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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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512 products match your search
Product Name
Supplier
Description
Jeffamine® M-1000 Amine by Huntsman is polyetheramine. Used to modify epoxy resins for water reducible systems. Acts as an ore flotation agent and agricultural emulsifier... view more
Jeffamine® M-2070 Amine by Huntsman is a mono-functional polyetheramine based on a copolymer backbone with an average molecular weight of about 2,000. The propylene oxide/ethylene oxide (PO/EO) mol... view more
Applications
Jeffamine® M-2095 Amine by Huntsman is polyethylene glycol (PEG)-based polyetheramine. It is a hydrophilic polyether monoamine of approximately 2000 molecular weight. Exhibits moderate viscosity... view more
Jeffamine® M-3085 Amine by Huntsman is a hydrophilic polyether monoamine of approximately 3000 molecular weight with a PO/EO mole ratio of about 8/58. Exhibits moderate viscosity and low vapor... view more
Jeffamine® RFD-270 Amine by Huntsman is a novel amine containing both rigid (cycloaliphatic) and flexible (polyetheramine) segments in the same molecule. Acts as a curing agent for epoxy resins. It... view more
Jeffamine® T-3000 Amine is polyetheramine by Huntsman. Acts as a modifier and curative in polyurethane elastomers and foams. Used as an adhesion promoter in epoxy systems. Possesses flexible... view more
Jeffamine® T-403 Amine by Huntsman is polypropylene glycol (PPG)-based polyetheramine which acts as a curing agent for epoxy resins and anti-sag agent for polyurethanes. Exhibits low color, viscosity and... view more
Jeffamine® T-5000 Amine is polyetheramine by Huntsman. Used as a co-reactant in epoxy systems where adhesion promotion and flexibility are important. It is a crosslinker for polyurea and co-reactant... view more
Jeffamine® THF-100 Polyetheramine by Huntsman is diamine based on a PTMEG (poly(tetramethylene ether glycol)/PPG (polypropylene glycol) copolymer. It is useful in a variety of polymers, including cured epoxy resins... view more
Applications
Jeffamine® THF-170 Polyetheramine by Huntsman is diamine of approximately 1700 molecular weight. It is chemically based on a PTMEG [poly(tetramethylene ether glycol)]/PPG (polypropylene glycol)... view more
Applications
Jeffamine® XTJ 512 Amine by Huntsman is a polyetheramine. Used in adhesives, construction, flooring and paving, caulks, sealants, decorative aggregate, polymer concrete and wood consolidation. Acts... view more
Jeffsol® Propylene Carbonate by Huntsman is a clear, mobile, hygroscopic propylene carbonate solvent. It is used as a diluent for epoxy resins. It reacts with amines and can accelerate cure with more reactive... view more
Krystalgran® PN03-214 by Huntsman is a high performance aliphatic polycaprolactone based thermoplastic polyurethane. Used in adhesive film. Possesses features including very good UV stability, color... view more
High performance aliphatic polycaprolactone based thermoplastic polyurethane. Used in adhesive film. Possesses features including good UV stability, color and clarity retention, very good hydrolysis... view more
Krystalgran® PN3429-218 by Huntsman is a high performance aliphatic polyester based thermoplastic polyurethane. Used in adhesive film. Offers benefits such as very good UV stability, color and... view more
Applications
Matrimid® 2292 by Huntsman is a diallyl ether of bisphenol-A based low viscosity resin. Used as a reactive diluent with epoxy, bismaleimide and polyimides. Exhibits excellent mechanical properties... view more
Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. Possesses very high glass transition temperature and excellent high temperature properties for use in structural composites... view more
4,4'-Bismaleimidodiphenylmethane. It exhibits outstanding heat performance (Tg range 250-300°C) and excellent mechanical properties at high temperature. Provides good toughness and very good... view more
Matrimid® 5292B by Huntsman is an O,O-Diallyl Bisphenol A based reactive diluent with epoxy, bismaleimide, polyimides. It exhibits outstanding heat performance and excellent mechanical properties at... view more
Diamine, 5(6)-amino-1-(4' aminophenyl)-1,3,-trimethylindane. It is a micropulverized version of Matrimid® 5218. Soluble polyimide. Fully imidized polymer. Does not require high temperatures for... view more
