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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with 2-PYROL™

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
126 products match your search
Product Name
Supplier
Description
New Japan Chemical
HSP Distance: 1.4
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are... view more
Vertellus Specialties
HSP Distance: 1.6
Surfactol® 318 by Vertellus Specialties is a non-ionic surfactant based on the addition of ethylene oxide to the hydroxyl groups in castor oil. Acts as a non-ionic surfactant, defoamer, wetting and... view more
Vertellus Specialties
HSP Distance: 1.6
Surfactol® 365 by Vertellus Specialties is a PEG-40 water-soluble castor oil, designed for adhesive applications. Acts as a non-ionic surfactant, wetting agent, defoamer and anti-static agent. Shows... view more
A&C Catalysts
HSP Distance: 1.7
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
HSP Distance: 1.7
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
Ningbo Actmix Polymer
HSP Distance: 1.7
Actmix® TBzTD-70GE F140 is a 70 wt% tetrabenzylthiuram disulfide. Acts as a vulcanization accelerator. Addition of thiazoles or sulfenamides accelerators can slow down vulcanization, shorten... view more
Ningbo Actmix Polymer
HSP Distance: 1.7
Curekind® TBzTD Dust free Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 1.7
Curekind® TBzTD Granule is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 1.7
Curekind® TBzTD Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
HSP Distance: 1.7
SIPOMER® WAM II by Solvay is a methacrylic monomer based on 46-50% methacrylamidoethyl ethylene urea (MAEEU). It promotes adhesion of polymer resins to metal, glass, concrete and other inorganic... view more
HSP Distance: 2.0
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 2.0
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 2.0
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 2.0
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
HSP Distance: 2.0
N-Acryloxysuccinimide. It is a white solid. It complies with FDA 40 CFR 720.36 regulation... view more
HSP Distance: 2.1
TITANOS TGIC JF-77 by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77 is suitable for adhesives applications... view more
Applications
HSP Distance: 2.1
TITANOS TGIC JF-77B by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77B is suitable for adhesives applications... view more
Applications
HSP Distance: 2.1
TITANOS TGIC JF-77H by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent and it offers high purity. TITANOS TGIC JF-77H is suitable for adhesives applications... view more
Applications
HSP Distance: 2.1
TITANOS TGIC JF-78 by Titanos is an anti-allergic, triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-78 is suitable for adhesives applications... view more
Applications
Lanxess
HSP Distance: 2.3
Uniplex 214 by Lanxess is a stable n-butylbenzenesulfonamide-based plasticizer for polyamides especially nylon, in adhesives for nonwoven interlinings. Possesses good heat stability to 80°C and... view more
HSP Distance: 2.3
Acticide® M10S by Thor is a 2-Methyl-4-isothiazolin-3-one (9.5%) grade. Acts as an industrial microbiocide and algicide & fungicide. It controls the growth of bacteria and fungi. Used in water... view more
Vink Chemicals
HSP Distance: 2.3
Vinkocide MIT 10 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Vink Chemicals
HSP Distance: 2.3
Vinkocide MIT 50 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
A&C Catalysts
HSP Distance: 2.4
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 2.4
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 2.4
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 2.4
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
HSP Distance: 2.4
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
HSP Distance: 2.5
Kowa THPA is a tetra hydro phthalic anhydride monomer. Used in adhesives... view more
Nan Ya Plastics
HSP Distance: 2.5
Tetra hydro-phthalic anhydride. Acts as a curing agent. It is produced by diels-alder condensation with maleic anhydride and 1, 3-butadiene. It improves the quality of resins and their reactivity in... view more
Shanghai Deborn
HSP Distance: 2.5
THPA by Shanghai Deborn is an epoxy resin-based curing agent. It is available in white-colored flake form. It is suitable for adhesives. THPA is partly soluble in petroleum ether and miscible in... view more
IGM Resins
HSP Distance: 2.6
Esacure KIP 160 by IGM Resins is a difunctional alpha hydroxy ketone based type I photoinitiator. It exhibits excellent reactivity. Provides through and surface cure. Esacure KIP 160 is designed for... view more
HSP Distance: 2.6
Kowa MTHPA is a methyl tetra hydro phthalic anhydride monomer. Used in adhesives... view more
HSP Distance: 2.6
4-Methacryloxyethyl trimellitic anhydride is a reactive monomer. Can be used as an adhesion promoter... view more
HSP Distance: 2.6
N-(2-Ethoxyphenyl)-N'-(2-ethylphenyl)oxamide. It acts as UV absorber. It is low molecular weight, slightly yellowish powder. It shows performance synergy with other light stabilizers such as... view more
HSP Distance: 2.6
Methyl terephthalaldehydate. Used in production of polymers and chemical intermediates... view more
TinToll (PCC Group)
HSP Distance: 2.6
PowerSorb™ 312 by TinToll (PCC Group) is a light stabilizer of oxanilide class. It is a N-(2-ethoxyphenyl)-N'-(2-ethylphenyl) oxamide. It offers less discoloring even in alkaline environment and in... view more
