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Product Name
Supplier
Description
Jeffamine® M-1000 Amine
Huntsman
Jeffamine® M-1000 Amine by Huntsman is polyetheramine. Used to modify epoxy resins for water reducible systems. Acts as an ore flotation agent and agricultural emulsifier...
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Jeffamine® M-2070 Amine
Huntsman
Jeffamine® M-2070 Amine by Huntsman is a mono-functional polyetheramine based on a copolymer backbone with an average molecular weight of about 2,000. The propylene oxide/ethylene oxide (PO/EO) mol...
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Applications
Adhesives
Jeffamine® M-2095 Amine
Huntsman
Jeffamine® M-2095 Amine by Huntsman is polyethylene glycol (PEG)-based polyetheramine. It is a hydrophilic polyether monoamine of approximately 2000 molecular weight. Exhibits moderate viscosity...
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Applications
Adhesives
Polymers>Epoxies (EP)
Polymers>Acrylics & Acrylic Copolymers
Jeffamine® M-3085 Amine
Huntsman
Jeffamine® M-3085 Amine by Huntsman is a hydrophilic polyether monoamine of approximately 3000 molecular weight with a PO/EO mole ratio of about 8/58. Exhibits moderate viscosity and low vapor...
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Applications
Adhesives
Polymers>Acrylics & Acrylic Copolymers
Polymers>Epoxies (EP)
Jeffamine® RFD-270 Amine
Huntsman
Jeffamine® RFD-270 Amine by Huntsman is a novel amine containing both rigid (cycloaliphatic) and flexible (polyetheramine) segments in the same molecule. Acts as a curing agent for epoxy resins. It...
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Applications
Adhesives
Polymers>Epoxies (EP)
Jeffamine® T-3000 Amine
Huntsman
Jeffamine® T-3000 Amine is polyetheramine by Huntsman. Acts as a modifier and curative in polyurethane elastomers and foams. Used as an adhesion promoter in epoxy systems. Possesses flexible...
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Applications
Adhesives
Polymers>Epoxies (EP)
Jeffamine® T-403 Amine
Huntsman
Jeffamine® T-403 Amine by Huntsman is polypropylene glycol (PPG)-based polyetheramine which acts as a curing agent for epoxy resins and anti-sag agent for polyurethanes. Exhibits low color, viscosity and...
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Applications
Polymers>Epoxies (EP)
Jeffamine® T-5000 Amine
Huntsman
Jeffamine® T-5000 Amine is polyetheramine by Huntsman. Used as a co-reactant in epoxy systems where adhesion promotion and flexibility are important. It is a crosslinker for polyurea and co-reactant...
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Applications
Adhesives
Polymers>Epoxies (EP)
Jeffamine® THF-100 Polyetheramine
Huntsman
Jeffamine® THF-100 Polyetheramine by Huntsman is diamine based on a PTMEG (poly(tetramethylene ether glycol)/PPG (polypropylene glycol) copolymer. It is useful in a variety of polymers, including cured epoxy resins...
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Applications
Adhesives
Jeffamine® THF-170 Polyetheramine
Huntsman
Jeffamine® THF-170 Polyetheramine by Huntsman is diamine of approximately 1700 molecular weight. It is chemically based on a PTMEG [poly(tetramethylene ether glycol)]/PPG (polypropylene glycol)...
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Applications
Adhesives
Jeffamine® XTJ 512 Amine
Huntsman
Jeffamine® XTJ 512 Amine by Huntsman is a polyetheramine. Used in adhesives, construction, flooring and paving, caulks, sealants, decorative aggregate, polymer concrete and wood consolidation. Acts...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
...
Jeffsol® Propylene Carbonate
Huntsman
Jeffsol® Propylene Carbonate by Huntsman is a clear, mobile, hygroscopic propylene carbonate solvent. It is used as a diluent for epoxy resins. It reacts with amines and can accelerate cure with more reactive...
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Applications
Polymers>Epoxies (EP)
Krystalgran® PN03-214
Huntsman
Krystalgran® PN03-214 by Huntsman is a high performance aliphatic polycaprolactone based thermoplastic polyurethane. Used in adhesive film. Possesses features including very good UV stability, color...