Applications
N-aminoethylpiperazine (AEP) by Huntsman Advanced Materials is an N-aminoethylpiperazine. It is an epoxy resin curing agent. N-aminoethylpiperazine (AEP) is used to formulate epoxy systems for... view more
Nychem® Poly4000 by Huntsman is a specialized waterborne, polybutadiene homopolymer. It may also be used to form a butadiene rubber core in a core shell polymer. Nychem® Poly4000 is also suitable... view more
Applications
Omicure® 24EMI by Huntsman is a non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. It is used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature... view more
Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or... view more
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds... view more
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA... view more
Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting... view more
Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and... view more
Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the... view more
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The... view more
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of... view more
Huntsman
PKFE PELLETS by Huntsman is a phenoxy resin. It is most compatible with polar materials and surfaces. This grade offers good thermal stability, allowing high-temperature and high-speed processing... view more
Applications
Huntsman
PKHC PELLETS by Huntsman is a general purpose, medium molecular weight, phenoxy resin. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive strength... view more
Huntsman
PKHH PELLETS by Huntsman is a high viscosity, phenoxy resin. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive strength, and vapor barrier... view more
Huntsman
PKHJ PELLETS by Huntsman is a high viscosity, medium-high molecular weight, phenoxy resin. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive... view more
Huntsman
PKHM-301 by Huntsman is a solid, phenoxy resin melt blended with an oligomeric polyester polyol containing primary hydroxyl functional groups. It is a tough, ductile, amorphous, thermoplastic... view more
PKHP-200 POWDER by Huntsman is a micronized, phenoxy resin. It is a tough, ductile, amorphous polymer having excellent thermal stability, adhesion and cohesion strength, and excellent vapor barrier... view more
Huntsman
PKHS-30 PMA by Huntsman is a 30% NV solution of phenoxy resin in PM acetate. It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive strength, and vapor... view more
Huntsman
PKHS-40 by Huntsman is a 40% NV solution of phenoxy resin in methyl ethyl ketone (MEK). It is a tough, ductile, amorphous, thermoplastic polymer having excellent thermal stability, adhesive... view more
Huntsman
PKHS-MI by Huntsman is a 32% NV solution of phenoxy resin in PM acetate and cyclohexanone. It is a tough, ductile, amorphous polymer having excellent thermal stability, adhesive and cohesive... view more
Huntsman
PKHW-34 by Huntsman is a waterborne, anionically-stabilized, colloidal dispersion of phenoxy resin. The dispersion is a non-Newtonian fluid at room temperature and exhibits very slight thixotropic... view more
Applications
Huntsman
PKHW-35 by Huntsman is a waterborne, anionically-stabilized, colloidal dispersion of phenoxy resin. The dispersion is a non-Newtonian fluid at room temperature and exhibits very slight thixotropic... view more
Applications
Paphen® PKHM-30 by Huntsman is an opaque, tough & ductile, thermoplastic phenoxy resin blend. It possesses high cohesive strength, good impact resistance, compatibility with many polymers, polar... view more
Paphen® PKHM-85 by Huntsman is a tough & ductile, thermoplastic phenoxy resin blend. It possesses high cohesive strength, good impact resistance, compatibility with many polymers, polar materials... view more
Phenoxy PK™ HB+ by Huntsman is a tough, ductile, amorphous, low viscosity phenoxy (polyhydroxyethers) resin. It offers excellent thermal stability, adhesive strength, and vapor barrier properties... view more
Phenoxy PK™ HP-80 by Huntsman is a tough, ductile, amorphous, low viscosity phenoxy (poly hydroxyl ethers) resin. It offers excellent thermal stability, adhesive strength, and vapor barrier... view more
Resin XB 4399-3 is a tetra hydroxyphenyl ethane based solid polyfunctional epoxy resin. Exhibits high glass transition temperature, UV-blocking, better dimensional stability, higher cross-link... view more
