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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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171 products match your search
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Description
Dynasylan® 1122 by Evonik is a Bis(3-triethoxysilylpropyl)amine. Acts as an adhesion promoter and as a surface modifier. Provides good flexural strength, tensile strength, impact strength and... view more
Dynasylan® 1124 by Evonik is a Bis(trimethoxysilylpropyl)amine. Acts as an adhesion promoter and surface modifier. This grade provides improvement in flexural strength, tensile strength, impact... view more
Dynasylan® 1411 by Evonik is a N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane. This grade acts as an adhesion promoter, surface modifier and as a reactant for product modification. Offers... view more
Dynasylan® 1505 by Evonik is a 3-Aminopropylmethyldiethoxysilane. Acts as an adhesion promoter between inorganic materials like glass, metals and fillers and organic polymers and as a surface... view more
Dynasylan® 1506 by Evonik is 3-Aminopropylmethyldiethoxysilane. Acts as an adhesion promoter, surface modifier and as a reactant for product modification. Provides improved mechanical properties... view more
Applications
Dynasylan® A by Evonik is a tetraethyl orthosilicate. Used as a crosslinker in silicone rubber systems and as drying agent in sealing compositions. Provides improved chemical and thermal stability... view more
Dynasylan® AMEO by Evonik is 3-Aminopropyltriethoxysilane. Acts as an adhesion promoter, crosslinker, and/or surface modifier. Provides improved mechanical properties, for example flexural strength... view more
Dynasylan® GLYEO by Evonik is 3-Glycidyloxypropyltriethoxysilane. Acts as an adhesion promoter, crosslinking agent and/or surface modifier. Provides improved mechanical properties, such as flexural... view more
Dynasylan® GLYMO by Evonik is 3-Glycidyloxypropyltrimethoxysilane. Acts as an adhesion promoter, crosslinking agent and/or surface modifier. Provides improved mechanical properties, such as flexural... view more
Dynasylan® MEMO by Evonik is 3-Methacryloxypropyltrimethoxysilane. Acts as an adhesion promoter, surface modifier, co-monomer for polymer synthesis and crosslinker. Provides optimum dispersion of... view more
Dynasylan® MTES by Evonik is methyltriethoxysilane. Acts as a cross-linking agent. It is an alkyltrialkoxysilane is an important component in solgel systems. It is regarded as trifunctional since... view more
Dynasylan® MTMO by Evonik is 3-Mercaptopropyltrimethoxysilane. Acts as an adhesion promoter, crosslinking agent, surface modifier or reactive reagent. Provides improved mechanical properties like... view more
Dynasylan® MTMS by Evonik is methyltrimethoxysilane. Acts as a crosslinker. It is a colorless, low-viscosity liquid. It is regarded as trifunctional since all three alkoxy groups are able to... view more
Dynasylan® VTEO by Evonik is vinyltriethoxysilane. Acts as a crosslinking agent, adhesion promoter and/or surface modifier. Possesses moisture scavenging properties. Offers benefits such as improved... view more
Dynasylan® VTMO by Evonik is vinyltrimethoxysilane. Acts as a crosslinking agent, adhesion promoter, surface modifier and moisture scavenger. Provides improvement in tear- and crack resistance... view more
TEGOPAC® RD 1 by Evonik is a silane-modified polymer. Acts as a cross-linker which releases ethanol during the curing process. It can be used to decrease viscosity of adhesives & sealant... view more
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TEGOPAC® RD 2 by Evonik is a silane-modified polymer. Acts as a cross-linker which releases ethanol during the curing process. Helps address polymer structures with a high cross-linking density: in... view more
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1,7-Octadiene. It acts as a cross-linker for polyolefins (PE and PP) and as well as for a number of other polymers. Complies with REACH... view more
5-Hexen-1-ol. It acts as a cross-linker and modifier. Process steps include polymerization and it exhibits coloring. Pre-registered with REACH... view more
AMICURE® UR10/30 by Evonik is a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It acts as a curing agent. It provides rapid curing, high glass transition temperature, good... view more
ANCAMIDE® 2767 by Evonik is a high performance and modified polyamide curing agent. It is designed for use with epoxy resins. It provides fast drying time, high solvent resistance, good corrosion... view more
ANCAMIDE® 2781 by Evonik is a versatile hardener designed to cure epoxy resin at elevated temperatures. It provides longer working time, low exotherm and low viscosity. ANCAMIDE® 2781 is recommended... view more