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Applications
Adhesives>Film/ Web adhesives
Krystalgran® PN03-217
Huntsman
High performance aliphatic polycaprolactone based thermoplastic polyurethane. Used in adhesive film. Possesses features including good UV stability, color and clarity retention, very good hydrolysis...
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Applications
Adhesives>Film/ Web adhesives
Krystalgran® PN3429-218
Huntsman
Krystalgran® PN3429-218 by Huntsman is a high performance aliphatic polyester based thermoplastic polyurethane. Used in adhesive film. Offers benefits such as very good UV stability, color and...
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Applications
Adhesives
Matrimid® 2292
Huntsman
Matrimid® 2292 by Huntsman is a diallyl ether of bisphenol-A based low viscosity resin. Used as a reactive diluent with epoxy, bismaleimide and polyimides. Exhibits excellent mechanical properties...
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Applications
Adhesives
Industrial Assembly>Sporting Goods
Medical>Medical device assembly
Electrical & Electronic Bonding>Assembly
...
Matrimid® 5218
Huntsman
Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites...
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Applications
Adhesives
Transportation (excl. Automotive)>Rail
Electrical & Electronic Bonding>Thermally & Electrically conductive
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Matrimid® 5292 A-2
Huntsman
4,4'-Bismaleimidodiphenylmethane. It exhibits outstanding heat performance (Tg range 250-300°C) and excellent mechanical properties at high temperature. Provides good toughness and very good...
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Applications
Adhesives
Electrical & Electronic Bonding>Motor & Magnet bonding
Transportation (excl. Automotive)>Rail
Industrial Assembly>Sporting Goods
...
Matrimid® 5292B
Huntsman
Matrimid® 5292B by Huntsman is an O,O-Diallyl Bisphenol A based reactive diluent with epoxy, bismaleimide, polyimides. It exhibits outstanding heat performance and excellent mechanical properties at...
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Applications
Adhesives
Electrical & Electronic Bonding>Assembly
Electrical & Electronic Bonding>Poting & Encapsulating
Electrical & Electronic Bonding>Cable Sealing
...
Matrimid® 9725
Huntsman
Diamine, 5(6)-amino-1-(4' aminophenyl)-1,3,-trimethylindane. It is a micropulverized version of Matrimid® 5218. Soluble polyimide. Fully imidized polymer. Does not require high temperatures for...
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Applications
Adhesives
N-aminoethylpiperazine (AEP)
Huntsman
N-aminoethylpiperazine (AEP) by Huntsman Advanced Materials is an N-aminoethylpiperazine. It is an epoxy resin curing agent. N-aminoethylpiperazine (AEP) is used to formulate epoxy systems for...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Nychem® Poly4000
Huntsman
Nychem® Poly4000 by Huntsman is a specialized waterborne, polybutadiene homopolymer. It may also be used to form a butadiene rubber core in a core shell polymer. Nychem® Poly4000 is also suitable...
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Applications
Adhesives
Omicure® 24EMI
Huntsman
Omicure® 24EMI by Huntsman is a non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. It is used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature...
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Applications
Adhesives
Polymers>Epoxies (EP)
Omicure® BC-120
Huntsman
Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 10
Huntsman
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 100
Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 5
Huntsman
Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 50
Huntsman
Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-210
Huntsman
Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-24M
Huntsman
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-35M
Huntsman
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-405M
Huntsman
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-410M
Huntsman
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-415M
Huntsman
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-52M
Huntsman
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
PKFE PELLETS
Huntsman
PKFE PELLETS by Huntsman is a phenoxy resin. It is most compatible with polar materials and surfaces. This grade offers good thermal stability, allowing high-temperature and high-speed processing...
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Applications
Adhesives
PKHC PELLETS
Huntsman
PKHC PELLETS by Huntsman is a general purpose, medium molecular weight, phenoxy resin. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive strength...
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Applications
Adhesives
Sealants
PKHH PELLETS
Huntsman
PKHH PELLETS by Huntsman is a high viscosity, phenoxy resin. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive strength, and vapor barrier...
