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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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17 products match your search
Product Name
Supplier
Description
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Pulverized grade of dicyandiamide. Used as a curing agent in one-component adhesives. Offers benefits such as enhanced reactivity, improved product consistency and reduced clumping... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses high glass transition temperature and good one-pack shelf stability. Provides good flow properties and... view more
It acts as an accelerator for dicyandiamide cured epoxy resins. Provides longer pot life than standard substituted urea accelerators without increasing activation temperature. It cures rapidly above... view more
Substituted urea-based cure accelerator. Used in one-component paste and film adhesives. Offers advantages such as rapid cure and property development, high glass transition temperature and good... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses good flow properties. Offers benefits such as rapid cure and property development, high glass transition... view more
1-Phenyl-3, 3-dimethylurea. Acts as a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. Amicure® UR7/10 is supplied... view more
Modified polyamine. Used in one-component adhesives. Offers benefits such as long pot life, rapid cure above their temperature of activation and good adhesion... view more
Applications
Modified polyamine. Used in one-component adhesives. Acts as a latent curing agent. Offers benefits such as long pot life, rapid cure above their temperature of activation and good adhesion... view more
Applications
Modified aliphatic amine. Used in one-component conduction or induction heat-cure adhesives. Acts as a curing agent. Possesses very rapid reactivity above 158 °F, rapid green strength development... view more
Modified polyamine. Used in one-component convection or induction heat-cured adhesives. Acts as a latent curing agent. Possesses very good reactivity and improved green strength development. Offers... view more
Applications
Modified polyamine. Used in one-component convection or induction heat-cured adhesives. Acts as a latent curing agent. Possesses very good reactivity and very good green strength development... view more
Dicyandiamide latent curing agent used for epoxy resins in one-component adhesives. Pulverized grade. Enhanced solubility in polar solvents (acetone, DMF). Provides clumping and dispersion into... view more
Elevated-temperature curing agent. Used in adhesives. Possesses very good accelerator properties... view more
Imidazole curing agent. Used in adhesives. Possesses accelerator properties. Offers very rapid development of properties... view more
It acts as a high performance diamine curing agent. Versalink® 740M is an off-white powder with wide processing latitude. It has a melting range of 125 °C – 128 °C and should be processed at 140° C... view more
Nynas Naphthenic Process Oils
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