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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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13 products match your search
Product Name
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Description
Epi-rez™ 3510-W-60 by Hexion is a non-ionic, aqueous dispersion of a bisphenol A epoxy resin with no organic solvents. It is completely water reducible, providing wide latitude for viscosity... view more
Applications
Non-ionic, aqueous dispersion of a bisphenol A epoxy resin with no organic solvents. Is completely water reducible, providing wide latitude for viscosity reduction. Has moderate viscosity and is... view more
Moderate viscosity, mechanically stable, non-ionic, aqueous dispersion of a solid bisphenol A epoxy resin with no organic solvents. Is completely water reducible. Provides a wide latitude in... view more
Nonionic stable dispersion of a solid epoxy resin derived from bisphenol-A in water and 2-propoxyethanol. Possesses compatibility with a variety of aminoplast resins and solvents. Offers good... view more
Physically stable, non-ionic dispersion of high molecular weight epoxy resin derived from bisphenol-A in water and methoxy propanol (PM). Low VOC and non-HAPS. Provides good adhesion to metal and... view more
Applications
Nonionic aqueous dispersion of a polyfunctional aromatic epoxy resin with an average functionality of three. Contains reactive epoxide functionality. Upon evaporation of water, EPI-REZ 5003-W-55... view more
Solvent-free, thixotropic, nonionic, aqueous dispersion of urethane modified epoxy resin. No organic solvents are present. Has a moderate viscosity and is mechanically stable. Is completely water... view more
Polyfunctional epoxy resin dispersion. Low volatile organic content (VOC). Shows rapid room temperature cure, long-term water and humidity resistance. Offers performance versatility and corrosion... view more
Applications
No VOC, waterborne dispersion of an epoxidized ortho-cresylic novolac with an average functionality of six. Contains no organic co-solvents. Dries to a clear, tack-free film or can be cured with... view more
It is a 55% solids dispersion of an EPON™ Resin 1001F in water and 2-propoxyethanol. Epi-rez™ Resin 3520-WY-55 is compatible with a variety of water reducible curing agents. When combined with... view more
It is a 53% solids dispersion of an EPON™ Resin 1001F in water and 2-propoxyethanol. Epi-rez™ Resin 3521-WY-55 is compatible with a variety of water reducible curing agents. When combined with... view more
Liquid, bisphenol A type epoxy resin specifically designed for water dilution. Acts as a binder for sealers. Is alkylphenol ethoxylates free. Forms uniform dispersions in water in combination with... view more
Applications
Water dispersible, liquid bisphenol A type epoxy resin. Is particularly attractive for two-package high solids water-based formulations. Can also be used in highly crosslinked one-package baked... view more
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