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Applications
Adhesives
Sealants
PKHJ PELLETS
Huntsman
PKHJ PELLETS by Huntsman is a high viscosity, medium-high molecular weight, phenoxy resin. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive...
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Applications
Adhesives
Sealants
PKHM-301
Huntsman
PKHM-301 by Huntsman is a solid, phenoxy resin melt blended with an oligomeric polyester polyol containing primary hydroxyl functional groups. It is a tough, ductile, amorphous, thermoplastic...
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Applications
Adhesives
Sealants
PKHP-200 POWDER
Huntsman
PKHP-200 POWDER by Huntsman is a micronized, phenoxy resin. It is a tough, ductile, amorphous polymer having excellent thermal stability, adhesion and cohesion strength, and excellent vapor barrier...
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Applications
Adhesives
Sealants
PKHS-30 PMA
Huntsman
PKHS-30 PMA by Huntsman is a 30% NV solution of phenoxy resin in PM acetate. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive strength, and vapor...
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Applications
Adhesives
Sealants
PKHS-40
Huntsman
PKHS-40 by Huntsman is a 40% NV solution of phenoxy resin in methyl ethyl ketone (MEK). It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive...
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Applications
Adhesives
Sealants
PKHS-MI
Huntsman
PKHS-MI by Huntsman is a 32% NV solution of phenoxy resin in PM acetate and cyclohexanone. It is a tough, ductile, amorphous polymer having excellent thermal stability, adhesive and cohesive...
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Applications
Adhesives
Sealants
PKHW-34
Huntsman
PKHW-34 by Huntsman is a waterborne, anionically-stabilized, colloidal dispersion of phenoxy resin. The dispersion is a non-Newtonian fluid at room temperature and exhibits very slight thixotropic...
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Applications
Adhesives
PKHW-35
Huntsman
PKHW-35 by Huntsman is a waterborne, anionically-stabilized, colloidal dispersion of phenoxy resin. The dispersion is a non-Newtonian fluid at room temperature and exhibits very slight thixotropic...
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Applications
Adhesives
Paphen® PKHM-30
Huntsman
Paphen® PKHM-30 by Huntsman is an opaque, tough & ductile, thermoplastic phenoxy resin blend. It possesses high cohesive strength, good impact resistance, compatibility with many polymers, polar...
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Applications
Adhesives>Hot-melt adhesives
Paphen® PKHM-85
Huntsman
Paphen® PKHM-85 by Huntsman is a tough & ductile, thermoplastic phenoxy resin blend. It possesses high cohesive strength, good impact resistance, compatibility with many polymers, polar materials...
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Applications
Adhesives
Sealants
Phenoxy PK™ HB+
Huntsman
Phenoxy PK™ HB+ by Huntsman is a tough, ductile, amorphous, low viscosity phenoxy (polyhydroxyethers) resin. It offers excellent thermal stability, adhesive strength, and vapor barrier properties...
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Applications
Adhesives
Sealants
Phenoxy PK™ HP-80
Huntsman
Phenoxy PK™ HP-80 by Huntsman is a tough, ductile, amorphous, low viscosity phenoxy (poly hydroxyl ethers) resin. It offers excellent thermal stability, adhesive strength, and vapor barrier...
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Applications
Adhesives
Sealants
Resin XB 4399-3
Huntsman
Resin XB 4399-3 is a tetra hydroxyphenyl ethane based solid polyfunctional epoxy resin. Exhibits high glass transition temperature, UV-blocking, better dimensional stability, higher cross-link...
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Applications
Adhesives
Industrial Assembly>Household appliance assembly
Automotive>Vehicle assembly (OEM)
Electrical & Electronic Bonding>Assembly
...
Resin XU 3508
Huntsman
Resin XU 3508 by Huntsman is a liquid toughened, bisphenol A based epoxy resin. Provides high toughness without decrease of glass transition temperature. It can replace partly or totally standard...
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Applications
Adhesives
Industrial Assembly>Household appliance assembly
Transportation (excl. Automotive)>Aircraft & Aerospace
Transportation (excl. Automotive)>Recreational vehicle
...
