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Product Name
Supplier
Description
RIKACID HNA-100
New Japan Chemical
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are...
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Applications
Adhesives
Polymers>Epoxies (EP)
RIKACID MH
New Japan Chemical
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It...
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Applications
Adhesives
Polymers>Epoxies (EP)
RIKACID MH-700
New Japan Chemical
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It...
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Applications
Adhesives
Polymers>Epoxies (EP)
RIKACID MH-700G
New Japan Chemical
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is...
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Applications
Adhesives
Polymers>Epoxies (EP)
RIKARESIN BEO-60E
New Japan Chemical
Bisphenol A bis (triethylene glycol glycidylether) ether. It is pale yellow liquid. It improves toughness, flexibility, adhesiveness. It also improves heat cycle, thermal shock property, and shock...
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Applications
Adhesives
RIKARESIN BPO-20E
New Japan Chemical
Bisphenol A bis (propylene glycol glycidylether) ether. It is pale yellow liquid. It improves toughness, flexibility, adhesiveness. It also improves heat cycle, thermal shock property, and shock...
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Applications
Adhesives
RIKARESIN DME-100
New Japan Chemical
1,4-cyclohexane dimethanol diglycidylether. It has less viscosity and less Tg deterioration. It has excellent in weather resistance, mechanical characteristics and electric characteristics. It...
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Applications
Adhesives
Spotlight
High-performant HMA for Superior Packaging Solutions
Excellent Thermal Stability & Maximum Cohesion Properties with L-MODU™
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Want to Improve Your Polyamide Hot-melt Adhesive Formulation?
Check Out the Unique Properties of DYTEK® A Amine
Read More
Get PU Strength with Silicone Flexibility
Tech paper features 3 MS Polymer technologies
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New Low & Middle Molecular Weight SEBS by LCY in Action
For Adhesives & Sealants that Perform Even in Harsh Environments
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