OK
The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
Save
Cette page a bien été ajoutée à vos favoris
78 products match your search
Product Name
Supplier
Description
Non-MDA aromatic amine. Used in heat-cured adhesives. Acts as a curing agent. Possesses nonstaining properties. Offers benefits such as good handling characteristics, moderate exotherms, high... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Dicyandiamide micronized Curing agent. (Contains 0.5% of an inert flow control additive to inhibit clumping and improve handling). Can be used as a latent curing agent for epoxy resins in... view more
Pulverized grade of dicyandiamide. Used as a curing agent in one-component adhesives. Offers benefits such as enhanced reactivity, improved product consistency and reduced clumping... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Unpulverized grade of dicyandiamide. Used as a curing agent, in adhesives... view more
Unmodified cycloaliphatic amine. Used in adhesives. Acts as a curing agent. Possesses low viscosity and very good mechanical properties following elevated temperature cure. Offers good resistance... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses high glass transition temperature and good one-pack shelf stability. Provides good flow properties and... view more
It acts as an accelerator for dicyandiamide cured epoxy resins. Provides longer pot life than standard substituted urea accelerators without increasing activation temperature. It cures rapidly above... view more
Substituted urea-based cure accelerator. Used in one-component paste and film adhesives. Offers advantages such as rapid cure and property development, high glass transition temperature and good... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses good flow properties. Offers benefits such as rapid cure and property development, high glass transition... view more
1-Phenyl-3, 3-dimethylurea. Acts as a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. Amicure® UR7/10 is supplied... view more
Dimethylaminomethylphenol. Acts as a curing agent, catalyst for epoxy/polysulfide cures and an accelerator for polyamide or amidoamine curing agents. The blends of Ancamide® 1110 and Ancamide® K54... view more
High-performance modified polyamide curing agent optimized for use with liquid epoxy resins in two-component structural adhesives. Can be used in two-component epoxy adhesives for metal or plastic... view more
It is a high performance modified polyamide. Acts as a curing agent. Exhibits zero induction time at ambient temperature, excellent development of hardness, moderate viscosity and fast dry time... view more
Applications
Modified amidoamine. Used in concrete primers and adhesives. Acts as a curing agent. Possesses very good chemical resistance and very good adhesion to cold, damp concrete. Offers benefits such as... view more
High-performance modified polyamide. Used in two-component epoxy adhesives for metal or plastic bonding and two-component structural adhesives. Acts as a curing agent. Offers benefits such as rapid... view more
Modified polyamide. Used in two-component ambient temperature or heat-cured epoxy adhesives for metal, plastic or wood bonding. Acts as a curing agent. Possesses features including low viscosity... view more
Reactive polyamide. Used in adhesives and sealants. Acts as a curing agent. Possesses good chemical resistance. Offers compatibility with a wide range of solvents... view more
Reactive polyamide. Acts as an epoxy curing agent. It provides excellent adhesion to a variety of substrates. Ancamide® 261A is readily compatible with a wide range of solvents. Has high viscosity... view more
It is a low viscosity polyaminoamide adduct supplied at 90% solids in ethanol. Acts as a curing agent. Offers good cure under high humidity. Used for concrete adhesives where good adhesion to damp... view more
Amidoamine. Acts as a low viscosity curing agent designed for use with liquid epoxy resin. Offers low viscosity, long pot life and high temperature performance. Its recommended usage level with... view more
Reactive polyamide. Used in adhesives and sealants. Acts as a curing agent. Possesses low viscosity and higher imidazoline content. Offers long pot life with liquid resins... view more
Reactive polyamide. Used in structural adhesives and sealers for concrete. Acts as a curing agent. Possesses good corrosion resistance and good color and light stability. Shows compatibility with... view more
It is an accelerated amidoamine. Acts as a curing agent for liquid epoxy resins. Offers faster cure speed and improved chemical resistance than unmodified amidoamines. Exhibits low viscosity and... view more
Amidoamine. Used in adhesives. Acts as a curing agent. Offers benefits such as low viscosity, DOT noncorrosive and relatively long pot life... view more
Aliphatic amidoamine. Acts as a curing agent at room temperature. It is designed to be used with liquid epoxy resin. Ancamide® 503 is moisture tolerant and offers low viscosity, long pot life as... view more
