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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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4 products match your search
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Dicyandiamide latent curing agent. Used in one-component adhesives. Offers advantages such as fine particle size providing enhanced reactivity versus coarser grades and maximum dispersibility in... view more
Micronized grade of dicyandiamide. Used in one-component adhesives. Acts as a latent curing agent. Possesses advantages such as finest particle size and easily dispersed in liquid resins... view more
Dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. Can be used in electrical laminates, recreational and industrial pre-preg composites. Pulverized grade. Provides... view more
Dicyandiamide latent curing agent used for epoxy resins in one-component adhesives. Pulverized grade. Enhanced solubility in polar solvents (acetone, DMF). Provides clumping and dispersion into... view more
Nagase Water Soluble Epoxy Compounds
5th SpecialChem Annual Japan Conference - Digital Transformation in the Chemical Industry
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