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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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2 products match your search
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VESTAMELT® 171-P1 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more
VESTAMELT® 250-P1 by Evonik is a copolyamide hotmelt adhesive. It offers advantages such as high melting point and high melt viscosity, very good resistance to strike back and very good resistance... view more
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