Amidoamine. Used in adhesives. Acts as a curing agent. Offers benefits such as low viscosity, very long pot life and low exotherm... view more
It is a polyfunctional fatty amidoamine. Acts as a curing agent for liquid epoxy resins. It can be used alone or in the mixture with polyamides and other amidoamines. Offers rapid cure rate, good... view more
Curing agent. Used in general-purpose, two-component adhesives. Possesses very good flexibility and peel strength, very good thermal shock resistance and good electrical properties. Offers... view more
N-(2-hydroxy ethyl) diethylene triamine. Acts an ambient or elevated temperature curing agent. It is a two-component (2K) epoxy adhesive in which the term two-component indicates that the curing... view more
Liquid eutectic mixture of aromatic amines. Used in adhesives. Acts as a curing agent. Offers benefits such as long pot life and can be mixed at room temperature. Possesses very good chemical and... view more
Aliphatic amine adduct. Used in adhesives. Acts as a curing agent. Offers advantages such as rigidity, high physical strength and fast cure speed... view more
Ancamine® 1608 by Evonik is a light-colored aliphatic amine adduct curing agent designed for epoxy resins. Possesses good solvent-, hot water- and alcohol resistance. Offers fast cure speed and good... view more
Ancamine® 1618 by Evonik is a modified cycloaliphatic amine based curing agent. Designed for ambient or low temperature liquid epoxy resins. Used in adhesives. Possesses very low color, good color... view more
Mannich-Base. Used in adhesives. Acts as a curing agent. Possesses rapid cure speed and DOT noncorrosive properties. Offers benefits such as cures well even under high humidity and low temperatures... view more
Ancamine® 1638 by Evonik is a modified aliphatic amine. Used in structural and general-purpose adhesives. Acts as a curing agent. Possesses features including low viscosity, high reactivity and fast... view more
Ancamine® 1768 by Evonik is a modified aliphatic amine based curing agent with low viscosity. Used in fast-setting adhesives. Offers fast cure at ambient and low temperatures. Ancamine® 1768 has a... view more
Ancamine® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. Used in adhesives. Possesses good mechanical- and electrical properties. Provides low shrinkage and vapor pressure... view more
Ancamine® 1784 by Evonik is a room temperature, lowviscosity modified aliphatic amine hardener for epoxy resins. It is a curing agent. Exhibits excellent color, moisture insensitivity, long pot... view more
Ancamine® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent for epoxy resins. It is based on unmodified aliphatic amine grade. Used in ambient and heat-cured... view more
Ancamine® 2014AS is a modified polyamine by Evonik. Used in one-component adhesives. Offers long pot life, rapid cure above their temperature of activation and good adhesion. Ancamine® 2014AS has a... view more
Applications
Ancamine® 2014FG by Evonik is a modified polyamine. Used in one-component adhesives. Acts as a latent curing agent. Offers benefits such as long pot life, rapid cure above their temperature of... view more
Applications
Ancamine® 2049 by Evonik is a curing agent based on unmodified cycloaliphatic amine for epoxy resins. Used in adhesives. Possesses high gloss, mechanical properties, high glass transition... view more
Ancamine® 2167 by Evonik is a low-viscosity curing agent. Used in adhesives. Offers benefits such as higher tensile strength and improved elongation. It has an increased fracture toughness and... view more
Ancamine® 2205 by Evonik is a phenol-free, accelerated modified aliphatic amine based curing agent. Used in adhesives. Offers very rapid low-temperature cure and property development. Shelf life of... view more
Ancamine® 2264 by Evonik is an unmodified cycloaliphatic amine base curing agent. Provides increased chemical resistance and faster cure. Used in adhesives. Possesses higher glass transition... view more
Modified aliphatic amine. Used in one-component conduction or induction heat-cure adhesives. Acts as a curing agent. Possesses very rapid reactivity above 158 °F, rapid green strength development... view more
Ancamine® 2390 is a low viscosity modified amine by Evonik. Used in joint sealants for civil engineering applications. Acts as a curing agent. Provides high tear resistance, tensile strength and... view more
Ancamine® 2441 by Evonik is a modified polyamine based latent curing agent. Used in one-component convection or induction heat-cured adhesives. Possesses excellent reactivity and improved green... view more
Applications
Modified polyamine. Used in one-component convection or induction heat-cured adhesives. Acts as a latent curing agent. Possesses very good reactivity and very good green strength development... view more
