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Adhesives & Sealants Selector
Idemitsu Kosan
L-MODU™
by SpecialChem
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L-MODU™
Adhesives ingredients supplied by Idemitsu Kosan
L-MODU™ is low molecular weight and low modulus polypropylene. This homo polypropylene polymer exhibits good flexibility, high adhesive strength, slow crystallization and high heat stability against any degradation. It ensures good sprayability, long open time, transparency and low VOC in your applications. L-MODU™ is expected to be used as adhesive base polymer for broad range of applications including hot melt adhesives.
4
products match your search
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Product Name
Supplier
Description
L-MODU™ S400 Discontinued
Idemitsu Kosan
L-MODU™ S400 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky...
view more
Applications
Adhesives>Hot-melt adhesives
Papers & Packagings
Non-woven
Wood & Related Industries
L-MODU™ S410 Discontinued
Idemitsu Kosan
L-MODU™ S410 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky...
view more
Applications
Adhesives>Hot-melt adhesives
Non-woven
Wood & Related Industries
Papers & Packagings
L-MODU™ S600 Discontinued
Idemitsu Kosan
L-MODU™ S600 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky...
view more
Applications
Adhesives>Hot-melt adhesives
Papers & Packagings
Wood & Related Industries
Non-woven
L-MODU™ S901 Discontinued
Idemitsu Kosan
L-MODU™ S901 by Idemitsu Kosan is a colorless, odorless, soft, low molecular weight and low modulus polyolefin. It offers low density, high heat stability, low melt-viscosity and non-sticky...
view more
Applications
Adhesives>Hot-melt adhesives
Non-woven
Papers & Packagings
Wood & Related Industries
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