OK
The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
Save
Cette page a bien été ajoutée à vos favoris
147 products match your search
Product Name
Supplier
Description
2-ethylhexyl acrylate. It is a transparent, colorless, clear liquid. It can be copolymerized for instance with acrylic acid and its salts, esters and acrylamide, with methacrylic acid... view more
High reactive epoxy methacrylate resin based on bisphenol A diglycidylether and diluted in a difunctional monomer. Offers good chemical resistance. Exhibits high reactivity even at low temperatures... view more
High reactive modified epoxy/acrylate resin based on bisphenol A/F diglycidylether. Is solvent and styrene free. Offers good chemical resistance and high reactivity even at low temperatures. Used... view more
Non-ionic, aqueous dispersion of a bisphenol A epoxy resin with no organic solvents. Is completely water reducible, providing wide latitude for viscosity reduction. No organic solvents are present... view more
Non-ionic, aqueous dispersion of a bisphenol A epoxy resin with no organic solvents. Is completely water reducible, providing wide latitude for viscosity reduction. Has moderate viscosity and is... view more
Moderate viscosity, mechanically stable, non-ionic, aqueous dispersion of a solid bisphenol A epoxy resin with no organic solvents. Is completely water reducible. Provides a wide latitude in... view more
Nonionic stable dispersion of a solid epoxy resin derived from bisphenol-A in water and 2-propoxyethanol. Possesses compatibility with a variety of aminoplast resins and solvents. Offers good... view more
Physically stable, non-ionic dispersion of high molecular weight epoxy resin derived from bisphenol-A in water and methoxy propanol (PM). Low VOC and non-HAPS. Provides good adhesion to metal and... view more
Applications
Nonionic aqueous dispersion of a polyfunctional aromatic epoxy resin with an average functionality of three. Contains reactive epoxide functionality. Upon evaporation of water, EPI-REZ 5003-W-55... view more
Solvent-free, thixotropic, nonionic, aqueous dispersion of urethane modified epoxy resin. No organic solvents are present. Has a moderate viscosity and is mechanically stable. Is completely water... view more
Polyfunctional epoxy resin dispersion. Low volatile organic content (VOC). Shows rapid room temperature cure, long-term water and humidity resistance. Offers performance versatility and corrosion... view more
Applications
No VOC, waterborne dispersion of an epoxidized ortho-cresylic novolac with an average functionality of six. Contains no organic co-solvents. Dries to a clear, tack-free film or can be cured with... view more
It is a 55% solids dispersion of an EPON™ Resin 1001F in water and 2-propoxyethanol. Epi-rez™ Resin 3520-WY-55 is compatible with a variety of water reducible curing agents. When combined with... view more
It is a 53% solids dispersion of an EPON™ Resin 1001F in water and 2-propoxyethanol. Epi-rez™ Resin 3521-WY-55 is compatible with a variety of water reducible curing agents. When combined with... view more
Liquid, bisphenol A type epoxy resin specifically designed for water dilution. Acts as a binder for sealers. Is alkylphenol ethoxylates free. Forms uniform dispersions in water in combination with... view more
Applications
Water dispersible, liquid bisphenol A type epoxy resin. Is particularly attractive for two-package high solids water-based formulations. Can also be used in highly crosslinked one-package baked... view more
Medium viscosity epoxy resin based on a blend of a bisphenol F resin and a bisphenol A resin. Has a low volatility as well as is crystallization-free and nearly inodorous. Exhibits very good... view more
Applications
Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin, and containing an added proportion of a mono epoxidised alcohol as a reactive diluent. Possesses low volatility, very good... view more
Low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin)... view more
Diluent-free, low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and... view more
Diluent-free, low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and... view more
Low viscosity epoxy resin based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin). Contains an... view more
Low viscosity epoxy resin, based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin). Contains... view more
Low viscosity epoxy resin based on bisphenol A and bisphenol F resin. Contains an added proportion of a difunctional epoxidized alcohol as reactive diluent. No tendency to crystallization. Offers... view more
Low viscosity epoxy resin based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin). Contains an... view more
Applications
Low viscosity epoxy resin based on a blend of a bisphenol F resin (produced from bisphenol F and epichlorohydrin) and a bisphenol A resin (produced from bisphenol A and epichlorohydrin). Contains an... view more
Applications
Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin. Contains an added proportion of glycidylester of neodecanoic acid as a reactive diluent. Provides good resistance for... view more
Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin, and containing an added proportion of glycidyl ester of neodecanoic acid as a reactive diluent. Has low volatility. Offers... view more
Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin and containing an added proportion of glycidyl ester of neodecanoic acid as a reactive diluent. Has low volatility. Provides a... view more
Low viscosity epoxy resin produced from bisphenol A and F resins. Provides no tendency to crystallization even at sub-zero conditions. Offers low volatility, very good pigment and filler wetting... view more
Medium viscosity liquid epoxy resin produced from bisphenol A and epichlorohydrin. Contains no diluent. Provides good pigment wetting and good resistance to filler settling. Offers high level of... view more
Diluent-free, medium viscosity liquid epoxy resin produced from bisphenol A and epichlorohydrin. Provides good pigment wetting and good resistance to filler settling. Offers high level of mechanical... view more
Medium viscosity epoxy resin, produced from bisphenol A and epichlorohydrin. Contains no diluent. Has low hydrolyzable chlorine content. Provides good pigment wetting and good resistance to filler... view more
Diluent-free, medium viscosity liquid epoxy resin produced from bisphenol A and epichlorohydrin. Provides good pigment wetting and good resistance to filler settling. Offers high level of mechanical... view more
Diluent-free, low viscosity liquid epoxy resin produced from bisphenol F and epichlorohydrin. Provides good pigment wetting and good resistance to filler settling. Imparts high mechanical... view more
Solvent-free, modified special curing agent. The short pot life only allows production of small resin / hardener mixtures. Offers fast curing even at low temperatures. Used in fast curing adhesive... view more
Applications
Low viscosity, Mannich based special curing agent. Imparts very good water resistance and adhesion under wet conditions. Provides good mechanical performance, superior surface appearance and blush... view more
Mannich base type curing agent with a high reactivity. Possesses good mechanical properties and good resistance against mineral acids. Offers high gloss and water resistant. Exhibits fast curing... view more
Solvent and phenol-free mannich base type curing agent with a high reactivity. Possesses good mechanical properties, good resistance against solvents and mineral acids. Offers fast curing even at... view more
High viscosity, modified mannich base hardener with a favorable mixing ratio. Acts as a curing agent. Offers good surface appearance, good chemical resistance. The resulting surfaces have a high... view more
Amidoamine with a low viscosity, low imidazoline content and dark color. Is based on tall oil fatty acid and polyamines as well as fast setting. Exhibits very good epoxy resin compatibility... view more
Low viscosity amidoamine, low imidazoline content, fast-setting epoxy curing agent based on tall oil fatty acid and polyamines. Provides good adhesion, chemical resistance, low exotherm and high... view more
Very low viscosity amidoamine, medium imidazoline content epoxy curing agent based on tall oil fatty acid and polyamines. Is moderately fast setting. Exhibits very good compatibility with epoxy... view more
Aliphatic amidoamine. Acts as a curing agent. Provides advantages such as low viscosity, extended pot life and wide range of combining ratios. Shows complete compatibility with conventional epoxy... view more
Accelerated amidoamine. Acts as a moderately reactive room temperature curing agent. Possesses good mechanical and chemical properties. Compositions based on EPON™ Resin 828 and EPIKURE 3072 cure... view more
Moderate-viscosity, modified polyamidoamine adduct. Acts as a curing agent. Is blush-resistant and features a 1-to-1 by weight/mix/ratio with standard liquid epoxy resins. Possesses high corrosion... view more
High molecular weight, reactive polyamide. Is a semi-solid epoxy curing agent and blending resin based on dimerized fatty acid as well as polyamines. Offers very good water and corrosion resistance... view more
High molecular weight, reactive polyamide, high viscosity epoxy curing agent based on dimerized fatty acid and polyamines. Possesses long pot life and very good adhesion. Offers very good pigment... view more
High molecular weight, reactive polyamide, high viscosity epoxy curing agent based on dimerized fatty acid and polyamines. Possesses long pot life and very good adhesion. Offers very good pigment... view more
High molecular weight, reactive polyamide, high viscosity epoxy curing agent based on dimerized fatty acid and polyamines. Possesses long pot life and very good adhesion. Offers very good pigment... view more
Medium viscosity reactive polyamide curing agent based on dimerized fatty acid and polyamines. Offers very good adhesion, good water resistance, toughness and flexibility. Exhibits good pigment and... view more
