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The Universal Selection Source:
Adhesives Ingredients
by SpecialChem
 
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113 products match your search
Product Name
Supplier
Description
Bluestar Silicones
Silcolease® PC-195NXL by Bluestar Silicones is a biocompatible polyaddition silicone emulsion. Acts as a release modifier. Offers incremental levels release, good cures with low levels of... view more
Cardolite® NX-5607 by Cardolite is a phenalkamine that have favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free curing agent for epoxy adhesives and as a... view more
Cardolite® NX-5608 by Cardolite is a phenalkamine that have favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free curing agent for epoxy adhesives and as a... view more
Chemtura (LANXESS)
Blocked isocyanate. Acts as a crosslinking agent and adhesion promoter. Provides wide pH latitude for formulators and compatibility with a range of aqueous auxiliaries, co-binders, pigments as well... view more
Chemtura (LANXESS)
Trixene Aqua BI 201 by Baxenden Chemical Chemtura is a blocked isocyanate. Acts as a crosslinking agent and adhesion promoter. It is an anionic particle based on patented HDI trimer/DMP compounds... view more
Chemtura (LANXESS)
Blocked isocyanate. Acts as a crosslinking agent and adhesion promoter. Provides wide pH latitude for formulators and compatibility with a range of aqueous auxiliaries, co-binders, pigments as well... view more
Chemtura (LANXESS)
Aromatic blocked TDI prepolymer type isocyanate. Acts as a crosslinking agent for hydroxyl-functional resins (polyester, urethane, acrylic etc). Its chemical structure offers a range of flexibility... view more
Chemtura (LANXESS)
Aromatic blocked TDI prepolymer type isocyanate. Acts as a crosslinking agent for hydroxyl-functional resins (polyester, urethane, acrylic etc). Its chemical structure offers a range of flexibility... view more
B-Tough A1 by Croda acts as an epoxy functional toughening with low polarity. Offers excellent stability and impact strength to structural adhesives and sealants without impacting the hardness of... view more
B-Tough A2 by Croda acts as epoxy functional toughening agent. Exhibits medium polarity and offers excellent stability and impact strength. It enhances durability by absorbing microcracks caused by... view more
B-Tough A3 acts as a acts as epoxy functional toughening agent. Exhibits high polarity and offers excellent stability and impact strength in structural adhesives and sealants. It enhances durability... view more
Carbodiimide. Acts as a crosslinking agent. Offers bond strength, broad substrate adhesion, performance improvement, heat resistance and ice water resistance. Used in glass, BOPP, metal (aluminum... view more
DowDuPont (Dow)
Reinforcing composite. Used as an adhesion promoter in automotive applications like primed metal, oily galvanized and cold rolled steel. Possesses high temperature curing properties... view more
DowDuPont (Dow)
Reinforcing composite. Used as an adhesion promoter in automotive applications like primed metal, oily galvanized and cold rolled steel. Possesses high temperature curing properties... view more
DowDuPont (Dow)
Reinforcing composite. Used as an adhesion promoter in automotive applications like primed metal, oily galvanized and cold rolled steel. Possesses high temperature curing properties... view more
Non-MDA aromatic amine. Used in heat-cured adhesives. Acts as a curing agent. Possesses nonstaining properties. Offers benefits such as good handling characteristics, moderate exotherms, high... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Pulverized grade of dicyandiamide. Used as a curing agent in one-component adhesives. Offers benefits such as enhanced reactivity, improved product consistency and reduced clumping... view more
Improve your performance with water soluble epoxy compounds
Process oils for non-woven adhesives
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