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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Myacide™ DZ

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
67 products match your search
Product Name
Supplier
Description
HSP Distance: 1.0
CUREZOL® 2E4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. CUREZOL® 2E4MZ is recommended for structural adhesives... view more
HSP Distance: 1.0
CUREZOL® 2MZ Azine by Evonik acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives. The shelf life of... view more
HSP Distance: 1.0
CUREZOL® 2P4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3 years. Recommended... view more
HSP Distance: 1.0
CUREZOL® C17Z by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures. CUREZOL® C17Z is... view more
Ningbo Actmix Polymer
HSP Distance: 1.4
Actmix® OTOS-80GE F200 is a morpholin-4-yl morpholine-4-carbodithioate. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is an activator which has... view more
Ningbo Actmix Polymer
HSP Distance: 1.6
Actmix® MTT-80GE F500 is a 3-methylthiazolidine-2-thione. Acts as an accelerator. It is a thiazole heterocycles chemical, contained active sulfur atoms, can be crosslinked with a polymer containing... view more
Everkem
HSP Distance: 1.9
AP 400-DIOL by Everkem is a tetrabromophthalic diol grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the registration... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 2.1
Tris [2-(3-mercaptopropionyloxy) ethyl] isocyanurate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TEMPIC is solvent free and exhibits high reactivity, low... view more
HSP Distance: 2.1
Kowa TEMPIC is a tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate. It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.1
TITANOS TGIC JF-77 by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77 is suitable for adhesives applications... view more
Applications
HSP Distance: 2.1
TITANOS TGIC JF-77B by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77B is suitable for adhesives applications... view more
Applications
HSP Distance: 2.1
TITANOS TGIC JF-77H by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent and it offers high purity. TITANOS TGIC JF-77H is suitable for adhesives applications... view more
Applications
HSP Distance: 2.1
TITANOS TGIC JF-78 by Titanos is an anti-allergic, triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-78 is suitable for adhesives applications... view more
Applications
Double Bond Chemical
HSP Distance: 2.2
1,1,1’,1’-Tetramethyl-4,4'-(methylene-di-p-phenylene) di-semicarbazide. Acts as an UV absorber. Used in adhesives... view more
IGM Resins
HSP Distance: 2.3
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
HSP Distance: 2.7
SIPOMER® WAM II by Solvay is a methacrylic monomer based on 46-50% methacrylamidoethyl ethylene urea (MAEEU). It promotes adhesion of polymer resins to metal, glass, concrete and other inorganic... view more
A&C Catalysts
HSP Distance: 2.9
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
HSP Distance: 2.9
Lapox® ASH-11 by Atul is a white to brownish, odorless, non-volatile crystalline powder. It is used as curing agent with epoxy resins specially to obtain faster reactivity than 4,4’-DDS. Exhibits... view more
Applications
HSP Distance: 2.9
Lapox® ASH-11 MIC by Atul is an aromatic amine curing agent with fast reactivity than 4,4’-DDS. It is off-white to yellowish-brown, odorless, non-volatile micronised powder suitable to disperse... view more
Applications
HSP Distance: 2.9
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
Gabriel Chemical
HSP Distance: 2.9
It is a 3, 3- diamino dephenyl sulfone. Acts as curing agents. It provides excellent thermal stability, outstanding chemical resistance, and excellent high temperature properties. Gabepro Gps-331 is... view more
HSP Distance: 2.9
3,3'-Diaminodiphenylsulfone by Mitsui Chemicals is a curing agent. SO2 offers better performance in bonding carbon-fibers. Used for a heat-resistant epoxy resin. It offers flexibility... view more
HSP Distance: 2.9
3, 3’-Diaminodiphenylsulfone by Mitsui Chemicals is an aromatic sulfone diamine. It acts as a curing agent for epoxy resin. Offers excellent heat resistance and flexibility. SO2 shows better... view more
Ningbo Actmix Polymer
HSP Distance: 2.9
Actmix® TBzTD-70GE F140 is a 70 wt% tetrabenzylthiuram disulfide. Acts as a vulcanization accelerator. Addition of thiazoles or sulfenamides accelerators can slow down vulcanization, shorten... view more
Ningbo Actmix Polymer
HSP Distance: 2.9
Curekind® TBzTD Dust free Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 2.9
Curekind® TBzTD Granule is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 2.9
Curekind® TBzTD Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Everkem
HSP Distance: 3.0
AP 729 by Everkem is a tris(2,3-dibromoisopropyil) isocianurate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
A&C Catalysts
HSP Distance: 3.1
4,4’ Methylene bis (phenyl dimethyl urea). It acts as a curing agent and an accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It... view more
A&C Catalysts
HSP Distance: 3.1
Technicure® MDU-11M by A&C Catalysts is a [4,4’- (methylene bis (phenyl dimethyl)] urea, is a substituted urea. Technicure® MDU-11M is a dicyandiamide (DICY) accelerator. Provides good formulation... view more
HSP Distance: 3.1
ZOLDINE® ZT-55 by Dow is a low viscosity 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane used as crosslinking and curing agent. Imparts great flexibility and elongation characteristics, and... view more