Low viscosity reactive polyamide, high imidazoline, moderate molecular weight epoxy curing agent based on dimerized fatty acid and polyamines. Possesses very good compatibility with epoxy resin... view more
Low viscosity, modified polyamide epoxy curing agent based on dimerized fatty acid and polyamines. Offers good flexibility and very good corrosion resistance. Exhibits good blush resistance... view more
Proprietary oligomeric polyamine. Acts as a curing agent. Possesses high degree of toughness and flexibility. Exhibits improved combinations of elongation, strength, modulus, abrasion resistance... view more
Unmodified aliphatic amine. Acts as a curing agent. Due to its tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, it is most often formulated, adducted or... view more
Solution of an aliphatic amine adduct in a mixture of xylene, propylene glycol monomethyl ether and methyl isobutyl ketone. Acts as a curing agent. Possesses good chemical, solvent and corrosion... view more
Unmodified aliphatic amine. Acts as a curing agent. Due to its tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, it is most often formulated, adducted or... view more
Unmodified D230-type polyoxypropylenediamine. Acts as a curing agent. Has moderate reactivity, low viscosity, low vapor pressure, low color and high primary amine content. Offers benefits such as... view more
Unmodified D230-type polyoxypropylenediamine. Acts as a curing agent. Has moderate reactivity, low viscosity, low vapor pressure, light color and improved color retention. Offers benefits such as... view more
Unmodified aliphatic amine. Acts as a curing agent. Due to its tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, it is most often formulated, adducted or... view more
Unmodified aliphatic amine. Acts as a curing agent. Due to its tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, it is most often formulated, adducted or... view more
Phenol-free, modified mannich base epoxy curing agent. Has low temperature cure, light color and low viscosity. Offers very good moisture resistance, high gloss and carbonate free surfaces. Used in... view more
A tertiary amine, is tris (dimethyl amino-methyl) phenol. Acts as a curing agent. Offers high reactivity, low viscosity, low vapor pressure and good color. Used in concrete adhesives and bake cured... view more
Modified aliphatic amine. Acts as a curing agent. Offers benefits such as light color, good mar resistance, resistance to amine carbonate formation (“blush”, “bloom” or “sweat-out”) and convenient... view more
Low to moderate viscosity, fastsetting, modified aliphatic amine. Acts as a curing agent. Possesses features including high heat distortion temperatures, modest blush resistance and very good... view more
Modified aliphatic amine. Offers benefits such as rapid cure rates in thin sections, low temperature cure and convenient combining ratio. Used in rapid setting adhesives and equal volume packaged... view more
Moderately reactive, low viscosity aliphatic amine. Acts as a curing agent. Is low color, blush free and sweat free. Possesses water insensitivity and improved color retention as compared to... view more
Very reactive modified aliphatic amine adduct. Acts as a curing agent. Has been developed for applications where relatively short cure periods at room temperature are required... view more
Applications
Modified aliphatic amine. Acts as a light colored, low viscosity epoxy curing agent. Possesses reduced vapor pressure, good chemical resistance, low shrinkage and less critical mix ratios. Offers... view more
Low viscosity aliphatic amine adduct. Acts as a curing agent. Is relatively reactive. Imparts high degree of rigidity and mechanical strength to cured systems. Its reduced vapor pressure, less... view more
Very low viscosity, light colored cycloaliphatic amine. As a sole curing agent, it can yield epoxy systems with relatively high heat distortion properties when properly cured. Possesses resistance... view more
Low viscosity, modified cycloaliphatic amine capable of effecting thorough cures in epoxy resin systems at normal room temperature. Acts as a curing agent. Offers benefits such as good overnight... view more
Relatively low viscosity, modified amine adduct. Acts as a light-colored epoxy curing agent which, when combined with epoxy resins, cures to clear, tack-free films under low-temperature and high... view more
Very low viscosity, modified cycloaliphiatic amine. Acts as a light colored epoxy curing agent. Possesses good flexibility, very good gloss and color stability. Offers benefits such as good chemical... view more
Low viscosity, modified cycloaliphiatic amine adduct. Acts as a room temperature curing agent for epoxy resins. Offers benefits such as very good resistance to blush or sweat-out. Moderate to high... view more
Low viscosity, modified cycloaliphiatic amine. Acts as a light colored epoxy curing agent. Is excellent where high gloss, self-leveling, smooth, chemically resistant, light fast properties are... view more
