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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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36 products match your search
Product Name
Supplier
Description
DIC Corporation
EPICLON® 153 by DIC Corporation is an epoxy resin based on tetrabromobisphenol A grade. Acts as an excellent flame retardant. EPICLON® 153 is used in adhesive applications... view more
DIC Corporation
EPICLON® 1650-75MPX by DIC Corporation is a flexible epoxy resin. It can be diluted in xylene/ methoxypropanol solution. Exhibits improved impact resistance. EPICLON® 1650-75MPX is used in adhesive... view more
Applications
DIC Corporation
EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives... view more
DIC Corporation
EPICLON® 850 by DIC Corporation is a standard bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 850 by DIC Corporation include concrete adhesives... view more
DIC Corporation
EPICLON® 850-CRP by DIC Corporation is a distilled bisphenol A type (BPA) epoxy resin of high purity. Available in Asian countries. Applications of EPICLON® 850-CRP by DIC Corporation include... view more
DIC Corporation
EPICLON® 850-S by DIC Corporation is a bisphenol A type (BPA) epoxy resin containing low hydrolyzable chlorine. Available in Asian countries. Applications of EPICLON® 850-S by DIC Corporation... view more
DIC Corporation
EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications... view more
Applications
DIC Corporation
EPICLON® EXA-4816 by DIC Corporation is an epoxy resin with high purity. Exhibits excellent flexible toughness, high strength and elongation rate at normal temperatures. Offers tough physical... view more
Applications
DIC Corporation
EPICLON® EXA-4850-1000 by DIC Corporation is a high performance liquid epoxy resin with ductility and flexible toughness. It combines exceptionally good bonding properties and extremely small cure... view more
Applications
DIC Corporation
EPICLON® EXA-4850-150 by DIC Corporation is a high performance liquid epoxy resin with flexible toughness and ductility. It improves hard and brittle properties. It combines exceptionally good... view more
Applications
DIC Corporation
EPICLON® HP-4032D by DIC Corporation is a high performance naphthalene based epoxy resin. It is a distilled product. Designed for liquid encapsulant applications. EPICLON® HP-4032D offers ductility... view more
Applications
DIC Corporation
EPICLON® HP-4700 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4700 combines... view more
DIC Corporation
EPICLON® HP-4770 by DIC Corporation is a high performance naphthalene based epoxy resin. Provides ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-4770 combines... view more
DIC Corporation
EPICLON® HP-5000 by DIC Corporation is a high performance epoxy resin with modified polyfuctional-type naphthalene backcone. Provides ductility and flexible toughness. It improves hard and brittle... view more
DIC Corporation
EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard... view more
DIC Corporation
EPICLON® HP-7200 by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Exhibits ductility and flexible toughness. It combines exceptionally good bonding properties and... view more
DIC Corporation
EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON®... view more
DIC Corporation
EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and... view more
DIC Corporation
EPICLON® HP-7200L by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Designed for IC encapsulant applications. EPICLON® HP-7200L exhibits ductility and flexible toughness... view more
DIC Corporation
EPICLON® HP-820 by DIC Corporation is a high performance liquid epoxy resin with alkyl phenol. Designed for use in adhesive applications. Exhibits ductility and flexible toughness. EPICLON® HP-820... view more
Applications
DIC Corporation
EPICLON® TSR-601 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-601 by DIC Corporation sed in elastomeric... view more
DIC Corporation
EPICLON® TSR-960 by DIC Corporation is a modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. EPICLON® TSR-960 by DIC Corporation is used in elastomeric... view more
DIC Corporation
Alkyl phenol mono glycidyl ether. Acts as a reactive diluent. It is a 100% reactive system. Exhibits super low viscosity and also achieves very low viscosity when mixed with liquid epoxy resins... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin containing low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete... view more
DIC Corporation
Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include concrete adhesives... view more
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications... view more
DIC Corporation
Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
Epoxy phenol novolac. It is a multi-functional resin produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance. Used in... view more
Applications
Nagase Water Soluble Epoxy Compounds
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