HSP Distance: 3.1
ZOLDINE® ZT-65 by Dow is a low viscosity, formaldehyde-free oxazolidine, 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane. Used as a curing agent for phenolic/resorcinol adhesive resins and for... view more
HSP Distance: 3.1
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
HSP Distance: 3.1
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of... view more
HSP Distance: 3.1
N-(2-Hydroxypropyl)methacrylamide. It is a hydrolytically stable hydrophilic monomer in form of white solid. It complies with FDA 40 CFR 720.36 regulation... view more
Ashland Specialty Chemical
HSP Distance: 3.2
2-PYROL™ by Ashland Specialty Chemical is a hygroscopic, biodegradable and reactive 2-pyrrolidone. Offers low vapor pressure, high flash point, high dipole moment, ready complex formation and... view more
Applications
Ashland Specialty Chemical
HSP Distance: 3.2
2-PYROL™ Purified by Ashland Specialty Chemical is 2-pyrrolidone. It acts as a coalescent and plasticizer for acrylic resins in adhesives. It is a purified, hygroscopic, biodegradable and reactive... view more
HSP Distance: 3.2
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 3.2
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are... view more
New Japan Chemical
HSP Distance: 3.2
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 3.2
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 3.2
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
HSP Distance: 3.2
Acticide® M10S by Thor is a 2-Methyl-4-isothiazolin-3-one (9.5%) grade. Acts as an industrial microbiocide and algicide & fungicide. It controls the growth of bacteria and fungi. Used in water... view more
Vink Chemicals
HSP Distance: 3.2
Vinkocide MIT 10 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Vink Chemicals
HSP Distance: 3.2
Vinkocide MIT 50 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
A&C Catalysts
HSP Distance: 3.4
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.4
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 3.4
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 3.4
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
HSP Distance: 3.4
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.5
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
Double Bond Chemical
HSP Distance: 3.5
1,6-Hexamethylene bis(N,N-dimethyl semicarbazide). Acts as an antioxidant. It is a white crystalline powder. Used in adhesives... view more
HSP Distance: 3.6
Tris (4-aminophenyl) thiophosphate . It is a multifunctional monomer specifically developed for PU. Imparts inherent flame retardency due to presence of P, N and S elements... view more
A&C Catalysts
HSP Distance: 3.7
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
HSP Distance: 3.7
Lapox® ASH-10 by Atul is a white to off-white, odorless, non-volatile crystalline powder. It acts as curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix... view more
Applications
HSP Distance: 3.7
Lapox® ASH-10 FF by Atul is a curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix. It is white to off-white, odorless, non-volatile crystalline powder... view more
Applications
HSP Distance: 3.7
Lapox® ASH-10 MIC by Atul is a non-volatile micronised powder suitable to disperse uniformly in epoxy resins. It acts as curing agent. Offers slow reactivity and extended pot life of mix. Exhibits... view more
Applications
Gabriel Chemical
HSP Distance: 3.7
It is a 4, 4-diamino diphenyl sulfone. Acts as curing agent. It provides excellent thermal stability, outstanding chemical resistance, and excellent high temperature properties. Gabepro Gps-441 is... view more
HSP Distance: 3.7
Aradur® 9664-1 by Huntsman is a 4,4' diaminodiphenylsulfone grade. It is a curing agent used with Araldite® epoxy resins. Exhibits excellent thermal stability, outstanding chemical resistance and... view more
Huntsman
HSP Distance: 3.7
Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding... view more
HSP Distance: 3.7
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
HSP Distance: 3.7
4, 4'-Diaminodiphenylsulfone by Mitsui Chemicals is an aromatic sulfone diamine. SO2 offers better performance in bonding carbon-fibers. It also acts as a curing agent. The epoxy resin made from it... view more
HSP Distance: 3.7
4,4'-Diaminodiphenylsulfone by Mitsui Chemicals is used in epoxy resin as a curing agent. It provides excellent flexibility and heat resistance. SO2 offers better performance in bonding... view more
Vertellus Specialties
HSP Distance: 3.7
Surfactol® 318 by Vertellus Specialties is a non-ionic surfactant based on the addition of ethylene oxide to the hydroxyl groups in castor oil. Acts as a non-ionic surfactant, defoamer, wetting and... view more
Vertellus Specialties
HSP Distance: 3.7
Surfactol® 365 by Vertellus Specialties is a PEG-40 water-soluble castor oil, designed for adhesive applications. Acts as a non-ionic surfactant, wetting agent, defoamer and anti-static agent. Shows... view more
Ferro-Plast
HSP Distance: 3.8
FerroFlex PTSA by FerroPlast is a p-toluene sulfonamide grade. Acts as a plasticizer. FerroFlex PTSA by FerroPlast is compatible with thermosetting resins and is suitable for adhesives... view more
Applications
Lanxess
HSP Distance: 3.8
Uniplex 171 by Lanxess is a stable o, p-toluene sulfonamide-based plasticizer for polyamide, melamine, urea and phenolic resins. Imparts good gloss and wetting action improving mixing of filled... view more
Eastman
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