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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with AEP

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
376 products match your search
Product Name
Supplier
Description
HSP Distance: 0.6
Kowa M-600A is a 2-hydroxy-3-phenoxypropyl acrylate. It is a mono-functional monomer... view more
Kyoeisha Chemical
HSP Distance: 0.6
2-Hydroxy-3-phenoxy propyl acrylate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 0.6
NAM-128H by Nagase Specialty Materials is a 2-Hydroxy 3-phenoxy propyl acrylate. Offers good flexibility, good adhesion, fast cure speed and has low odor. It is registered in TSCA... view more
Nagase Specialty Materials
HSP Distance: 0.6
NAM-702A by Nagase Specialty Materials is a 2-Hydroxy 3-phenoxy propyl acrylate. Offers good flexibility and good adhesion. It is registered in TSCA... view more
Nagase Specialty Materials
HSP Distance: 0.6
NAM-M600A by Nagase Specialty Materials is a 2-Hydroxy 3-phenoxy propyl acrylate. Offers good flexibility and good adhesion. It is registered in TSCA... view more
HSP Distance: 1.0
DOWANOL™ PPh Glycol Ether by Dow is a low odor, slow-evaporating, very hydrophobic glycol ether. It is used as a coalescent in acrylic-based latex adhesives. DOWANOL™ PPh Glycol Ether possesses... view more
HSP Distance: 1.0
Kowa PhFG is a phenyl propylene glycol. It is a diol polyether. Used in adhesives... view more
Kowa
HSP Distance: 1.1
Kowa BzG is a benzyl glycol. It is a diol polyether. Used in adhesives... view more
HSP Distance: 1.1
Witcolink® AZ-33 by Lanxess is a cross-linker for both aqueous and non-aqueous adhesives. It promotes both physical and chemical properties. This ethylene imine based tri-functional polyaziridine is... view more
PolyAziridine Global
HSP Distance: 1.1
PZE-1000 by PolyAziridine Global is an ethylene imine based tri-functional polyaziridine grade. Acts as a crosslinking agent. Exhibits an amine-like odor and a high level of functionality that... view more
Shanghai Holdenchem
HSP Distance: 1.1
Pentaerythritol tris[3-(1-aziridinyl) propionate]. Acts as a crosslinking agent, adhesion promoter and modifier. Increases the cohesive strength and offers faster cure time. Improves the adhesion to... view more
HSP Distance: 1.3
Kowa BA-2 is an ethoxylated bisphenol A. Used in adhesives... view more
HSP Distance: 1.4
Kowa A-9300(S)(NK-Ester) is an ethoxylated isocyanuric acid triacrylate. It is a multi-functional monomer. It is an excellent high density crosslinking monomer for high temperature resistance and... view more
HSP Distance: 1.4
Tris(2-hydroxy Ethyl)isocyanurate diacrylate. It is difunctional. Offers good adhesion and abrasion resistance... view more
HSP Distance: 1.4
Tris(2-hydroxy Ethyl)isocyanurate triacrylate. It is trifunctional. Offers high reactivity, good scratch resistance, good adhesion... view more
HSP Distance: 1.4
Tris(2-hydroxy Ethyl)isocyanurate triacrylate with trimethylolpropane triacrylate. Offers good adhesion, abrasion resistance, and chemical resistance... view more
Nagase Specialty Materials
HSP Distance: 1.4
NAM- A9300 by Nagase Specialty Materials is a tris(2-acryloxyethyl) isocyanurate. Provides good abrasion resistance, good adhesion and fast cure speed. It is registered in TSCA... view more
Sartomer (Arkema Group)
HSP Distance: 1.4
SR 368 NS by Sartomer Arkema Group is a tris (2-hydroxy ethyl) isocyanurate triacrylate. It is trifunctional. It is a white, crystalline, solid triazin compound with a melt point of 52-54°C which... view more
Sartomer (Arkema Group)
HSP Distance: 1.4
SR 368D NS by Sartomer Arkema Group is a tris (2-hydroxy ethyl) isocyanurate triacrylate. It is trifunctional. It is a clear liquid triazin compound which is used in free radical polymerization... view more
Sartomer (Arkema Group)
HSP Distance: 1.4
SR368 by Sartomer (Arkema Group) is tris (2-hydroxy ethyl) isocyanurate triacrylate designed for adhesives. Offers fast cure response, adhesion, weatherability, high impact strength, low shrinkage... view more
Shin-Nakamura Chemicals
HSP Distance: 1.4
A-9300 is a tris(2-acryloxyethyl) isocyanulate. It is a multifunctional acrylate... view more
HSP Distance: 1.5
Kowa Topolene M is 3-chloro-2-hydroxy-propyl methacrylate. It is mono-functional monomer... view more
HSP Distance: 1.6
2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane is an amino monomer. It is a microcrystalline solid. Used in adhesives... view more
HSP Distance: 1.7
Heat reactive, phenolic resin. Used in the resin curing of butyl rubbers, adhesive systems and sealants. Possesses very good compatibility with chloroprene, nitrile and natural rubbers. Provides... view more