HSP Distance: 2.7
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 2.7
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 2.7
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
HSP Distance: 2.7
Solbrol® ICG by Lanxess is an in-can preservative in adhesives and animal, plant and synthetic glues. It is 3-iodo-2-propynylbutylcarbamate (IPBC). It offers efficiency against mold fungi, yeast and... view more
Applications
HSP Distance: 2.7
Omacide™ IPBC 100 Fungicide by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. It is a broad spectrum antimicrobial additive, preventing dry film fungal growth such as yeast and molds... view more
HSP Distance: 2.7
Omacide™ IPBC 20 by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants... view more
HSP Distance: 2.7
Omacide™ IPBC 30 by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. Broad spectrum fungicide additive. Prevents dry film fungal growth. Irreversible yellowing of the dry film may occur soon... view more
HSP Distance: 2.7
Omacide™ IPBC 30 DPG by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is designed for adhesives, caulks and... view more
HSP Distance: 2.7
Omacide™ IPBC 40 by Lonza is iodopropynyl butyl carbamate(IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants. Omacide™... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.8
Tris [2-(3-mercaptopropionyloxy) ethyl] isocyanurate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TEMPIC is solvent free and exhibits high reactivity, low... view more
HSP Distance: 2.8
Kowa TEMPIC is a tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate. It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.9
Kowa DPMP is a dipentaerythritol-hexakis-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.9
Kowa NMMA is N-methoxymethyl acrylamide. Used in adhesives... view more
Lemman Laboratories International
HSP Distance: 2.9
Tris(2-chloroethyl) phosphate. Acts as a flame retardant. It exists as colorless or light yellow transparent liquid. Used in flexible and rigid polyurethane and polyisocyanurate foam, unsaturated... view more
HSP Distance: 2.9
General purpose chlorinated phosphate ester. Acts as a flame retardant... view more
Zhejiang Wansheng
HSP Distance: 2.9
Low Odor Tris(1-chloro-2-propyl) phosphate. Acts as a general purpose chlorinated phosphate ester flame retardant. Exhibits low odor, high heat stability, excellent hydrolysis stability, low... view more
HSP Distance: 3.0
Kowa HHPA is a hexa hydro phthalic anhydride monomer. Used in adhesives... view more
Nan Ya Plastics
HSP Distance: 3.0
Hexa hydro-phthalic anhydride. Acts as a curing agent. It improves the quality of resins and their reactivity in the presence of air & their light fastness. It is compatible with epoxy resins. Used... view more
Shanghai Deborn
HSP Distance: 3.0
HHPA by Shanghai Deborn is hexahydrophthalic anhydride-based curing agent. It is available in white-colored solid form. It finds application in adhesives. HHPA is partly soluble in petroleum ether... view more
HSP Distance: 3.1
N,N’-Hexamethylenebisacrylamide. It occurs in form of white powder. It is a crosslinking amide monomer and possesses greater hydrolytic stability than corresponding esters. It complies with FDA 40... view more
A&C Catalysts
HSP Distance: 3.2
Technicure® DCMU by A&C Catalysts is a 3-(3,4-dichlorophenyl)-1,1-dimethylurea, is a substituted urea. Technicure® DCMU is a dicyandiamide (DICY) accelerator. Provides good formulation shelf... view more
HSP Distance: 3.2
Lapox® ARTF-35 by Atul is a low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition temperature, outstanding heat... view more
Applications
HSP Distance: 3.2
Lapox® ARTF-36 by Atul is a high purity, distilled, low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition... view more
Applications
HSP Distance: 3.2
Dazomet Technical by BASF is a biocide, 3,5-dimethyl-2H-1,3,5-thiadiazinane-2-thione. Dazomet Technical is used in adhesives... view more
Applications
HSP Distance: 3.2
Myacide™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable. This... view more
HSP Distance: 3.2
Protectol™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione which is used as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable... view more
HSP Distance: 3.2
Araldite® MY 0500 by Huntsman is a low viscosity, high functionality amine based epoxy resin. It is an aero-grade. It cures very rapidly to produce products having exceptionally high heat deflection... view more
Applications
HSP Distance: 3.2
Araldite® MY 0510 is a triglycidylized para-amino-phenol by Huntsman. It is a very low viscosity, high functionality amine-based, high purity resin with relatively good storage stability. It cures... view more
HSP Distance: 3.2
Kowa NMMM is N-methoxymethyl methacrylamide. Used in adhesives... view more
Bimax
HSP Distance: 3.3
N-Acryloyl sarcosine methyl ester. It reacts with a full range of acrylates & methacrylates and has high refractive index. It is used for the production of resins for solid phase peptide synthesis... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.3
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.3
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP is based on mercaptocarboxylic acids. It is solvent free and exhibits high reactivity, low viscosity as... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.3
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP l.o. is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity, low... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.3