Huntsman
Resin XU 3508 by Huntsman is a liquid toughened, bisphenol A based epoxy resin. Provides high toughness without decrease of glass transition temperature. It can replace partly or totally standard... view more
RoyOxy® RA-9500 by Huntsman is amidoamine-based curing agent. Has lower viscosity. RoyOxy® RA-9500 is used for solvent-free systems and encapsulating applications... view more
RoyOxy® RAC 43 by Huntsman is polyamide-based curing agent. Has higher viscosity with good flexibility, adhesion and long pot life. RoyOxy® RAC 43 is recommended for adhesives... view more
RoyOxy® RAC 44 by Huntsman is polyamide-based curing agent. Has medium viscosity. RoyOxy® RAC 44 is used for adhesives and sealants... view more
RoyOxy® RAC 46 by Huntsman is polyamide-based curing agent. Has lower viscosity. RoyOxy® RAC 46 is used for flooring and concrete crack sealants applications... view more
RoyOxy® RAC 9089 by Huntsman is cycloaliphatic amine-based ambient temperature curing agent for liquid epoxy resins. Also acts as an accelerator in some systems. Provides an excellent adhesion to... view more
RoyOxy® RAC 9500 by Huntsman is amidoamine-based curing agent. Provides good adhesion to concrete. RoyOxy® RAC 9500 is used for flooring, concrete repair and general purpose adhesives applications... view more
RoyOxy® RAC 9501 by Huntsman is amidoamine-based curing agent. Provides good adhesion to concrete. RoyOxy® RAC 9501 is used for flooring, concrete repair and general purpose adhesives applications... view more
RoyOxy® RAC 9544 by Huntsman is polyamide-based curing agent. It is solvent-free and displays good adhesion and toughness. RoyOxy® RAC 9544 is suitable for use in adhesives... view more
RoyOxy® RAC 9546 by Huntsman is polyamide-based curing agent. Provides an excellent flexibility and toughness. RoyOxy® RAC 9546 is used for solvent-free adhesives and other general purpose... view more
RoyOxy® RAC 9552 by Huntsman is modified polyamide-based curing agent. Provides an excellent hardness and flexibility. It cures at a room temperature. Offers medium viscosity and a long pot life... view more
RoyOxy® RAC 9910 by Huntsman is 4,4`-diaminodiphenyl sulphone (4,4'-DDS). Acts as an aromatic amine curing agent. Has high temperature and chemical resistance... view more
RoyOxy® RAC 9912 by Huntsman acts as an aromatic amine curing agent. Used in adhesives... view more
RoyOxy® RAC 9919 by Huntsman is multi-purpose aromatic amine-based curing agent. Provides high heat distortion. Has a long pot life and low exotherm. RoyOxy® RAC 9919 is recommended for adhesive... view more
Applications
RoyOxy® RAC 9956 by Huntsman is aliphatic amine-based curing agent for liquid and solid epoxy resins. Offers low viscosity, light color, low shrinkage and good electrical properties... view more
RoyOxy® RAC-9500 by Huntsman is an amidoamine. It provides good adhesion to concrete. It is suitable for adhesives applications. It complies with FDA 21 CFR 175.3000 and 21 CFR 175.105... view more
Applications
RoyOxy® RAC-9501 by Huntsman is an amidoamine. It provides good adhesion to concrete. It is suitable for adhesives applications. It complies with FDA 21 CFR 175.3000 and 21 CFR 175.105... view more
Applications
RoyOxy® RAD 948 by Huntsman is a low viscosity aliphatic trifunctional reactive diluent based on trimethylol propane. Also acts as a crosslinking agent. Provides very good reactivity which makes it... view more
RoyOxy® RAR 1001 X75 by Huntsman is an epoxy resin. It is used for adhesives... view more
Applications
RoyOxy® RAR 1001x75 by Huntsman is a bisphenol-A solid epoxy resin. RoyOxy® RAR 1001x75 is suitable for use in adhesives... view more
Applications
RoyOxy® RAR 1002 by Huntsman is an epoxy resin. It is used as an intermediate in the preparation of high-performance hot melt adhesives... view more
RoyOxy® RAR 1018 by Huntsman is a high melt viscosity epoxy resin. It is used to maintain the rheological characteristics of adhesives... view more
Applications
RoyOxy® RAR 8006 by Huntsman is CTBN-elastomer modified bisphenol A based epoxy resin. Provides excellent thermal shock resistance and toughness. Has an elastomer content of 40% by weight. RoyOxy®... view more
RoyOxy® RAR 908 by Huntsman is bisphenol-A liquid epoxy resin. It is utilized to provide increased flexibility, improved impact resistance, high elongation and extended the pot life. Exhibits low... view more