ANCAMIDE® 3011 by Evonik is a high viscosity polyamide. It acts as a curing agent for solid epoxy resins. It offers high performance corrosion resistance, good flexibility and long pot life... view more
ANCAMIDE® 3015 by Evonik is a high viscosity polyamide solution in xylene. It acts as a curing agent for solid epoxy resins. It provides good flexibility, high performance corrosion resistance and... view more
ANCAMIDE® 3021 by Evonik is a medium viscosity polyamide. It is recommended for use with liquid epoxy resin. It acts as a curing agent. It offers good adhesion to cementitious substrates. ANCAMIDE®... view more
ANCAMIDE® 3029 by Evonik is a polyamide. It acts as a curing agent. It offers low viscosity, moderate pot life and good adhesion to concrete. ANCAMIDE® 3029 is recommended for reactive adhesives and... view more
ANCAMIDE® 3030 by Evonik is a reactive polyaminoamide developed for use in liquid epoxy resins. It offers low viscosity, moderate pot life and good adhesion. It acts as a curing agent. ANCAMIDE®... view more
ANCAMIDE® 3031 by Evonik is a medium viscosity polyamide. It acts as a curing agent. It offers long pot life and good adhesion to substrates. ANCAMIDE® 3031 is recommended for reactive adhesives and... view more
ANCAMIDE® 3032 by Evonik is a low viscosity polyaminoamide. It acts as a curing agent. It offers moderate pot life and good adhesion to concrete. ANCAMIDE® 3032 is suitable for reactive adhesives... view more
ANCAMIDE® 3034 by Evonik is a moderate viscosity aminoamide. It acts as a curing agent. It provides moderate pot life and good adhesion to substrates. ANCAMIDE® 3034 is suitable for reactive... view more
ANCAMIDE® 3398 by Evonik is a polyaminoamide adduct at 60% solids. It offers excellent corrosion resistance and fast drying. It acts as a curing agent. ANCAMIDE® 3398 is designed for adhesives. Its... view more
Applications
ANCAMIDE® 3529 by Evonik is a low viscosity amidoamine hardener. It is recommended for high temperature applications such as sealants, epoxy mortars and reactive adhesives. It offers very long pot... view more
ANCAMIDE® 801 by Evonik is a plasticizer & benzyl alcohol-free, high performance polyamide curing agent. It provides low viscosity, rapid dry times, excellent corrosion resistance, high gloss films... view more
ANCAMIDE® 903MAV by Evonik is an amidoamine curing agent. It is designed for use with liquid epoxy resin. It provides low viscosity, long pot life and pigment acceptance for high build intumescent... view more
Non-MDA aromatic amine. Used in heat-cured adhesives. Acts as a curing agent. Possesses nonstaining properties. Offers benefits such as good handling characteristics, moderate exotherms, high... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Pulverized grade of dicyandiamide. Used as a curing agent in one-component adhesives. Offers benefits such as enhanced reactivity, improved product consistency and reduced clumping... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Unpulverized grade of dicyandiamide. Used as a curing agent, in adhesives... view more
Unmodified cycloaliphatic amine. Used in adhesives. Acts as a curing agent. Possesses low viscosity and very good mechanical properties following elevated temperature cure. Offers good resistance... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses high glass transition temperature and good one-pack shelf stability. Provides good flow properties and... view more
It acts as an accelerator for dicyandiamide cured epoxy resins. Provides longer pot life than standard substituted urea accelerators without increasing activation temperature. It cures rapidly above... view more
Substituted urea-based cure accelerator. Used in one-component paste and film adhesives. Offers advantages such as rapid cure and property development, high glass transition temperature and good... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses good flow properties. Offers benefits such as rapid cure and property development, high glass transition... view more
1-Phenyl-3, 3-dimethylurea. Acts as a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. Amicure® UR7/10 is supplied... view more
Dimethylaminomethylphenol. Acts as a curing agent, catalyst for epoxy/polysulfide cures and an accelerator for polyamide or amidoamine curing agents. The blends of Ancamide® 1110 and Ancamide® K54... view more
High-performance modified polyamide curing agent optimized for use with liquid epoxy resins in two-component structural adhesives. Can be used in two-component epoxy adhesives for metal or plastic... view more
It is a high performance modified polyamide. Acts as a curing agent. Exhibits zero induction time at ambient temperature, excellent development of hardness, moderate viscosity and fast dry time... view more
