Cardolite® NX-2026 is a high purity cardanol, bio-based diluent, resin modifier, and accelerator designed for use in adhesives and sealants. It is based on natural, renewable, non-food raw material... view more

Cardolite® LITE 3040 is a solvent free, low viscosity phenalkamide epoxy curing agent by Cardolite. Exhibits excellent mechanical properties and excellent adhesion. Provides outstanding durability... view more

Cardolite® NX-5594 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more

Cardolite® GX-3090 is a solvent free and very low viscosity phenalkamide epoxy curing agent. Exhibits excellent mechanical properties, faster strength development, and good adhesion at recommended... view more

Cardolite® LITE 2001 is a solvent-free, light color phenalkamine epoxy curing agent with high bio-content. It is very similar in performance to Cardolite® NC-541, it has excellent rapid cure... view more

Dynasylan® SIVO 203 by Evonik is a multifunctional aminosilane compound. Acts as an adhesion promoter. Provides improved product performance and quality. It is soluble in alcohols, aliphatic and... view more

Dynasylan® 1122 by Evonik is a bis(3-triethoxysilylpropyl)amine grade. It is an adhesion promoter and a surface modifier. Provides good flexural strength, tensile strength, impact strength and... view more

Dynasylan® 1124 by Evonik is a bis(trimethoxysilylpropyl)amine grade with excellent crosslinking properties. Acts as an adhesion promoter and surface modifier. This grade provides improvement in... view more

Dynasylan® 1146 is a diaminofunctional silane by Evonik. Acts as an adhesion promoter. Exhibits very good wetting on substrates and forms weather- and moisture-resistant bonds to substrates with... view more

Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity... view more

Dytek® BHMT-HP (Bis(hexamethylene)triamine) by Invista acts as an emulsifier, curing, flocculating and chelating agent. It is a solid aliphatic triamine that provides unique properties when used in... view more

Dytek® DCH-99 (1,2-Diaminocyclohexane) by Invista is a cyclic aliphatic diamine. It acts as an extender, corrosion inhibitor, catalyst, and chelating- and curing agent. It is compatible with... view more

Pentaerythritol tetrakis. It acts as a curing agent. Improves curing speed, sensitivity and reactivity, which leads to a reduction in the amount of energy necessary for production and processing... view more

Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more

Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more

Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more

Technicure® 54 by A&C Catalysts is a 2,4,6-tris(dimethylaminomethyl) phenol. Acts as a cure accelerator. It has low viscosity. It accelerates thin film set time and cure under damp and cold... view more

Technicure® DCMU by A&C Catalysts is a 3-(3,4-dichlorophenyl)-1,1-dimethylurea, is a substituted urea. Technicure® DCMU is a dicyandiamide (DICY) accelerator. Provides good formulation shelf... view more

Andisil® 187 Silane by AB Specialty Silicones is epoxy functional silane used as a coupling agent for unsaturated polyester-fiberglass composites and for polysulfide/polyurethane caulks & sealants... view more

It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. The speed and specificity of this grade makes it relatively easy to incorporate dimer, trimer, and other polybasic... view more

It acts as a catalyst for anhydride-epoxy and carboxylic acid-epoxy resin systems. At elevated temperatures, it gives three to four times the rate of reaction of common promoters such as tertiary... view more

Low viscous modified aliphatic polyamine. Used as a very reactive epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives and putties... view more

Modified heterocyclic polyamine. Used as an epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives and putties... view more

Modified heterocyclic polyamine. Used as an epoxy hardener for the formulation of solvent-free epoxy systems in applications such as fast-curing adhesives and putties. Provides low cure temperatures... view more

Relatively low viscous, high reactivity, modified polyamine-adduct. Used as a fast curing epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives. Can be... view more

Low viscous, phenol-free Mannich-base. Used as an epoxy hardener for the formulation of solvent-free epoxy systems in applications such as adhesives. Provides chemical resistance and acceleration of... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more

Phenalkamine. Acts as an epoxy hardener. Used in solvent-free adhesives... view more