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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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14 products match your search
Product Name
Supplier
Description
Non-MDA aromatic amine. Used in heat-cured adhesives. Acts as a curing agent. Possesses nonstaining properties. Offers benefits such as good handling characteristics, moderate exotherms, high... view more
33% triethylenediamine and 67% dipropylene glycol catalyst . Has low-viscosity. Used in adhesives and sealants applications... view more
Amicure® CG-1400 by Evonik is a dicyandiamide based micronized curing agent. It is a 0.5% of an inert flow control additive to inhibit clumping and improve handling. It can be used as a latent... view more
Pulverized grade of dicyandiamide. Used as a curing agent in one-component adhesives. Offers benefits such as enhanced reactivity, improved product consistency and reduced clumping... view more
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355... view more
Unpulverized grade of dicyandiamide. Used as a curing agent, in adhesives... view more
Tertiary amine salt. Used in adhesives. Acts as a cure accelerator. Offers advantages such as long room temperature pot life, fast cures at 146 °F, high glass transition temperatures and improved... view more
Amicure® PACM by Evonik is an unmodified cycloaliphatic amine based curing agent. Used in adhesives. Possesses low viscosity and excellent mechanical properties following elevated temperature cure... view more
Amicure® TEDA by Evonik is a high-purity catalyst. Designed for polyurethane applications. Amicure® TEDA consists of minimum 99.95%wt of triethylenediamine on a water-free, amine-base... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses high glass transition temperature and good one-pack shelf stability. Provides good flow properties and... view more
It acts as an accelerator for dicyandiamide cured epoxy resins. Provides longer pot life than standard substituted urea accelerators without increasing activation temperature. It cures rapidly above... view more
Substituted urea-based cure accelerator. Used in one-component paste and film adhesives. Offers advantages such as rapid cure and property development, high glass transition temperature and good... view more
Substituted urea-based cure accelerator. Used in one-pack paste and film adhesives. Possesses good flow properties. Offers benefits such as rapid cure and property development, high glass transition... view more
1-Phenyl-3, 3-dimethylurea. Acts as a substituted urea-based accelerator for dicyandiamide cured epoxy resins. It is a finely grounded version of Amicure® UR accelerator. Amicure® UR7/10 is supplied... view more
Omya Calcium Carbonates
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