HSP Distance: 1.7
Oil soluble, heat reactive phenolic resin. Used in neoprene solvent type contact cements. Provides high heat resistance, high cohesive strength, shorter open time, and light color. Possesses... view more
HSP Distance: 1.7
Akrochem® P-133 by Akrochem is a thermoplastic, alkyl phenolic resin tackifier. Develops high tack levels in rubber compounds which are used in tire construction and mechanical goods. Provides tack... view more
HSP Distance: 1.7
One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal and vinyl plastics. Provides good... view more
Applications
HSP Distance: 1.7
Akrochem® P-28 by Akrochem is a non-staining, heat reactive alkylphenol-formaldehyde resins resin. Used in neoprene solvent cements. Increases the heat resistance of the adhesive when used with an... view more
HSP Distance: 1.7
One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal, and vinyl plastics. Provides good... view more
Applications
HSP Distance: 1.7
Finely pulverized thermosetting phenolic resin of the two-step type. Used as a hardening and a reinforcing agent for nitrile, nitrile-SBR blends, and polybutadiene polymers. Possesses medium flow... view more
HSP Distance: 1.7
Thermoplastic plenolic novolac resin. Compatible in nitrile rubber. Possesses better compatibility and dispersibility with NBR when a cashew nut oil is added. Recommended for use where scorching or... view more
Arakawa Chemical
HSP Distance: 1.7
Pure phenolic resin. Used as a tackifier in NBR adhesives. Provides addition of hardness... view more
Arakawa Chemical
HSP Distance: 1.7
Pure phenolic resin. Used as a tackifier in IC sealing. Provides very good electronic characteristics under high temperature and high moisture conditions... view more
Applications
Arakawa Chemical
HSP Distance: 1.7
Pure phenolic resin. Used as a tackifier in IC sealing. Provides very good electronic characteristics under high temperature and high moisture conditions... view more
Applications
LANXESS
HSP Distance: 1.7
Solbrol® P by Lanxess is paraben-n-propylester-based preservative. Solbrol® P is used in the manufacture of glues and adhesives... view more
Applications
HSP Distance: 1.7
Solbrol® P Sodium Salt by Lanxess is used as a preservative in the manufacturing of glues and adhesives. Solbrol® P Sodium Salt is a paraben-n-propylester sodium salt... view more
Ningbo Actmix Polymer
HSP Distance: 1.7
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
Shanghai Xin Hua
HSP Distance: 1.7
Phenol formaldehyde resin. Used in adhesives... view more
Applications
Shanghai Xin Hua
HSP Distance: 1.7
Phenol formaldehyde resin. Used in adhesives... view more
Applications
SHOWA DENKO
HSP Distance: 1.8
Pentaerythritol tetrakis. It acts as a curing agent. Improves curing speed, sensitivity and reactivity, which leads to a reduction in the amount of energy necessary for production and processing... view more
HSP Distance: 1.8
Methacroyloxyethyl maleate (HEMA maleate). It is a carboxylic acid-containing methacrylate that can function as an alternative to PMDM. Used in anaerobic adhesive applications. Complies with TSCA... view more
Huntsman
HSP Distance: 1.8
Aradur® 1167 by Huntsman is a latent modified phenolic accelerator. Exhibits low dust powder and softening temperature. Suitable for heat curing epoxy systems. Provides good glass transition... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.9
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Wilshire Technologies (Evonik)
HSP Distance: 1.9
(1R,2R,3S,5R)-(-)-Pinanediol is a diol monomer. Used in adhesives... view more
Wilshire Technologies (Evonik)
HSP Distance: 1.9
(1S,2S,3R,5S)-(+)-Pinanediol is a diol monomer. Used in adhesives... view more
Wilshire Technologies (Evonik)
HSP Distance: 1.9
1,3-Adamantanediol is a diol monomer. Used in adhesives... view more
HSP Distance: 2.0
Kowa BA-P2 is a propoxylated bisphenol A. Used in adhesives... view more
HSP Distance: 2.1
AEROTHANE MM by Dow is used as a solvent in adhesives. AEROTHANE MM possesses non-flammable and volatile properties... view more
Applications
HSP Distance: 2.1
Methylene Chloride Technical E is used as a solvent in adhesives. Methylene Chloride Technical E offers high purity, high quality, non-flammability and volatility... view more
Applications
HSP Distance: 2.1
Methylene Chloride Technical Grade by Dow is used as a solvent in adhesives. Methylene Chloride Technical Grade possesses non-flammability and volatility... view more
Applications
HSP Distance: 2.1