RoyOxy® RA-9500
Huntsman
RoyOxy® RA-9500 by Huntsman is amidoamine-based curing agent. Has lower viscosity. RoyOxy® RA-9500 is used for solvent-free systems and encapsulating applications...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
RoyOxy® RAC 43
Huntsman
RoyOxy® RAC 43 by Huntsman is polyamide-based curing agent. Has higher viscosity with good flexibility, adhesion and long pot life. RoyOxy® RAC 43 is recommended for adhesives...
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Applications
Adhesives
Polymers>Polyamides (PA)
RoyOxy® RAC 44
Huntsman
RoyOxy® RAC 44 by Huntsman is polyamide-based curing agent. Has medium viscosity. RoyOxy® RAC 44 is used for adhesives and sealants...
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Applications
Adhesives
Sealants
Polymers>Polyamides (PA)
RoyOxy® RAC 46
Huntsman
RoyOxy® RAC 46 by Huntsman is polyamide-based curing agent. Has lower viscosity. RoyOxy® RAC 46 is used for flooring and concrete crack sealants applications...
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Applications
Adhesives
Sealants
Polymers>Polyamides (PA)
Buildings & constructions>Floorcovering
...
RoyOxy® RAC 9089
Huntsman
RoyOxy® RAC 9089 by Huntsman is cycloaliphatic amine-based ambient temperature curing agent for liquid epoxy resins. Also acts as an accelerator in some systems. Provides an excellent adhesion to...
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Applications
Adhesives
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
RoyOxy® RAC 9500
Huntsman
RoyOxy® RAC 9500 by Huntsman is amidoamine-based curing agent. Provides good adhesion to concrete. RoyOxy® RAC 9500 is used for flooring, concrete repair and general purpose adhesives applications...
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Applications
Adhesives
Buildings & constructions>Floorcovering
Buildings & constructions>Concrete
RoyOxy® RAC 9501
Huntsman
RoyOxy® RAC 9501 by Huntsman is amidoamine-based curing agent. Provides good adhesion to concrete. RoyOxy® RAC 9501 is used for flooring, concrete repair and general purpose adhesives applications...
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Applications
Adhesives
Buildings & constructions>Concrete
Buildings & constructions>Floorcovering
RoyOxy® RAC 9544
Huntsman
RoyOxy® RAC 9544 by Huntsman is polyamide-based curing agent. It is solvent-free and displays good adhesion and toughness. RoyOxy® RAC 9544 is suitable for use in adhesives...
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Applications
Adhesives
Polymers>Polyamides (PA)
RoyOxy® RAC 9546
Huntsman
RoyOxy® RAC 9546 by Huntsman is polyamide-based curing agent. Provides an excellent flexibility and toughness. RoyOxy® RAC 9546 is used for solvent-free adhesives and other general purpose...
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Applications
Adhesives
Polymers>Polyamides (PA)
RoyOxy® RAC 9552
Huntsman
RoyOxy® RAC 9552 by Huntsman is modified polyamide-based curing agent. Provides an excellent hardness and flexibility. It cures at a room temperature. Offers medium viscosity and a long pot life...
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Applications
Adhesives
Polymers>Polyamides (PA)
RoyOxy® RAC 9910
Huntsman
RoyOxy® RAC 9910 by Huntsman is 4,4`-diaminodiphenyl sulphone (4,4'-DDS). Acts as an aromatic amine curing agent. Has high temperature and chemical resistance...
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Applications
Adhesives
Polymers>Sulfone-based
RoyOxy® RAC 9912
Huntsman
RoyOxy® RAC 9912 by Huntsman acts as an aromatic amine curing agent. Used in adhesives...
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Applications
Adhesives
Polymers>Sulfone-based
RoyOxy® RAC 9919
Huntsman
RoyOxy® RAC 9919 by Huntsman is multi-purpose aromatic amine-based curing agent. Provides high heat distortion. Has a long pot life and low exotherm. RoyOxy® RAC 9919 is recommended for adhesive...
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Applications
Adhesives
RoyOxy® RAC 9956
Huntsman
RoyOxy® RAC 9956 by Huntsman is aliphatic amine-based curing agent for liquid and solid epoxy resins. Offers low viscosity, light color, low shrinkage and good electrical properties...