Applications
Modified amidoamine. Used in concrete primers and adhesives. Acts as a curing agent. Possesses very good chemical resistance and very good adhesion to cold, damp concrete. Offers benefits such as... view more
High-performance modified polyamide. Used in two-component epoxy adhesives for metal or plastic bonding and two-component structural adhesives. Acts as a curing agent. Offers benefits such as rapid... view more
Modified polyamide. Used in two-component ambient temperature or heat-cured epoxy adhesives for metal, plastic or wood bonding. Acts as a curing agent. Possesses features including low viscosity... view more
Reactive polyamide. Used in adhesives and sealants. Acts as a curing agent. Possesses good chemical resistance. Offers compatibility with a wide range of solvents... view more
Reactive polyamide. Acts as an epoxy curing agent. It provides excellent adhesion to a variety of substrates. Ancamide® 261A is readily compatible with a wide range of solvents. Has high viscosity... view more
It is a low viscosity polyaminoamide adduct supplied at 90% solids in ethanol. Acts as a curing agent. Offers good cure under high humidity. Used for concrete adhesives where good adhesion to damp... view more
Amidoamine. Acts as a low viscosity curing agent designed for use with liquid epoxy resin. Offers low viscosity, long pot life and high temperature performance. Its recommended usage level with... view more
Reactive polyamide. Used in adhesives and sealants. Acts as a curing agent. Possesses low viscosity and higher imidazoline content. Offers long pot life with liquid resins... view more
Reactive polyamide. Used in structural adhesives and sealers for concrete. Acts as a curing agent. Possesses good corrosion resistance and good color and light stability. Shows compatibility with... view more
It is an accelerated amidoamine. Acts as a curing agent for liquid epoxy resins. Offers faster cure speed and improved chemical resistance than unmodified amidoamines. Exhibits low viscosity and... view more
Amidoamine. Used in adhesives. Acts as a curing agent. Offers benefits such as low viscosity, DOT noncorrosive and relatively long pot life... view more
Aliphatic amidoamine. Acts as a curing agent at room temperature. It is designed to be used with liquid epoxy resin. Ancamide® 503 is moisture tolerant and offers low viscosity, long pot life as... view more
Amidoamine. Used in adhesives. Acts as a curing agent. Offers benefits such as low viscosity, very long pot life and low exotherm... view more
It is a polyfunctional fatty amidoamine. Acts as a curing agent for liquid epoxy resins. It can be used alone or in the mixture with polyamides and other amidoamines. Offers rapid cure rate, good... view more
Curing agent. Used in general-purpose, two-component adhesives. Possesses very good flexibility and peel strength, very good thermal shock resistance and good electrical properties. Offers... view more
N-(2-hydroxy ethyl) diethylene triamine. Acts an ambient or elevated temperature curing agent. It is a two-component (2K) epoxy adhesive in which the term two-component indicates that the curing... view more
Liquid eutectic mixture of aromatic amines. Used in adhesives. Acts as a curing agent. Offers benefits such as long pot life and can be mixed at room temperature. Possesses very good chemical and... view more
Aliphatic amine adduct. Used in adhesives. Acts as a curing agent. Offers advantages such as rigidity, high physical strength and fast cure speed... view more
Light-colored aliphatic amine adduct. Used in adhesives. Acts as a curing agent. Possesses good solvent and alcohol resistance and good mechanical properties. Offers benefits such as good hot water... view more
Modified cycloaliphatic amine. Used in adhesives. Acts as a curing agent. Possesses very low color and good color stability, good chemical resistance and high gloss. Offers benefits such as good... view more
Mannich-Base. Used in adhesives. Acts as a curing agent. Possesses rapid cure speed and DOT noncorrosive properties. Offers benefits such as cures well even under high humidity and low temperatures... view more
Modified aliphatic amine. Used in structural and general-purpose adhesives. Acts as a curing agent. Possesses features including low viscosity, high reactivity and fast set time and low loading... view more
Modified aliphatic amine. Used in fast-setting adhesives. Acts as a curing agent. Offers benefits such as fast cure at ambient and low temperatures and low viscosity... view more
Hydroxyalkylated polyamine. Used in adhesives. Acts as a curing agent. Possesses good mechanical and very good electrical properties and low shrinkage and vapor pressure. Offers benefits such as... view more
