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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Products Compatible with Nuvox 1330

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

Evernox®

Adhesives ingredients supplied by Everspring Chemical

13 products match your search
Product Name
Supplier
Description
Everspring Chemical
HSP Distance: 0
Evernox® 1330 by Everspring Chemical is a stable phenolic compound. It is a primary antioxidant for processing and long-term thermal stabilization. Available as white, free-flowing powder. Suitable... view more
Applications
Everspring Chemical
HSP Distance: 0
Evernox® 1330GF by Everspring Chemical is a stable phenolic compound. It is a primary antioxidant for processing and long-term thermal stabilization. Available as white, free-flowing granules... view more
Applications
Everspring Chemical
HSP Distance: 0
Stable synergestic blend of phenolic and phosphite compounds. Used as an antioxidant for processing and good long-term heat stability in adhesives. Forms low color and keeps original melt flow... view more
Everspring Chemical
HSP Distance: 0
Stable synergestic blend of phenolic and phosphite compounds. Used as an antioxidant for processing and long-term heat stability in adhesives. Forms low color and keeps original melt flow... view more
Everspring Chemical
HSP Distance: 0
Stable synergestic blend of phenolic and phosphite compounds. Used as an antioxidant for processing and long-term heat stability in adhesives. Forms low color and keeps original melt flow... view more
Everspring Chemical
HSP Distance: 0
Stable synergestic blend of phenolic and phosphite compounds. Used as a good antioxidant for processing and long-term heat stability in adhesives. Forms low color and keeps original melt flow... view more
Everspring Chemical
HSP Distance: 0
Stable synergestic blend of phenolic and phosphite compounds. Used as an excellent antioxidant for processing and long-term heat stability in adhesives. Forms low color and keeps original melt flow... view more
Everspring Chemical
HSP Distance: 0
Stable synergestic blend of phenolic and phosphite compounds. Used as an excellent antioxidant for processing and long-term heat stability in adhesives. Forms low color and keeps original melt flow... view more
Everspring Chemical
HSP Distance: 1.8
Evernox® 10 by Everspring Chemical is a stable and sterically hindered phenolic compound. It is used as an antioxidant for manufacturing and processing. It improves long-term thermal stabilization... view more
Everspring Chemical
HSP Distance: 1.8
Stable, sterically hindered phenolic compound. Used as antioxidant for manufacturing, processing, long-term thermal stabilization in adhesives. Possesses good compatibility, high resistance to... view more
Everspring Chemical
HSP Distance: 2.7
Hindered phenolic compound. Used as an antioxidant for processing and long-term thermal stabilization in adhesives... view more
Everspring Chemical
HSP Distance: 3.5
Stable, sterically hindered phenolic compound. Used as an antioxidant for manufacturing, processing and long-term thermal stabilization in adhesives. Possesses good compatibility, high resistance to... view more
Everspring Chemical
HSP Distance: 3.5
Stable, sterically hindered phenolic compound. Used as an antioxidant for manufacturing, processing and long-term thermal stabilization in adhesives. Possesses good compatibility, high resistance to... view more
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