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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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117 products match your search
Product Name
Supplier
Description
Cardolite® NX-5607 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
Chemtura (LANXESS)
Blocked isocyanate. Acts as a crosslinking agent and adhesion promoter. Provides wide pH latitude for formulators and compatibility with a range of aqueous auxiliaries, co-binders, pigments as well... view more
Chemtura (LANXESS)
Trixene Aqua BI 201 by Baxenden Chemical Chemtura is a blocked isocyanate. Acts as a crosslinking agent and adhesion promoter. It is an anionic particle based on patented HDI trimer/DMP compounds... view more
Chemtura (LANXESS)
Blocked isocyanate. Acts as a crosslinking agent and adhesion promoter. Provides wide pH latitude for formulators and compatibility with a range of aqueous auxiliaries, co-binders, pigments as well... view more
Chemtura (LANXESS)
Aromatic blocked TDI prepolymer type isocyanate. Acts as a crosslinking agent for hydroxyl-functional resins (polyester, urethane, acrylic etc). Its chemical structure offers a range of flexibility... view more
Chemtura (LANXESS)
Aromatic blocked TDI prepolymer type isocyanate. Acts as a crosslinking agent for hydroxyl-functional resins (polyester, urethane, acrylic etc). Its chemical structure offers a range of flexibility... view more
Carbodiimide. Acts as a crosslinking agent. Offers bond strength, broad substrate adhesion, performance improvement, heat resistance and ice water resistance. Used in glass, BOPP, metal (aluminum... view more
Non-MDA aromatic amine. Used in heat-cured adhesives. Acts as a curing agent. Possesses nonstaining properties. Offers benefits such as good handling characteristics, moderate exotherms, high... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Pulverized grade of dicyandiamide. Used as a curing agent in one-component adhesives. Offers benefits such as enhanced reactivity, improved product consistency and reduced clumping... view more
Hitech Industries
Reactive polyamide. Acts as a cuing agent. Exhibits low viscosity. Used in combination with liquid epoxy for cold curing/ambient temperature. Suitable for concrete adhesives. Recommended loading of... view more
Honeywell
OS® 1000 by Honeywell is a methyl oximino silane grade in the form of a clear, colorless combustible liquid. Acts as a crosslinking agent for silicone sealants and adhesives. It readily undergoes... view more
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