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Applications
Adhesives
Polymers>Epoxies (EP)
RoyOxy® RAC-9500
Huntsman
RoyOxy® RAC-9500 by Huntsman is an amidoamine. It provides good adhesion to concrete. It is suitable for adhesives applications. It complies with FDA 21 CFR 175.3000 and 21 CFR 175.105...
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Applications
Adhesives
RoyOxy® RAC-9501
Huntsman
RoyOxy® RAC-9501 by Huntsman is an amidoamine. It provides good adhesion to concrete. It is suitable for adhesives applications. It complies with FDA 21 CFR 175.3000 and 21 CFR 175.105...
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Applications
Adhesives
RoyOxy® RAD 948
Huntsman
RoyOxy® RAD 948 by Huntsman is a low viscosity aliphatic trifunctional reactive diluent based on trimethylol propane. Also acts as a crosslinking agent. Provides very good reactivity which makes it...
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Applications
Adhesives>Reactive adhesives>Solvent free (100% solid) adhesives
Polymers>Epoxies (EP)
RoyOxy® RAR 1001 X75
Huntsman
RoyOxy® RAR 1001 X75 by Huntsman is an epoxy resin. It is used for adhesives...
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Applications
Adhesives
RoyOxy® RAR 1001x75
Huntsman
RoyOxy® RAR 1001x75 by Huntsman is a bisphenol-A solid epoxy resin. RoyOxy® RAR 1001x75 is suitable for use in adhesives...
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Applications
Adhesives
RoyOxy® RAR 1002
Huntsman
RoyOxy® RAR 1002 by Huntsman is an epoxy resin. It is used as an intermediate in the preparation of high-performance hot melt adhesives...
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Applications
Adhesives>Hot-melt adhesives
RoyOxy® RAR 1018
Huntsman
RoyOxy® RAR 1018 by Huntsman is a high melt viscosity epoxy resin. It is used to maintain the rheological characteristics of adhesives...
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Applications
Adhesives
RoyOxy® RAR 8006
Huntsman
RoyOxy® RAR 8006 by Huntsman is CTBN-elastomer modified bisphenol A based epoxy resin. Provides excellent thermal shock resistance and toughness. Has an elastomer content of 40% by weight. RoyOxy®...
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Applications
Adhesives
Electrical & Electronic Bonding
RoyOxy® RAR 908
Huntsman
RoyOxy® RAR 908 by Huntsman is bisphenol-A liquid epoxy resin. It is utilized to provide increased flexibility, improved impact resistance, high elongation and extended the pot life. Exhibits low...
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Applications
Adhesives
Sealants
RoyOxy® RAR 935
Huntsman
RoyOxy® RAR 935 by Huntsman is a cycloaliphatic epoxy resin (casting resin). It gives a very high Tg. It provides outstanding performance for UV resistance and anti-radiation properties when used in...
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Applications
Adhesives
RoyOxy® RAR 9438
Huntsman
RoyOxy® RAR 9438 by Huntsman is epoxy phenol novolac resin. Provides excellent thermal stability and high heat as well as chemical resistance. Has a functionality of ~3.6. It is an ideal binder for...
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Applications
Adhesives
Suprasec® 1000
Huntsman
4,4' diphenylmethane diisocyanate (MDI). Used in adhesives for flexible packaging...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 1004
Huntsman
Suprasec® 1004 by Huntsman is a reactivity and viscosity modified pure MDI with low-functionality. Suprasec® 1004 is used in the formulation of adhesives and in low reactive systems and prepolymers...
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Applications
Adhesives
Suprasec® 1007
Huntsman
Prepolymerised diphenyl methane diisocyanate (MDI). Used in industrial adhesives...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 1042
Huntsman
Polymeric diphenyl methane diisocyanate (MDI). Used in industrial adhesives and in wood adhesives...
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Applications
Adhesives>Water-based adhesives
Wood & Related Industries
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 1100
Huntsman
4,4' diphenylmethane diisocyanate (MDI). Used in adhesives for flexible packaging...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 1306
Huntsman
Suprasec® 1306 by Huntsman is a 4,4' diphenylmethane diisocyanate (MDI). Used in the production of industrial adhesives and sealants. Suprasec® 1306 is supplied as frozen solid in drums or in liquid...