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP sl is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity as well... view more
HSP Distance: 3.3
Kowa PEMP is a pentaerythritol tetrakis(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Lemman Laboratories International
HSP Distance: 3.3
Tris(2-chloroethyl) phosphate. Acts as a low viscosity and low acidic flame retardant. It exists as colorless to light yellow viscous liquid. Used in flexible and rigid polyurethane and... view more
HSP Distance: 3.3
N-methyl-2-pyrrolidone (NMP) by LyondellBasell is a powerful solvent. It offers exceptional performance, broad solubility for resins, high chemical and thermal stability. Due to its high solvency... view more
Everkem
HSP Distance: 3.4
AP 400-DIOL by Everkem is a tetrabromophthalic diol grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the registration... view more
Applications
IGM Resins
HSP Distance: 3.4
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
HSP Distance: 3.4
Kowa NEMA is a N-ethoxymethyl acrylamide monomer. Used in adhesives... view more
Double Bond Chemical
HSP Distance: 3.5
1,6-Hexamethylene bis(N,N-dimethyl semicarbazide). Acts as an antioxidant. It is a white crystalline powder. Used in adhesives... view more
HSP Distance: 3.5
CUREZOL® 2E4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. CUREZOL® 2E4MZ is recommended for structural adhesives... view more
HSP Distance: 3.5
CUREZOL® 2MZ Azine by Evonik acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives. The shelf life of... view more
HSP Distance: 3.5
CUREZOL® 2P4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3 years. Recommended... view more
HSP Distance: 3.5
CUREZOL® C17Z by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures. CUREZOL® C17Z is... view more
HSP Distance: 3.5
Kohshylmer® ACMO™ (Acryloyl morpholine) by KJ Chemicals is a low viscosity adhesive raw material for UV curable applications. Provides low skin irritation with 0.5 primary irritation index. It has... view more
Polysciences
HSP Distance: 3.5
N-Acryloylmorpholine is a chemically stable acryl-based liquid monomer. It is suitable for preparation of water-soluble (neutral substituted acrylamide) polymers. It complies with TSCA regulation... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.6
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
Janssen (Johnson & Johnson Group)
HSP Distance: 3.6
Metal-free, halogen-free, non volatile bethoxazin. Used as a fungicide and an algicide for stains, moulds and algae control in adhesives and sealants. Offers broadspectrum mouldicide and algaecide... view more
Lanxess
HSP Distance: 3.6
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
Advanced Polymer
HSP Distance: 3.7
VOC free, low toxicity, oxazoline resin emulsion. Used as an effective waterborne crosslinking agent for polymer emulsions containing carboxyl functionality. Provides very good adhesion to... view more
Advanced Polymer
HSP Distance: 3.7
VOC free, low toxicity, oxazoline resin emulsion. Used as an effective waterborne crosslinking agent for polymer emulsions containing carboxyl functionality. Provides very good adhesion to... view more
Advanced Polymer
HSP Distance: 3.7
Oxazoline functional polymer solution. Used as an effective waterborne crosslinking agent for polymer emulsions containing carboxyl functionality. Provides very good adhesion to polyester... view more
HSP Distance: 3.7
Tris (4-aminophenyl) thiophosphate . It is a multifunctional monomer specifically developed for PU. Imparts inherent flame retardency due to presence of P, N and S elements... view more
Ningbo Actmix Polymer
HSP Distance: 3.7
Actmix® OTOS-80GE F200 is a morpholin-4-yl morpholine-4-carbodithioate. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is an activator which has... view more
HSP Distance: 3.7
N-Benzylmethacrylamide is a chemically stable solid acrylic monomer. It is used to make polymers of high (1.5965) refractive index. It complies with FDA 40 CFR 720.36 regulation... view more
Wilshire Technologies (Evonik)
HSP Distance: 3.7
Bisphenol S Diglycidyl Ether is a bisphenol monomer. Used in adhesives... view more
A&C Catalysts
HSP Distance: 3.8
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
Albemarle
HSP Distance: 3.8
2,4,6-trimethyldiphenylphosphineoxide. Used in adhesives. Offers the advantage of good shelf stability, fast and thorough cure... view more
HSP Distance: 3.8
Darocur® TPO by BASF is 2,4,6-Trimethylbenzoyl-diphenyl-phosphineoxide functions as a photoinitiator. Used in reactive and radiation curing adhesives for wood, metal, plastic, paper and optical... view more
Chitec Technology
HSP Distance: 3.8
Chiguard® 5228WB by Chitec Technology is a nano-grade, neutral benzotriazole. Acts as a water-borne UV absorber. It is more resistant to freeze-thaw cycles. Possesses the advantage of high storage... view more
HSP Distance: 3.8
Benzotriazole. Used in adhesives and sealants. Acts as a UV absorber. Offers benefits such as easy incorporation, broad compatibility, good solubility in very most binders and very good efficiency... view more
Dalian Richfortune Chemicals
HSP Distance: 3.8
Photoinitiator TPO by Dalian Richfortune Chemicals is a diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide grade. It acts as a photoinitiator. It exhibits low volatility. It is suitable for UV curable... view more
Eastman
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