Methylene Chloride™ Technical Grade Cyclohexane Inhibited by Dow is a clear, colorless, volatile liquid, chlorinated solvent. It contains cyclohexane for applications sensitive to amylene. Methylene... view more
Applications
HSP Distance: 2.1
2-Hydroxyethyl methacrylate/ succinate (methacryloyloxyethyl succinate). It is a yellow to milky white liquid with mild pleasant odor. Offers reactivity of succinic acid along with the adhesive... view more
Kowa
HSP Distance: 2.1
Kowa SA is a β-methacryloyl oxyethyl hydrogen succinate monomer... view more
Kyoeisha Chemical
HSP Distance: 2.1
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Kyoeisha Chemical
HSP Distance: 2.1
2-Methacryloyloxyethyl succinic acid. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 2.1
NAM- HOAMPE by Nagase Specialty Materials is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
Shin-Nakamura Chemicals
HSP Distance: 2.1
2-Methacryloyloxyethyl succinate. It is a monofunctional methacrylate... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.1
3-Ethyl-3-hydroxymethyloxetane is an epoxidized monomer. It is a clear and colorless liquid. Used in adhesives... view more
HSP Distance: 2.2
2-Hydroxy-2-methyl-1-phenyl-1-propane-one. Used in adhesives. Offers non-yellowing properties and good shelf stability... view more
HSP Distance: 2.2
Irgacure® 1173 (Old name: Darocur® 1173) by BASF is a photoinitiator composed of 2-Hydroxy-2-methyl-1-phenyl-propan-1-one grade. Used in reactive and radiation curing adhesives. Irgacure® 1173... view more
HSP Distance: 2.2
Loxanol® PL 5031 (Old Name: Plastilit 3431) by BASF is a plasticizer for resins and aqueous polymer dispersions. It is used in tackifying additives for dispersion adhesives such as flooring... view more
HSP Distance: 2.2
Protectol™ PE by BASF is a phenoxyethanol. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. Protectol™ PE is used in water-based adhesives... view more
HSP Distance: 2.2
Protectol™ PE S by BASF is a phenoxyethanol. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. Protectol™ PE S is used in water based adhesives... view more
Bimax
HSP Distance: 2.2
Dimethyl maleate. It is a clear liquid monomer. Improves hardness & toughness of polymer films and anti-blocking properties of copolymers of vinyl acetate. Used in internal modifier to increase the... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.2
Trimethylolpropane tri (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMP is solvent free and exhibits high reactivity, low viscosity as... view more
HSP Distance: 2.2
DALPAD A by Dow is a slow-evaporating glycol ether-based coalescing agent. This low odor, hydrophilic additive is used in latex adhesives. DALPAD A exhibits high polymer solvency... view more
Applications
HSP Distance: 2.2
DOWANOL™ EPh Glycol Ether by Dow is a low odor, aromatic ethylene glycol phenyl ether with slow evaporation. It possesses high polymer solvency. DOWANOL™ EPh Glycol Ether is used in latex adhesives... view more
Applications
HSP Distance: 2.2
Bis (2-methacryloyloxyethyl) pyromellitate [pyromellitic dimethacrylate ]. Possesses the ability to bond various substrates when used alone or in conjunction with our sodium or magnesium (NTG-GMA)... view more
IGM Resins
HSP Distance: 2.2
Esacure KL 200 by IGM Resins is 2-hydroxy-2-methyl-1-phenyl-1-propanone based photoinitiator. It provides high reactivity and low yellowing properties. It is used for photopolymerization of UV... view more
IGM Resins
HSP Distance: 2.2
Omnirad 1173 (Old name: Irgacure 1173) by IGM Resins is a highly efficient, low yellwoing type I photoinitiator. It provides surface-, through-, LED and high speed cure. Omnirad 1173 is used to... view more
IGM Resins
HSP Distance: 2.2
Omnirad 73 by IGM Resins acts as a free-radical type I photoinitiator. It is designed for UV radiation curing system. It provides through-, surface- and LED cure. Omnirad 73 is suitable for clear... view more
HSP Distance: 2.2
Kowa DPMP is a trimethylolpropane-tris-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Kyoeisha Chemical
HSP Distance: 2.2
2-Acryloyloxy ethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
HSP Distance: 2.2
Greatcure 1173 by Lanxess is a highly efficient photo-initiator in UV-curable systems. Greatcure 1173 is used in adhesives... view more
HSP Distance: 2.2
Phenoxyethanol by Lanxess is used as a crosslinking agent. It is effective against gram positive and gram negative bacteria and fungi. Phenoxyethanol complies with FDA 21 CFR 175.105 for indirect... view more
Applications
LANXESS
HSP Distance: 2.2