Low-viscosity modified aliphatic amine. Used in adhesives. Acts as a curing agent. Offers benefits such as very good color, moisture insensitivity, long pot life, good impact resistance and good... view more
Unmodified aliphatic amine. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical and other high-performance applications. Acts as a curing agent. Possesses very... view more
Modified polyamine. Used in one-component adhesives. Offers benefits such as long pot life, rapid cure above their temperature of activation and good adhesion... view more
Applications
Modified polyamine. Used in one-component adhesives. Acts as a latent curing agent. Offers benefits such as long pot life, rapid cure above their temperature of activation and good adhesion... view more
Applications
Unmodified cycloaliphatic amine. Used in adhesives. Acts as a curing agent. Possesses mechanical properties, high glass transition temperature and good chemical resistance to inorganic acids... view more
Low-viscosity curing agent. Used in adhesives. Offers benefits such as higher tensile strength, improved toughness and improved elongation... view more
Accelerated modified aliphatic amine. Used in adhesives. Acts as a curing agent. Offers benefits such as very rapid cure and property development, fast low-temperature cure and phenol-free... view more
Unmodified cycloaliphatic amine. Used in adhesives. Acts as an epoxy curing agent with both cycloaliphatic and aromatic character. Possesses higher glass transition temperature and good toughness... view more
Modified aliphatic amine. Used in one-component conduction or induction heat-cure adhesives. Acts as a curing agent. Possesses very rapid reactivity above 158 °F, rapid green strength development... view more
Low viscosity modified amine. Used in joint sealants for civil engineering applications. Acts as a curing agent. Provides adavantages such as high tear resistance, tensile strength and elongation... view more
Modified polyamine. Used in one-component convection or induction heat-cured adhesives. Acts as a latent curing agent. Possesses very good reactivity and improved green strength development. Offers... view more
Applications
Modified polyamine. Used in one-component convection or induction heat-cured adhesives. Acts as a latent curing agent. Possesses very good reactivity and very good green strength development... view more
Cycloaliphatic amine. Acts as a curing agent. Offers low viscosity and a high glass transition temperature within liquid epoxy resin systems. Also Offers good thermal resistance. Its recommended... view more
It acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. Offers rapid cure at elevated temperatures, low viscosity and excellent adhesion... view more
Aliphatic polyamine adduct. Acts as a curing agent. It is free from phenol, nonyl phenol and bisphenol A. Ancamine® 3456 is designed to be used with liquid epoxy resin at ambient temperature. Offers... view more
Modified aromatic amine. Used in adhesives. Acts as a curing agent. Possesses good high-temperature properties. Offers advantages such as low viscosity and low pull forces in pultrusion processing... view more
Modified aromatic amine. Used in adhesives. Acts as a curing agent. Possesses low viscosity and long working life. Offers benefits such as adjustable cure time and high elongation... view more
Liquid mixture of aromatic amines based on methylenedianiline(MDA). Used in adhesives. Acts as a curing agent. Offers advantages such as very good resistance to water, acid, alkalies and hydrocarbon... view more
Tertiary amine. Used in sealant and concrete adhesives applications. Acts as a curing agent as an activator... view more
Triethylenetetramine. Acts as a curing agent. In comparison to Ancamine® DETA, it is less hygroscopic, has lower vapor pressure and does not carbamate as readily. Its recommended usage level... view more
Applications
Aromatic amine. Used in adhesives. Acts as a curing agent. Possesses very good physical properties and high heat deflection temperature. Offers benefits such as good pot life and good chemical... view more
Blend of aromatic amines. Used in adhesives. Acts as a curing agent. Offers benefits such as very good chemical resistance, good pot life and high heat resistance... view more
CUREZOL® 2E4MZ is an imidazole by Evonik. It acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. CUREZOL® 2E4MZ is recommended for... view more
CUREZOL® 2MZ Azine is an imidazole by Evonik. It acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives... view more
CUREZOL® 2P4MZ is an imidazole by Evonik. It acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3... view more
CUREZOL® C17Z is an imidazole by Evonik. It acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures... view more
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