Low viscosity, light colored cycloaliphatic amine. Acts as a curing agent. Possesses very good resistance to blush or sweat-out and high reactivity at room temperature. Offers quick hardening... view more
Low viscosity, low color modified cycloaliphatic amine epoxy curing agent. Exhibits very good corrosion resistance, chemical resistance as well as good color stability. Offers good amine blush... view more
Low viscosity, reaction product of ethylenediamine and methyl isobutyl ketone. Imparts extended pot life of 7-8 hours. Provides similar performance when compared to unmodified aliphatic amines or... view more
Light color and low viscosity modified cycloaliphatic amine curing agent. Contains no nonylphenol. Provides benefits such as low yellowing characteristics, superior surface appearance, blush... view more
Low viscosity, light colored modified cycloaliphatic amine. Contains no nonylphenol. Acts as a curing agent. When properly formulated the resultant surfaces are tack free and show a very good... view more
Low viscosity and a very light color modified cycloaliphatic amine. Acts as a curing agent. Offers benefits such as low yellowing with standard epoxy resins and good surface appearance... view more
Is a 53% solids, high molecular weight non-ionic aqueous dispersion of a modified polyamine adduct curing agent. Imparts good compatibility with other epoxy resin dispersions and mechanical... view more
Modified polyamidoamine adduct supplied at 50 percent solids in water, which when combined with liquid epoxy resins, provides completely solvent-free, two-package epoxy systems. Acts as a curing... view more
Water reducible amine adduct supplied at 60 percent solids in water, 2-propoxyethanol and glacial acetic acid. Acts as a curing agent. Possesses resistance to flash rusting, very good film... view more
It is the modified polyamines adduct to cross-link epoxy resins. Acts as curing agent. It is supplied at 68% weight solids in ethylene glycol monopropyl ether. It provides outstanding corrosion... view more
Low viscosity epoxy resin manufactured from phenolic novolac resin and epichlorohydrin. When cured with appropriate materials, highly cross-linked compositions exhibiting high chemical resistance... view more
Solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. Exhibits unique melt viscosity. This resin will not “block” or sinter even at slightly elevated storage temperatures. Used in... view more
Phenol, 4,4’-(1-methylethylidene)bis-, polymer with 2,2’-[(1 methylethylidene)bis(4,1-phenyleneoxymethylene)]bis(oxirane). Moderately high molecular weight solid epoxy resin derived from a liquid... view more
Novolac-free multifunctional epoxy resin. Possesses low concentration of ionic contaminants, saponifiable chloride content as well as low melt viscosity. At elevated temperatures, such systems have... view more
Low viscosity, multifunctional epoxy resin. Improves the properties of cured epoxy resin systems particularly at elevated temperatures. Features an average of greater than three reactive groups per... view more
Epoxy resin manufactured from phenolic novolac resin and epichlorohydrin. When cured with appropriate materials, highly cross linked compositions exhibiting high chemical resistance, high... view more
Multifunctional epoxy novolac resin. Offers low viscosity for corresponding functionality. Exhibits superior chemical resistance and batch-to-batch consistency. Provides good thermal resistance and... view more
Applications
Multifunctional epoxidized phenolic novolac resin. Has relatively low viscosity with good thermal stability and chemical resistance properties. Offers high functionality. Used in high temperature... view more
Applications
It is the multifunctional epoxidized phenolic novolac resin with an average functionality of 2.2. Epon™ Resin 162 is capable of curing with all classes of curing agents. Cure times and temperatures... view more
Solid multifunctional epichlorohydrin/cresol novolac epoxy resin. Possesses low ionic contaminants, low saponifiable chloride, low melt viscosity and stabibity on storage. Offers high thermal... view more
Solid multifunctional cresol novolac epoxy resin. Possesses low ionic contaminants, low saponifiable chloride, low melt viscosity and good storage stability. Combines the high thermal stability of... view more
Elastomer modified epoxy functional adduct formed from the reaction of the diglycidyl ether of bisphenol A and a carboxyl terminated butadiene-acrylonitrile elastomer. Offers compatibility with a... view more
Applications
Elastomer modified epoxy functional adduct formed from the reaction of the diglycidyl ether of bisphenol A and a carboxyl terminated butadiene-acrylonitrile elastomer. Exhibits higher peel and shear... view more
Applications
Low viscosity elastomer modified epoxy functional adduct formed from the reaction of HELOXY™ 68 modifier and a carboxyl terminated butadiene-acrylonitrile elastomer. Offers compatibility with... view more
Applications
Nynas Naphthenic Process Oils
Back to Top