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
Lambson (Sartomer)
HSP Distance: 2.2
SpeedCure 73 by Lambson (Sartomer) is a 2-hydroxy-2-methyl-1-phenylpropanone. Acts as a highly efficient, widely used, Type I photoinitiator. Radicals are formed by an α cleavage mechanism and as... view more
Applications
HSP Distance: 2.2
Photoinitiator used for the photopolymerization of UV Curable systems based on acrylic unsaturated oligomers and monomers. Very good compatibility with acrylate chemistries, exhibits low odor in... view more
Nagase Specialty Materials
HSP Distance: 2.2
NAM- HOAMPL by Nagase Specialty Materials is a 2-acryloyloxy ethyl phthalate. Offers good adhesion. It is registered in TSCA... view more
Ningbo Actmix Polymer
HSP Distance: 2.2
Actmix® HEXA-80GE F500 is a hexamethylenetetramine. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is a weak alkaline accelerator for slow... view more
Runtec Chemical
HSP Distance: 2.2
1-Hydroxy-2-methylpheny-propane-1-one. Acts as a photoinitiator. It is a colorless or slightly yellow liquid with 164.2 molecular weight... view more
Applications
Suny Chem
HSP Distance: 2.2
Sunitor 1173 by Suny Chem is a 2-hydroxy-2-methyl-1-phenyl propanone grade. Sunitor 1173 is used in adhesives... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 2.4
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
IGM Resins
HSP Distance: 2.4
Photomer® 4703 by IGM Resins is a proprietary UV/EB curable monoacrylate with low viscosity. It acts as an adhesion promoter. It offers good adhesion, low viscosity, reactivity and chemical... view more
Kyoeisha Chemical
HSP Distance: 2.4
2-Acryloyloxy ethyl succunate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 2.4
NAM-HOAMS by Nagase Specialty Materials is a 2-acryloyloxy ethyl succinate. Offers good adhesion. It is registered in TSCA... view more
Nagase Specialty Materials
HSP Distance: 2.4
NAM- SA by Nagase Specialty Materials is a stearyl acrylate. Offers good adhesion. It is registered in TSCA... view more
Shin-Nakamura Chemicals
HSP Distance: 2.4
2-Acryloyloxyethyl succinate. It is a monofunctional acrylate... view more
Albemarle
HSP Distance: 2.5
Amine curing agent for polyurethanes and epoxies. Can be used as a chain extender for polyurethane and polyurea elastomers and as an antioxidant for elastomers, lubricants and industrial oils... view more
HSP Distance: 2.5
Low-color aromatic amine curing agent for polyurethanes and epoxies. Can be used as a chain extender for polyurethane and polyurea elastomers and as an antioxidant for elastomers, lubricants and... view more
Bimax
HSP Distance: 2.5
Monobutyl maleate. Provides a carboxylic acid functionality with maleate unsaturation, plasticizing effect and promotes improved polymer adhesion. It can be copolymerized with a variety of vinyl and... view more
HSP Distance: 2.5
Methacroyloxyethyl phthalate (HEMA phthalate). It is an aromatic, carboxylic acid-containing monomer which lends itself to many adhesive applications where functionality of a methacrylate is needed... view more
HSP Distance: 2.5
Jeffamine® EDR-148 Amine by Huntsman is a very reactive polyetheramine. Used as an epoxy curing agent. Imparts flexibility and toughness. Can be used at room temperature or at elevated temperatures... view more
HSP Distance: 2.5
Kowa HBPA is a hydrogenated bisphenol A. Used in adhesives... view more
Kowa
HSP Distance: 2.5
Kowa MPM is a methyl-3-mercaptopropionate. It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.5
Lonzacure® DETDA 80 by Lonza is a diethyltoluenediamine grade. Used as a chain extender for elastomeric polyurethanes and as a curing agent for epoxides. Provides low viscosity, hydrolytic stability... view more
Shin-Nakamura Chemicals
HSP Distance: 2.5
β-Methacryloyloxyethyl hydrogen phthalate. It is a monofunctional methacrylate... view more
HSP Distance: 2.6
4-Hydroxybutyl Acrylate (4-HBA) by BASF is an acrylate monomer. Exhibits scratch resistance, weatherability and has low VOC. Copolymers of 4-Hydroxybutyl acrylate can be prepared with acrylic acid... view more
HSP Distance: 2.6
Butanediol monoacrylate (BDMA or 4-HBA) by BASF is 4-hydroxybutyl acrylate (4-HBA) which forms homopolymers and copolymers. Copolymers of 4-Hydroxybutyl Acrylate (4-HBA) can be prepared with acrylic... view more
HSP Distance: 2.6
Disponil® SUS IC 875 by BASF is an anionic di-2-ethylhexyl sulphosuccinate, sodium salt. Used as emulsifier for the emulsion polymerization of practically all types of monomers used in adhesives... view more
Applications
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