OK
The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
Save
Cette page a bien été ajoutée à vos favoris

Products Compatible with RIKACID HNA-100

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
153 products match your search
Product Name
Supplier
Description
A&C Catalysts
HSP Distance: 0.5
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
HSP Distance: 0.5
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
HSP Distance: 1.0
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 1.0
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.0
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.0
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
Vertellus Specialties
HSP Distance: 1.3
Surfactol® 318 by Vertellus Specialties is a non-ionic surfactant based on the addition of ethylene oxide to the hydroxyl groups in castor oil. Acts as a non-ionic surfactant, defoamer, wetting and... view more
Vertellus Specialties
HSP Distance: 1.3
Surfactol® 365 by Vertellus Specialties is a PEG-40 water-soluble castor oil, designed for adhesive applications. Acts as a non-ionic surfactant, wetting agent, defoamer and anti-static agent. Shows... view more
Ashland Specialty Chemical
HSP Distance: 1.4
2-PYROL™ by Ashland Specialty Chemical is a hygroscopic, biodegradable and reactive 2-pyrrolidone. Offers low vapor pressure, high flash point, high dipole moment, ready complex formation and... view more
Applications
Ashland Specialty Chemical
HSP Distance: 1.4
2-PYROL™ Purified by Ashland Specialty Chemical is 2-pyrrolidone. It acts as a coalescent and plasticizer for acrylic resins in adhesives. It is a purified, hygroscopic, biodegradable and reactive... view more
HSP Distance: 1.6
Kowa DPMP is a dipentaerythritol-hexakis-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
A&C Catalysts
HSP Distance: 1.7
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 1.7
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 1.7
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 1.7
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
HSP Distance: 1.7
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.0
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP is based on mercaptocarboxylic acids. It is solvent free and exhibits high reactivity, low viscosity as... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.0
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP l.o. is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity, low... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.0
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP sl is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity as well... view more
HSP Distance: 2.0
Kowa PEMP is a pentaerythritol tetrakis(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.1
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
HSP Distance: 2.1
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 2.1
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 2.1
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
HSP Distance: 2.1
Solbrol® ICG by Lanxess is an in-can preservative in adhesives and animal, plant and synthetic glues. It is 3-iodo-2-propynylbutylcarbamate (IPBC). It offers efficiency against mold fungi, yeast and... view more
Applications
HSP Distance: 2.1
Omacide™ IPBC 100 Fungicide by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. It is a broad spectrum antimicrobial additive, preventing dry film fungal growth such as yeast and molds... view more
HSP Distance: 2.1
Omacide™ IPBC 20 by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants... view more
HSP Distance: 2.1
Omacide™ IPBC 30 by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. Broad spectrum fungicide additive. Prevents dry film fungal growth. Irreversible yellowing of the dry film may occur soon... view more
HSP Distance: 2.1
Omacide™ IPBC 30 DPG by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is designed for adhesives, caulks and... view more
HSP Distance: 2.1
Omacide™ IPBC 40 by Lonza is iodopropynyl butyl carbamate(IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants. Omacide™... view more
HSP Distance: 2.1
N-Acryloxysuccinimide. It is a white solid. It complies with FDA 40 CFR 720.36 regulation... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.2
Tris [2-(3-mercaptopropionyloxy) ethyl] isocyanurate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TEMPIC is solvent free and exhibits high reactivity, low... view more
HSP Distance: 2.2
Kowa TEMPIC is a tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate. It is a sulfur-based monomer. Used in adhesives... view more
Lanxess
HSP Distance: 2.3
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
HSP Distance: 2.4
Lapox® ARTF-35 by Atul is a low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition temperature, outstanding heat... view more
