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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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6 products match your search
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Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Unpulverized grade of dicyandiamide. Used as a curing agent, in adhesives... view more
Dicyandiamide latent curing agent. Used in one-component adhesives. Offers advantages such as fine particle size providing enhanced reactivity versus coarser grades and maximum dispersibility in... view more
Micronized grade of dicyandiamide. Used in one-component adhesives. Acts as a latent curing agent. Possesses advantages such as finest particle size and easily dispersed in liquid resins... view more
Dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. Can be used in electrical laminates, recreational and industrial pre-preg composites. Pulverized grade. Provides... view more
Nagase Water Soluble Epoxy Compounds
Naphthenic oils for better adhesion
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