Cycloaliphatic amine. Acts as a curing agent. Offers low viscosity and a high glass transition temperature within liquid epoxy resin systems. Also Offers good thermal resistance. Its recommended... view more
It acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. Offers rapid cure at elevated temperatures, low viscosity and excellent adhesion... view more
Aliphatic polyamine adduct. Acts as a curing agent. It is free from phenol, nonyl phenol and bisphenol A. Ancamine® 3456 is designed to be used with liquid epoxy resin at ambient temperature. Offers... view more
Modified aromatic amine. Used in adhesives. Acts as a curing agent. Possesses good high-temperature properties. Offers advantages such as low viscosity and low pull forces in pultrusion processing... view more
Modified aromatic amine. Used in adhesives. Acts as a curing agent. Possesses low viscosity and long working life. Offers benefits such as adjustable cure time and high elongation... view more
Ancamine® DL50 by Evonik is a liquid mixture of aromatic amines based on methylenedianiline(MDA). It is a curing agent. Used in adhesives. Offers advantages such as very good resistance to water... view more
Ancamine® K54 is a tertiary amine by Evonik. Designed for sealant and concrete adhesives applications. Used as a curing agent as an activator. Ancamine® K54 has a shelf life of 24 months... view more
Ancamine® TETA by Evonik is a triethylenetetramine based curing agent. In comparison to Ancamine® DETA, it is less hygroscopic, has lower vapor pressure and does not carbamate as readily. Its... view more
Applications
Aromatic amine. Used in adhesives. Acts as a curing agent. Possesses very good physical properties and high heat deflection temperature. Offers benefits such as good pot life and good chemical... view more
Ancamine® Z by Evonik is a blend of aromatic amines. It is a curing agent. Used in adhesives. Offers very good chemical- and high heat resistance. Provides low viscosity and good pot life. Ancamine®... view more
Dicyandiamide latent curing agent. Used in one-component adhesives. Offers advantages such as fine particle size providing enhanced reactivity versus coarser grades and maximum dispersibility in... view more
Micronized grade of dicyandiamide. Used in one-component adhesives. Acts as a latent curing agent. Possesses advantages such as finest particle size and easily dispersed in liquid resins... view more
Dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. Can be used in electrical laminates, recreational and industrial pre-preg composites. Pulverized grade. Provides... view more
Dicyandiamide latent curing agent used for epoxy resins in one-component adhesives. Pulverized grade. Enhanced solubility in polar solvents (acetone, DMF). Provides clumping and dispersion into... view more
Aliphatic glycidyl ether. Used in two component adhesives. Acts as a curing agent and a reactive diluent. Possesses advantages like low vapor pressure and low toxicity, improved flexibility and... view more
Neopentyl glycol diglycidyl ether, curing agent. Provides maximum viscosity reduction and good maintenance properties. Used in adhesives... view more
1,4-butanediol diglycidyl ether, curing agent. Provides maximum viscosity reduction with physical and performance properties. Used in adhesives... view more
Evonik
Aromatic hydrocarbon. Used in adhesives. Acts as an additive and extender. Possesses advantages such as good chemical resistance, low toxicity and low volatility. Offers benefits such as low... view more
Elevated-temperature curing agent. Used in adhesives. Possesses accelerator properties. Offers compatibility with liquid resin... view more
Elevated-temperature curing agent. Used in adhesives. Possesses very good accelerator properties... view more
2-ethyl-4-methyl Imidazole. Used in adhesives for wood, metal and glass. Acts as a curing agent and a cure accelerator... view more
Imidazole curing agent. Used in adhesives. Possesses accelerator properties. Offers very rapid development of properties... view more
It acts as a high performance diamine curing agent. Versalink® 740M is an off-white powder with wide processing latitude. It has a melting range of 125 °C – 128 °C and should be processed at 140° C... view more
It acts as an oligomeric diamine curative for various diisocyanates as well as their prepolymers and also as amine or anhydride cured epoxy modifier to enhance flexibility. Versalink® P-1000 is a... view more
It acts as an oligomeric diamine curative for various diisocyanates as well as their prepolymers and also as amine or anhydride cured epoxy modifier to enhance flexibility. Versalink® P-250 is a... view more
It acts as an oligomeric diamine curative for various diisocyanates as well as their prepolymers and also as amine or anhydride cured epoxy modifier to enhance flexibility. Versalink® P-650 is a... view more
Nynas Naphthenic Process Oils
Channel Alerts

Receive weekly digests on hot topics

Back to Top