Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

DYHARD® 100S by AlzChem is a latent hardener and dicyandiamide-based curing agent for thermosetting epoxy resin systems used in the adhesive industry. It possesses low shrinkage & toxicity and no... view more

DYHARD® 100SF by AlzChem is a latent hardener and dicyandiamide-based curing agent for thermosetting epoxy resin systems used in the adhesive industry. It offers extraordinary long latency and cost... view more

DYHARD® 100SH by AlzChem is a latent hardener and dicyandiamide-based curing agent for thermosetting epoxy resin systems used in the adhesive industry. It possesses low shrinkage & toxicity and no... view more

DYHARD® D50EP by AlzChem is a latent hardener & masterbatch of curing agents or accelerators for thermosetting epoxy resin systems used in the adhesive industry. It is excellently pre-dispersed... view more

DYHARD® DF50EP by AlzChem is a latent hardener & masterbatch of curing agents or accelerators for thermosetting epoxy resin systems used in the adhesive industry. It is excellently pre-dispersed... view more

Hyperbranched polyester amide. Acts as a crosslinking agent. It is a water-borne, nonionic and hydroxyl group-containing anti-splattering additive based on hybrane technology to enhance the transfer... view more

Atlas™ G-173X3/5 by Croda is a glycerol alkoxylate. It acts as a multi-functional cross-linker. This additive provides reduced skin irritancy and possibility to tune polarity. Atlas™ G-173X3/5 is... view more

Crosslinker® CX-300 by DSM is carbodiimide. Acts as a crosslinking agent. Offers bond strength, broad substrate adhesion, performance improvement, heat resistance and ice water resistance. Used in... view more

Silcolease® PC-195 NXL by Elkem Silicones is a biocompatible polyaddition silicone emulsion. Acts as a release modifier. Offers incremental levels release, good cures with low levels of extractable... view more

Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more

Amicure® CG-1200G by Evonik is a micronized grade of dicyandiamide. It contains 0.5% of an inert flow control additive to inhibit clumping and improve handling. It acts as a latent curing agent. Its... view more

AMICURE® CG-1400 by Evonik acts as a curing agent. It is a micronized grade of dicyandiamide containing 0.5% of an inert flow control additive to inhibit clumping and improve handling. It is... view more

AMICURE® CG-325 by Evonik is a pulverized grade of dicyandiamide. It offers benefits such as enhanced reactivity, improved product consistency and reduced clumping. AMICURE® CG-325 is used as a curing agent... view more

Amicure® CG-325G is a micronized grade of dicyandiamide. It acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. It contains 1.5% of an inert flow... view more