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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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587 products match your search
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Cardolite® NX-2026 is a high purity cardanol, bio-based diluent, resin modifier, and accelerator designed for use in adhesives and sealants. It is based on natural, renewable, non-food raw material... view more
Cardolite® Ultra LITE 513 by Cardolite is a low viscosity, mono-functional epoxy reactive diluent. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and... view more
Cardolite® LITE 513E is an epoxy reactive diluent. It contains low total chlorine/halogen content (≤ 1000ppm) and exhibits low color & low viscosity. This glycidyl ether offers reduced shrinkage... view more
Cardolite® NC-513 is a low viscosity, mono-functional epoxy reactive diluent by Cardolite. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and provides... view more
Cardolite® NC-514 is a diglycidyl ether epoxy resin. Cardolite® NC-514 provides excellent flexibility, outstanding water resistance, and increased bond strength on difficult substrates like wet or... view more
Dynasylan® 1124 by Evonik is a bis(trimethoxysilylpropyl)amine grade with excellent crosslinking properties. Acts as an adhesion promoter and surface modifier. This grade provides improvement in... view more
Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity... view more
3M™ Boron Nitride Cooling Filler Agglomerates CFA 100 by 3M is randomly oriented agglomerates for high filler loadings and isotropic thermal conductivity. Its softness helps facilitate low impact on... view more
3M™ Boron Nitride Cooling Filler Agglomerates CFA 150 by 3M is soft agglomerates for high filler loadings and isotropic thermal conductivity. It helps facilitate low impact on viscosity and easy... view more
3M™ Boron Nitride Cooling Filler Agglomerates CFA 250SS by 3M is boron nitride platelets spray-dried with inorganic binder to spherical granulates for high flowability and dosing velocities during... view more
3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M by 3M is a mixture of agglomerates, platelets and boron nitride clusters. It provides excellent heat transfer capabilities (through-plane), high... view more
3M™ Boron Nitride Cooling Filler Flakes CFF 200-15 by 3M is powder of textured agglomerates preferred for lowest viscosity in epoxies and silicones. It is ideal as a secondary filler for the... view more
A&C Catalysts
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
A&C Catalysts
Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide... view more
Technicure® Nano-Dicy is a pulverized grade of dicyandiamide with an average particle size of about 1-2 micron. Acts as a curing agent. Provides excellent adhesion to a variety of substrates and has... view more
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic... view more
AMPAC Fine Chemicals
It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary... view more
Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more
Aquent Impex
Bis-phenol A epoxy resin. It is a colorless or yellow viscous liquid with low toxicity. It can be modified to meet a wide variety of bonding needs. Generally, epoxy bonds are rigid and they fill... view more
Dianol® 223 by Arkema is polyether diol. It is a polyol containing primary hydroxyl groups. It provides improved adhesion and exhibits resistance to hydrolysis & high temperature. It remains solid... view more
Dianol® 240 by Arkema is polyether diol containing primary hydroxyl groups. Ihis polyol provides improved adhesion. Exhibits resistance to hydrolysis & high temperature. Used in automotive, building... view more
Dianol® 3120 by Arkema is polyether diol containing secondary hydroxyl groups. It provides improved adhesion and exhibits resistance to hydrolysis & high temperature. Dianol® 3120 is used in... view more
Dianol® 320 HP by Arkema is a polyol, polyether diol containing secondary hydroxyl groups. Provides improved adhesion and resistance to hydrolysis and high temperature. It remains solid at room... view more
Dianol® 330 by Arkema is polyether diol containing secondary hydroxyl groups. Exhibits resistance to hydrolysis & high temperature. It provides improved adhesion. Dianol® 330 is used in automotive... view more
Asahi Kasei
DURANOL™ G3450J by Asahi Kasei is a liquid polycarbonatediol (PCD). Offers excellent moisture heat & hydrolysis resistance and excellent flexibility. Compatible with polyester polyols. Provides high... view more
Asahi Kasei
DURANOL™ G3452 by Asahi Kasei is a liquid polycarbonatediol (PCD). Compatible with polyester polyols. Shows high strength retention even after storage at a high temperature. Exhibits excellent... view more
Asahi Kasei
DURANOL™ G4672 by Asahi Kasei is a polycarbonatediol (PCD) available in liquid form. Compatible with polyester polyols. Shows high strength retention even after storage at a high temperature... view more
Asahi Kasei
DURANOL™ T4671 by Asahi Kasei is a liquid polycarbonatediol (PCD). Shows high strength retention even after storage at a high temperature. Compatible with polyester polyols. Provides excellent... view more
Asahi Kasei
DURANOL™ T4691 by Asahi Kasei is a polycarbonatediol (PCD) available in liquid form. Compatible with polyester polyols. Shows excellent moisture heat & hydrolysis resistance and excellent... view more
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