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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Products Compatible with 2-PYROL™

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

Technicure®

Adhesives ingredients supplied by AC Catalysts

18 products match your search
Product Name
Supplier
Description
1-(2-Cyanoethyl)-2-ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to brownish liquid. It is used for impact and heat resistant adhesives, and accelerator... view more
A&C Catalysts
Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride... view more
A&C Catalysts
Epoxy amine adduct. It acts as curing agent and accelerator for dicyandiamide, anhydrides, DDS or other imidazoles, decreasing the cure temperature. It is fine free flowing powder which can be used... view more
A&C Catalysts
HSP Distance: 0
Technicure® 54 by A&C Catalysts is a 2,4,6-tris(dimethylaminomethyl) phenol. Acts as a cure accelerator. It has low viscosity. It accelerates thin film set time and cure under damp and cold... view more
A&C Catalysts
HSP Distance: 0
Dicyamdiamide. It acts as a curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
A&C Catalysts
HSP Distance: 0
Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
A&C Catalysts
HSP Distance: 0
Dicyamdiamide. It acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow... view more
A&C Catalysts
HSP Distance: 0
Technicure® DU-200M by A&C Catalysts is a [1,1’- (4-methyl-m-phenylene)bis-(3,3-dimethyl)] urea, is a substituted urea. Technicure™ DU-200M is a dicyandiamide (DICY) accelerator. Provides good... view more
A&C Catalysts
HSP Distance: 0
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in adhesives... view more
A&C Catalysts
HSP Distance: 0
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It is low viscosity amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in... view more
A&C Catalysts
HSP Distance: 0
4,4’ Methylene bis (phenyl dimethyl urea). It acts as a curing agent and an accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It... view more
A&C Catalysts
HSP Distance: 0
Technicure® MDU-11M by A&C Catalysts is a [4,4’- (methylene bis (phenyl dimethyl)] urea, is a substituted urea. Technicure® MDU-11M is a dicyandiamide (DICY) accelerator. Provides good formulation... view more
HSP Distance: 0
Technicure® Nano-Dicy by A&C Catalysts is a pulverized grade of dicyandiamide, acts as a curing agent with an average particle size of about 1-2 micron. Provides excellent adhesion to a variety of... view more
A&C Catalysts
HSP Distance: 0
1,1'-(4 methyl-m-phenylene) bis(3,3 dimethyl urea). It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It... view more
A&C Catalysts
HSP Distance: 2.4
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
A&C Catalysts
HSP Distance: 2.4
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.2
Technicure® DCMU by A&C Catalysts is a 3-(3,4-dichlorophenyl)-1,1-dimethylurea, is a substituted urea. Technicure® DCMU is a dicyandiamide (DICY) accelerator. Provides good formulation shelf... view more
A&C Catalysts
HSP Distance: 3.8
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
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