... view more
Nagase Water Soluble Epoxy Compounds
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