RoyOxy® RAR 935 by Huntsman is a cycloaliphatic epoxy resin (casting resin). It gives a very high Tg. It provides outstanding performance for UV resistance and anti-radiation properties when used in... view more
Applications
RoyOxy® RAR 9438 by Huntsman is epoxy phenol novolac resin. Provides excellent thermal stability and high heat as well as chemical resistance. Has a functionality of ~3.6. It is an ideal binder for... view more
Applications
4,4' diphenylmethane diisocyanate (MDI). Used in adhesives for flexible packaging... view more
Suprasec® 1004 by Huntsman is a reactivity and viscosity modified pure MDI with low-functionality. Suprasec® 1004 is used in the formulation of adhesives and in low reactive systems and prepolymers... view more
Applications
Prepolymerised diphenyl methane diisocyanate (MDI). Used in industrial adhesives... view more
Polymeric diphenyl methane diisocyanate (MDI). Used in industrial adhesives and in wood adhesives... view more
4,4' diphenylmethane diisocyanate (MDI). Used in adhesives for flexible packaging... view more
Suprasec® 1306 by Huntsman is a 4,4' diphenylmethane diisocyanate (MDI). Used in the production of industrial adhesives and sealants. Suprasec® 1306 is supplied as frozen solid in drums or in liquid... view more
4,4' diphenylmethane diisocyanate (MDI). Used in adhesives for flexible packaging... view more
Suprasec® 1412 by Huntsman is a low-functionality MDI based prepolymer. It is used in the formulation of adhesives. It offers improved adhesion properties... view more
Applications
Suprasec® 2004 is a reactive and viscosity modified diphenyl methane diisocyanate (MDI) by Huntsman. Offers improved storage stability. Suprasec® 2004 is used in adhesives for flexible packaging and... view more
Suprasec® 2008 by Huntsman is a prepolymerized diphenyl methane diisocyanate (MDI) with low functionality. Used in industrial adhesives. Suprasec® 2008 product is designed to have a small change is... view more
Applications
Suprasec® 2010 by Huntsman is a prepolymerized diphenyl methane diisocyanate (MDI). Suprasec® 2010 is used in industrial adhesives... view more
Applications
Prepolymerised diphenyl methane diisocyanate (MDI). Used in industrial adhesives... view more
Applications
Suprasec® 2020 by Huntsman is a low functionality product. It is chemically based on uretonimine-modified diphenyl methane diisocyanate (MDI). It has a low viscosity. Suprasec® 2020 is used in... view more
Suprasec® 2021 by Huntsman is a low-functionality MDI based prepolymer. Used in the formulation of adhesives and in cast polyurethanes with engineering requirements. Suprasec® 2021 has an average... view more
Applications
Suprasec® 2026 by Huntsman is a modified MDI containing some higher functionality isocyanate. The excellent sealing process provided by the polyurethane adhesive based on it allows the laminated... view more
Suprasec® 2029 by Huntsman is an uretonimine-modified diphenyl methane diisocyanate (MDI). Used in adhesives for flexible packaging. Suprasec® 2029 has a low NCO content with improved stability at... view more
Suprasec® 2030 is a pre-polymerized diphenyl methane diisocyanate (MDI). Used in industrial adhesives. Suprasec® 2030 gives a wide compatibility... view more
Applications
Mid-functionality MDI based prepolymer. Used in the formulation of adhesives. Offers even higher reactivity... view more
Applications
Low-functionality MDI based prepolymer for polyurea systems. Used in the formulation of adhesives... view more
Applications
Suprasec® 2050 by Huntsman is a MDI based prepolymer with mid-functionality. Suprasec® 2050 is used in the formulation of adhesives and in high performance elastomeric applications... view more
Applications
Suprasec® 2054 is a low-functionality MDI based prepolymer for polyurea systems by Huntsman. Used in the formulation of adhesives. Suprasec® 2054 provides very good tear strength and good E-modulus... view more
Applications
Low-functionality MDI based prepolymer for polyurea systems. Used in the formulation of adhesives. Provides low reactivity, very good tensile strength and elongation properties... view more
Applications
Higher-functional MDI based prepolymer for polyurea systems. Used in the formulation of adhesives. Provides very good tensile strength, elongation properties and cold impact resistance... view more
Applications
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