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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Eponol™ Resin 53-BH-35 by Hexion is an ultra high molecular weight epoxy resin cut to 35% weight in a blend of solvents. This blend is methyl ethyl ketone (MEK) and propylene glycol methyl ether... view more
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5th SpecialChem Annual Japan Conference - Digital Transformation in the Chemical Industry
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