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Applications
Adhesives
Sealants
Suprasec® 1400
Huntsman
4,4' diphenylmethane diisocyanate (MDI). Used in adhesives for flexible packaging...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 1412
Huntsman
Suprasec® 1412 by Huntsman is a low-functionality MDI based prepolymer. It is used in the formulation of adhesives. It offers improved adhesion properties...
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Applications
Adhesives
Suprasec® 2004
Huntsman
Suprasec® 2004 is a reactive and viscosity modified diphenyl methane diisocyanate (MDI) by Huntsman. Offers improved storage stability. Suprasec® 2004 is used in adhesives for flexible packaging and...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 2008
Huntsman
Suprasec® 2008 by Huntsman is a prepolymerized diphenyl methane diisocyanate (MDI) with low functionality. Used in industrial adhesives. Suprasec® 2008 product is designed to have a small change is...
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Applications
Adhesives
Suprasec® 2010
Huntsman
Suprasec® 2010 by Huntsman is a prepolymerized diphenyl methane diisocyanate (MDI). Suprasec® 2010 is used in industrial adhesives...
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Applications
Adhesives
Suprasec® 2018
Huntsman
Prepolymerised diphenyl methane diisocyanate (MDI). Used in industrial adhesives...
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Applications
Adhesives
Suprasec® 2020
Huntsman
Suprasec® 2020 by Huntsman is a low functionality product. It is chemically based on uretonimine-modified diphenyl methane diisocyanate (MDI). It has a low viscosity. Suprasec® 2020 is used in...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 2021
Huntsman
Suprasec® 2021 by Huntsman is a low-functionality MDI based prepolymer. Used in the formulation of adhesives and in cast polyurethanes with engineering requirements. Suprasec® 2021 has an average...
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Applications
Adhesives
Suprasec® 2026
Huntsman
Suprasec® 2026 by Huntsman is a modified MDI containing some higher functionality isocyanate. The excellent sealing process provided by the polyurethane adhesive based on it allows the laminated...
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Applications
Adhesives
Buildings & constructions>Panelling
Buildings & constructions>Laminates
Suprasec® 2029
Huntsman
Suprasec® 2029 by Huntsman is an uretonimine-modified diphenyl methane diisocyanate (MDI). Used in adhesives for flexible packaging. Suprasec® 2029 has a low NCO content with improved stability at...
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Applications
Adhesives
Papers & Packagings>Flexible packaging: films / films & film / foil laminates
Suprasec® 2030
Huntsman
Suprasec® 2030 is a pre-polymerized diphenyl methane diisocyanate (MDI). Used in industrial adhesives. Suprasec® 2030 gives a wide compatibility...
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Applications
Adhesives
Suprasec® 2034
Huntsman
Mid-functionality MDI based prepolymer. Used in the formulation of adhesives. Offers even higher reactivity...
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Applications
Adhesives
Suprasec® 2049
Huntsman
Low-functionality MDI based prepolymer for polyurea systems. Used in the formulation of adhesives...
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Applications
Adhesives
Suprasec® 2050
Huntsman
Suprasec® 2050 by Huntsman is a MDI based prepolymer with mid-functionality. Suprasec® 2050 is used in the formulation of adhesives and in high performance elastomeric applications...
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Applications
Adhesives
Suprasec® 2054
Huntsman
Suprasec® 2054 is a low-functionality MDI based prepolymer for polyurea systems by Huntsman. Used in the formulation of adhesives. Suprasec® 2054 provides very good tear strength and good E-modulus...
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Applications
Adhesives
Suprasec® 2058
Huntsman
Low-functionality MDI based prepolymer for polyurea systems. Used in the formulation of adhesives. Provides low reactivity, very good tensile strength and elongation properties...
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Applications
Adhesives
Suprasec® 2059
Huntsman
Higher-functional MDI based prepolymer for polyurea systems. Used in the formulation of adhesives. Provides very good tensile strength, elongation properties and cold impact resistance...
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Applications
Adhesives
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