Dynasylan® SIVO 203 by Evonik is a multifunctional aminosilane compound. Acts as an adhesion promoter. Provides improved product performance and quality. It is soluble in alcohols, aliphatic and... view more

Dynasylan® 1122 by Evonik is a bis(3-triethoxysilylpropyl)amine grade. It is an adhesion promoter and a surface modifier. Provides good flexural strength, tensile strength, impact strength and... view more

Dynasylan® 1124 by Evonik is a bis(trimethoxysilylpropyl)amine grade with excellent crosslinking properties. Acts as an adhesion promoter and surface modifier. This grade provides improvement in... view more

Dynasylan® 1146 is a diaminofunctional silane by Evonik. Acts as an adhesion promoter. Exhibits very good wetting on substrates and forms weather- and moisture-resistant bonds to substrates with... view more

Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity... view more

Cardolite® NX-2026 is a high purity cardanol, bio-based diluent, resin modifier, and accelerator designed for use in adhesives and sealants. It is based on natural, renewable, non-food raw material... view more

Cardolite® Ultra LITE 513 is a low viscosity, mono-functional epoxy reactive diluent with Gardner color 1. The long hydrophobic aliphatic side chain of cardanol gives this product a very low... view more

Cardolite® LITE 3040 is a solvent free, low viscosity phenalkamide Epoxy curing agent. Exhibits excellent mechanical properties and excellent adhesion. Provides outstanding durability through... view more

Cardolite® NX-5594 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

Cardolite® GX-3090 is a solvent free and very low viscosity phenalkamide epoxy curing agent. Exhibits excellent mechanical properties, faster strength development, and good adhesion at recommended... view more

Dytek® BHMT-HP (Bis(hexamethylene)triamine) by Invista acts as an emulsifier, curing, flocculating and chelating agent. It is a solid aliphatic triamine that provides unique properties when used in... view more

Dytek® DCH-99 (1,2-Diaminocyclohexane) by Invista is a cyclic aliphatic diamine. It acts as an extender, corrosion inhibitor, catalyst, and chelating- and curing agent. It is compatible with... view more

Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more

Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more

Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more

Technicure® 54 by A&C Catalysts is a 2,4,6-tris(dimethylaminomethyl) phenol. Acts as a cure accelerator. It has low viscosity. It accelerates thin film set time and cure under damp and cold... view more

Technicure® DCMU by A&C Catalysts is a 3-(3,4-dichlorophenyl)-1,1-dimethylurea, is a substituted urea. Technicure® DCMU is a dicyandiamide (DICY) accelerator. Provides good formulation shelf... view more

Aminoethylaminopropyltrimethoxysilane. Acts as an adhesion promoter and coupling agent. Provides superior elongation, flexibility and spreading at the interface of polymers. Used to promote adhesion... view more

It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic... view more

It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary... view more

Benzophenone. Used as an ultraviolet light absorber in pressure sensitive adhesives. Possesses compatibility with epoxy or phenolic alkyds, polystyrene, unsaturated polyesters, polymethylacrylate... view more

Nonstaining and nondiscoloring octadecyl-3,5-di-t-butyl-4-hydroxyhydrocinnamate. Acts as an antioxidant. Offers low volatility and provides good long-term heat aging & high temperature processing... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more

Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low... view more