OK
The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
Save
Cette page a bien été ajoutée à vos favoris
65 products match your search
Product Name
Supplier
Description
DIC Corporation
EPICLON® 153 by DIC Corporation is an epoxy resin based on tetrabromobisphenol A grade. Acts as an excellent flame retardant. EPICLON® 153 is used in adhesive applications... view more
DIC Corporation
EPICLON® 1650-75MPX by DIC Corporation is a flexible epoxy resin. It can be diluted in xylene/ methoxypropanol solution. Exhibits improved impact resistance. EPICLON® 1650-75MPX is used in adhesive... view more
Applications
DIC Corporation
EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives... view more
DIC Corporation
EPICLON® 850 by DIC Corporation is a standard bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 850 by DIC Corporation include concrete adhesives... view more
DIC Corporation
EPICLON® 850-CRP by DIC Corporation is a distilled bisphenol A type (BPA) epoxy resin of high purity. Available in Asian countries. Applications of EPICLON® 850-CRP by DIC Corporation include... view more
DIC Corporation
EPICLON® 850-S by DIC Corporation is a bisphenol A type (BPA) epoxy resin containing low hydrolyzable chlorine. Available in Asian countries. Applications of EPICLON® 850-S by DIC Corporation... view more
DIC Corporation
EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications... view more
Applications
DIC Corporation
EPICLON® EXA-4816 by DIC Corporation is an epoxy resin with high purity. Exhibits excellent flexible toughness, high strength and elongation rate at normal temperatures. Offers tough physical... view more
Applications
DIC Corporation
EPICLON® EXA-4850-1000 by DIC Corporation is a high performance liquid epoxy resin with ductility and flexible toughness. It combines exceptionally good bonding properties and extremely small cure... view more
Applications
DIC Corporation
EPICLON® EXA-4850-150 by DIC Corporation is a high performance liquid epoxy resin with flexible toughness and ductility. It improves hard and brittle properties. It combines exceptionally good... view more
Applications
DIC Corporation
EPICLON® HP-4032D by DIC Corporation is a high performance naphthalene based epoxy resin. It is a distilled product. Designed for liquid encapsulant applications. EPICLON® HP-4032D offers ductility... view more
Applications
DIC Corporation
EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines... view more
DIC Corporation
EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines... view more
DIC Corporation
EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle... view more
DIC Corporation
EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard... view more
DIC Corporation
EPICLON® HP-7200 by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Exhibits ductility and flexible toughness. It combines exceptionally good bonding properties and... view more
DIC Corporation
EPICLON® HP-7200H by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Possesses ductility and flexible toughness. It combines exceptionally good bonding properties and... view more
DIC Corporation
EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON®... view more
DIC Corporation
EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and... view more
DIC Corporation
EPICLON® HP-7200L by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Designed for IC encapsulant applications. EPICLON® HP-7200L exhibits ductility and flexible toughness... view more
DIC Corporation
EPICLON® HP-820 by DIC Corporation is a high performance liquid epoxy resin with alkyl phenol. Designed for use in adhesive applications. Exhibits ductility and flexible toughness. EPICLON® HP-820... view more
Applications
DIC Corporation
EPICLON® TSR-601 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-601 by DIC Corporation sed in elastomeric... view more
DIC Corporation
EPICLON® TSR-960 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-960 by DIC Corporation is used in elastomeric... view more
DIC Corporation
Alkyl phenol mono glycidyl ether. Acts as a reactive diluent. It is a 100% reactive system. Exhibits super low viscosity and also achieves very low viscosity when mixed with liquid epoxy resins... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin containing low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete... view more
DIC Corporation
Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include concrete adhesives... view more
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications... view more
DIC Corporation
Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Epoxy phenol novolac. It is a multi-functional resin produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance. Used in... view more
Applications
DIC Corporation
LUCKAMIDE 17-202 by DIC Corporation is a solvent solution of polyamide amine grade with drying characteristics. Acts as a curing agent for epoxy resin. LUCKAMIDE 17-202 is diluted with xylene and... view more
