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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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Products Compatible with JAYHAWK™ PMDA Ultrapure

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

JAYHAWK™

Adhesives ingredients supplied by Evonik

6 products match your search
Product Name
Supplier
Description
HSP Distance: 0
3,3'4,4'-Benzophenonetetracarboxylic Dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for... view more
HSP Distance: 0
3,3'4,4'-Benzophenonetetracarboxylic Dianhydride. Facilitates mixing in epoxy resins. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot... view more
HSP Distance: 0
3,3',4,4'-Benzophenonetetracarboxylic dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for... view more
HSP Distance: 0
3,3',4,4'-Benzophenonetetracarboxylic dianhydride. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an... view more
HSP Distance: 0
Pyromellitic dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for optimal processing and... view more
HSP Distance: 0
Pyromellitic dianhydride. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an optimum purity and... view more
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