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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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19 products match your search
Product Name
Supplier
Description
ANCAMIDE® 260A by Evonik is a reactive polyamide with low viscosity. Used in adhesives and sealants. Acts as a curing agent. Possesses good chemical-, water and corrosion resistance. ANCAMIDE® 260A... view more
ANCAMIDE® 350A by Evonik is a reactive polyamide with low viscosity and high imidazoline content. It is a curing agent. Used in adhesives and sealants. Offers long pot life with liquid resins... view more
ANCAMIDE® 351A by Evonik is a reactive polyamide based curing agent. Used in structural adhesives and sealers for concrete. Possesses good corrosion resistance, good color- and light stability... view more
ANCAMIDE® 503 by Evonik is an aliphatic amidoamine. It is a curing agent at room temperature. It is designed to be used with liquid epoxy resin. It is a moisture tolerant grade that offers low... view more
ANCAMIDE® 506 by Evonik is an aliphatic amidoamine based curing agent. Used in adhesives. Offers low viscosity, very long pot life and low exotherm. Designed for use with liquid epoxy resin... view more
ANCAMIDE® 507 by Evonik is a polyfunctional fatty amidoamine grade. Acts as a curing agent for liquid epoxy resins. It can be used alone or in the mixture with polyamides and other amidoamines... view more
ANCAMIDE® 910 by Evonik is a curing agent. Used in general-purpose, two-component adhesives. Possesses very good flexibility and peel strength, very good thermal shock resistance and good electrical... view more
Dimethylaminomethylphenol. Acts as a curing agent, catalyst for epoxy/polysulfide cures and an accelerator for polyamide or amidoamine curing agents. The blends of Ancamide® 1110 and Ancamide® K54... view more
High-performance modified polyamide curing agent optimized for use with liquid epoxy resins in two-component structural adhesives. Can be used in two-component epoxy adhesives for metal or plastic... view more
It is a high performance modified polyamide. Acts as a curing agent. Exhibits zero induction time at ambient temperature, excellent development of hardness, moderate viscosity and fast dry time... view more
Applications
Modified amidoamine. Used in concrete primers and adhesives. Acts as a curing agent. Possesses very good chemical resistance and very good adhesion to cold, damp concrete. Offers benefits such as... view more
High-performance modified polyamide. Used in two-component epoxy adhesives for metal or plastic bonding and two-component structural adhesives. Acts as a curing agent. Offers benefits such as rapid... view more
Modified polyamide. Used in two-component ambient temperature or heat-cured epoxy adhesives for metal, plastic or wood bonding. Acts as a curing agent. Possesses features including low viscosity... view more
Reactive polyamide. Acts as an epoxy curing agent. It provides excellent adhesion to a variety of substrates. Ancamide® 261A is readily compatible with a wide range of solvents. Has high viscosity... view more
It is a low viscosity polyaminoamide adduct supplied at 90% solids in ethanol. Acts as a curing agent. Offers good cure under high humidity. Used for concrete adhesives where good adhesion to damp... view more
Amidoamine. Acts as a low viscosity curing agent designed for use with liquid epoxy resin. Offers low viscosity, long pot life and high temperature performance. Its recommended usage level with... view more
It is an accelerated amidoamine. Acts as a curing agent for liquid epoxy resins. Offers faster cure speed and improved chemical resistance than unmodified amidoamines. Exhibits low viscosity and... view more
Amidoamine. Used in adhesives. Acts as a curing agent. Offers benefits such as low viscosity, DOT noncorrosive and relatively long pot life... view more
N-(2-hydroxy ethyl) diethylene triamine. Acts an ambient or elevated temperature curing agent. It is a two-component (2K) epoxy adhesive in which the term two-component indicates that the curing... view more
Peace of Mind for your food contact applications
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