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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Palatinol® C

Based on HSP Distance
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Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

ERISYS®

Adhesives ingredients supplied by Huntsman

24 products match your search
Detailed List
Product Name
Supplier
Description
ERISYS® RF-50
Huntsman
ERISYS® RF-50 by Huntsman is a formulated resorcinol/bisphenol F resin which combines low viscosity with a high degree of reactivity and outstanding chemical resistance. It is non crystallizing and... view more
Applications
ERISYS® RN-25
Huntsman
ERISYS® RN-25 by Huntsman is a non-crystallizing, low viscosity high temperature resorcinol/phenol novolac epoxy resin. It is used in high temperature and conductive adhesives. It provides high degree... view more
Applications
ERISYS® RN-3650
Huntsman
ERISYS® RN-3650 by Huntsman is a low viscosity high temperature resorcinol/phenol novolac epoxy resin. It is used in high temperature and conductive adhesives. It provides resistance to crystallization... view more
Applications
ERISYS® GE-24
Huntsman
HSP Distance: 0
ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy... view more
Applications
ERISYS® GE-29
Huntsman
HSP Distance: 0
ERISYS® GE-29 by Huntsman is a low viscosity, epoxidized brominated neopentyl glycol. It is used as a diluent and as a flame retardant for epoxy formulations in adhesives. It offers compatibility with... view more
Applications
ERISYS® GE-31
Huntsman
HSP Distance: 0
ERISYS® GE-31 by Huntsman is triglycidyl ether of trimethylolethane. It acts as a reactive diluent for high viscosity epoxy resins. It is a low viscosity aliphatic triepoxide. It helps to produce... view more
Applications
ERISYS® GE-35
Huntsman
HSP Distance: 0
ERISYS® GE-35 by Huntsman is the triglycidyl ether of castor oil. It is a low viscosity polyepoxide resin which imparts flexibility, impact resistance and thermal shock resistance to epoxy... view more
Applications
ERISYS® GE-35H
Huntsman
HSP Distance: 0
ERISYS® GE-35H by Huntsman is a special grade of the triglycidyl ether of castor oil. It is a low viscosity polyepoxide resin which imparts flexibility, impact resistance and thermal shock resistance... view more
Applications
ERISYS® GE-36
Huntsman
HSP Distance: 0
ERISYS® GE-36 by Huntsman is triglycidyl ether of propoxylated glycerin. It is a flexibilizing diluent for epoxy resins. It is compatible with standard Bisphenol-A, Bisphenol-F and epoxy phenol... view more
Applications
ERISYS® GE-8
Huntsman
HSP Distance: 0
ERISYS® GE-8 by Huntsman is a monoglycidyl ether of a naturally occurring C12-C14 aliphatic alcohol. It is used as a reactive diluent for high viscosity epoxy resin in general purpose adhesives. It... view more
Applications
ERISYS® GS-120
Huntsman
HSP Distance: 0
ERISYS® GS-120 by Huntsman is dimer acid diglycidyl ester. It imparts a degree of flexibility to normally rigid epoxy systems. It offers increased toughness and tensile elongation. It exhibits improved... view more
Applications
ERISYS® RDGE
Huntsman
HSP Distance: 0
ERISYS® RDGE by Huntsman is resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It can be used as the sole resin in an epoxy formulation or as a reactive modifier. It shows... view more
Applications
ERISYS® RDGE-H
Huntsman
HSP Distance: 0
ERISYS® RDGE-H by Huntsman is a high purity resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It is used in conductive adhesives. It possesses compatibility with all... view more
Applications
ERISYS® GE-12
Huntsman
HSP Distance: 1.8
ERISYS® GE-12 by Huntsman is ether of nonyl phenol. Used as a reactive diluent in adhesives and sealants. It offers compatibility with all epoxy resins. It can be cured with most conventional amine... view more
Applications
ERISYS® GE-11
Huntsman
HSP Distance: 2.1
ERISYS® GE-11 by Huntsman is an epoxidized para-tertiary butyl phenol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses compatibility at all concentrations... view more
Applications
ERISYS® GE-22
Huntsman
HSP Distance: 2.6
ERISYS® GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more
Applications
ERISYS® GE-20
Huntsman
HSP Distance: 2.9
ERISYS® GE-20 by Huntsman is a low viscosity, aliphatic, diepoxide, epoxidized neopentyl glycol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more
Applications
ERISYS® GE-5
Huntsman
HSP Distance: 3.3
ERISYS® GE-5 by Huntsman is the monofunctional glycidyl ether of butyl alcohol. It is used as a diluent for epoxy resins in adhesives. It reduces viscosity. It provides increased filler loading... view more
Applications
ERISYS® GE-10
Huntsman
HSP Distance: 3.4
ERISYS® GE-10 by Huntsman is a low viscosity, aromatic, mono-epoxide, ortho cresol glycidyl ether. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more
Applications
ERISYS® GE-21
Huntsman
HSP Distance: 3.4
ERISYS® GE-21 by Huntsman is low viscosity, aliphatic, diepoxide, epoxidized butanediol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses compatibility at... view more
Applications
ERISYS® GE-30
Huntsman
HSP Distance: 3.4
ERISYS® GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured with... view more
Applications
ERISYS® GE-7
Huntsman
HSP Distance: 3.5
ERISYS® GE-7 by Huntsman is a monoglycidyl ether of a naturally occurring C8-C10 aliphatic alcohol. It is used as a reactive diluent for high viscosity epoxy resin in adhesives. It possesses... view more
Applications
ERISYS® GA-240
Huntsman
HSP Distance: 3.7
ERISYS® GA-240 by Huntsman is a tetrafunctional epoxy resin based on meta-Xylenediamine. It is a nitrogen containing highly reactive resin with a very low viscosity. It suggested for use in... view more
Applications
ERISYS® GE-6
Huntsman
HSP Distance: 3.7
ERISYS® GE-6 by Huntsman is epoxidized 2-ethylhexanol, a low viscosity mono-epoxide. It is intended for use as a reactive diluent for high viscosity epoxy resins. It offers low volatility, toxicity... view more
Applications
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