DIC Corporation
LUCKAMIDE EA-330 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE EA-330 is used... view more
DIC Corporation
LUCKAMIDE F4 by DIC Corporation is a general purpose, mannich-type modified aliphatic polyamine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE F4 is... view more
DIC Corporation
LUCKAMIDE TD-960 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE TD-960 is... view more
DIC Corporation
LUCKAMIDE TD-961 by DIC Corporation is a solvent solution of polyamide adduct. Acts as a curing agent. Exhibits chemical resistance with drying characteristics. Shows compatibility with room... view more
DIC Corporation
LUCKAMIDE TD-977 by DIC Corporation is a solvent solution of polyamide amine adduct grade with drying characteristics. Acts as a curing agent. Shows compatibility with room temperature epoxy resin... view more
DIC Corporation
LUCKAMIDE TD-982 by DIC Corporation is a solvent-free, polyamide amine grade. Acts as a curing agent for room temperature epoxy resin. It is useable for long period of time. TD-982 is used as an... view more
DIC Corporation
LUCKAMIDE TD-984 by DIC Corporation is a solvent-less, polyamide amine grade. Acts as a curing agent. It is useable for long period of time. Shows compatibility with room temperature epoxy resin... view more
DIC Corporation
LUCKAMIDE TD-992 by DIC Corporation is a solvent solution of polyamine adduct with drying characteristics. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE TD-992 is diluted with... view more
DIC Corporation
LUCKAMIDE WH-614 by DIC Corporation is a mannich-type modified aliphatic polyamine grade with bonding properties. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE WH-614 is used as... view more
DIC Corporation
LUCKAMIDE WH-650 by DIC Corporation is a high strength, modified aliphatic polyamine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE WH-650 is... view more
DIC Corporation
LUCKAMIDE WN-405 by DIC Corporation is a mannich-type modified aliphatic polyamine grade. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-405 exhibits acid resistance... view more
DIC Corporation
LUCKAMIDE WN-620 by DIC Corporation is a modified aliphatic polyamine grade with high strength. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-620 is used as an... view more
DIC Corporation
PHENOLITE LA-1356 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Provides high heat-, moisture- and chemical resistance. It can be diluted in methyl ethyl... view more
DIC Corporation
PHENOLITE LA-3018-50P by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Offers high heat-, moisture- and chemical resistance. It can be diluted in PGM solution... view more
DIC Corporation
PHENOLITE LA-7052 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. It can be diluted in methyl ethyl ketone. Offers high heat-, moisture- and chemical... view more
DIC Corporation
PHENOLITE LA-7054 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Possesses high heat-, moisture- and chemical resistance. Shows compatibility with epoxy... view more
DIC Corporation
PHENOLITE LA-7751 by DIC Corporation is an ATN-type novolac phenol resin which exhibits high cross-linking density. Offers high heat-, moisture- and chemical resistance. Shows compatibility with... view more
DIC Corporation
PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and... view more
DIC Corporation
PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and... view more
DIC Corporation
PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more
DIC Corporation
PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more
DIC Corporation
PHENOLITE TD-2131 by DIC Corporation is a phenolic novolac resin. Exhibits high cross-linking density and softening point at 78-82°C. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more
DIC Corporation
PHENOLITE VH-4150 by DIC Corporation is a bisphenol A novolac resin designed for encapsulants. Exhibits softening point at 85-89°C and high cross-linking density. Shows high heat-, moisture- and... view more
DIC Corporation
PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance... view more
DIC Corporation
UNIDIC V-8000 by DIC Corporation is a solvent-soluble amide-imide resin which contain rigid imide structures and terminal carboxyl groups. Acts as a hardening agent for epoxy resins. Provides high... view more
DIC Corporation
UNIDIC V-8002 by DIC Corporation is a solvent-soluble amide-imide resin. Acts as a hardening agent. It contains rigid imide structures and terminal carboxyl groups. Designed for heat-resistant... view more
DIC Corporation
UNIDIC V-8005 by DIC Corporation is a solvent-soluble amide-imide resin, containing terminal carboxyl groups and rigid imide structures . Acts as a hardening agent. Provides high mechanical... view more
Nagase Water Soluble Epoxy Compounds
Back to Top