Applications
HSP Distance: 2.4
Lapox® ARTF-36 by Atul is a high purity, distilled, low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 2.4
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
HSP Distance: 2.4
Tris (4-aminophenyl) thiophosphate . It is a multifunctional monomer specifically developed for PU. Imparts inherent flame retardency due to presence of P, N and S elements... view more
HSP Distance: 2.4
Araldite® MY 0500 by Huntsman is a low viscosity, high functionality amine based epoxy resin. It is an aero-grade. It cures very rapidly to produce products having exceptionally high heat deflection... view more
Applications
HSP Distance: 2.4
Araldite® MY 0510 is a triglycidylized para-amino-phenol by Huntsman. It is a very low viscosity, high functionality amine-based, high purity resin with relatively good storage stability. It cures... view more
IGM Resins
HSP Distance: 2.4
Esacure KIP 160 by IGM Resins is a difunctional alpha hydroxy ketone based type I photoinitiator. It exhibits excellent reactivity. Provides through and surface cure. Esacure KIP 160 is designed for... view more
IGM Resins
HSP Distance: 2.5
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
HSP Distance: 2.5
Acticide® M10S by Thor is a 2-Methyl-4-isothiazolin-3-one (9.5%) grade. Acts as an industrial microbiocide and algicide & fungicide. It controls the growth of bacteria and fungi. Used in water... view more
Vink Chemicals
HSP Distance: 2.5
Vinkocide MIT 10 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Vink Chemicals
HSP Distance: 2.5
Vinkocide MIT 50 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
A&C Catalysts
HSP Distance: 2.6
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
HSP Distance: 2.6
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
Ningbo Actmix Polymer
HSP Distance: 2.6
Actmix® TBzTD-70GE F140 is a 70 wt% tetrabenzylthiuram disulfide. Acts as a vulcanization accelerator. Addition of thiazoles or sulfenamides accelerators can slow down vulcanization, shorten... view more
Ningbo Actmix Polymer
HSP Distance: 2.6
Curekind® TBzTD Dust free Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 2.6
Curekind® TBzTD Granule is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 2.6
Curekind® TBzTD Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Bimax
HSP Distance: 2.7
N-Acryloyl sarcosine methyl ester. It reacts with a full range of acrylates & methacrylates and has high refractive index. It is used for the production of resins for solid phase peptide synthesis... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.7
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Everkem
HSP Distance: 2.7
AP 400-DIOL by Everkem is a tetrabromophthalic diol grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the registration... view more
Applications
Kyoeisha Chemical
HSP Distance: 2.7
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase America
HSP Distance: 2.7
NAM- HOAMPE by Nagase America is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
Lanxess
HSP Distance: 2.8
Uniplex 214 by Lanxess is a stable n-butylbenzenesulfonamide-based plasticizer for polyamides especially nylon, in adhesives for nonwoven interlinings. Possesses good heat stability to 80°C and... view more
HSP Distance: 2.8
SIPOMER® WAM II by Solvay is a methacrylic monomer based on 46-50% methacrylamidoethyl ethylene urea (MAEEU). It promotes adhesion of polymer resins to metal, glass, concrete and other inorganic... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.9
4-((6-(Acryloyloxy)hexyl)oxy)phenol is an acrylate monomer. Used in adhesives... view more
HSP Distance: 3.0
N-methyl-2-pyrrolidone (NMP) by LyondellBasell is a powerful solvent. It offers exceptional performance, broad solubility for resins, high chemical and thermal stability. Due to its high solvency... view more
HSP Distance: 3.0
4-Methacryloxyethyl trimellitic anhydride is a reactive monomer. Can be used as an adhesion promoter... view more
HSP Distance: 3.0
TITANOS TGIC JF-77 by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77 is suitable for adhesives applications... view more
Applications
HSP Distance: 3.0
TITANOS TGIC JF-77B by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77B is suitable for adhesives applications... view more
Applications
HSP Distance: 3.0
TITANOS TGIC JF-77H by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent and it offers high purity. TITANOS TGIC JF-77H is suitable for adhesives applications... view more
Applications
HSP Distance: 3.0
TITANOS TGIC JF-78 by Titanos is an anti-allergic, triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-78 is suitable for adhesives applications... view more
Applications
Lanxess
HSP Distance: 3.1
Solbrol® P by Lanxess is paraben-n-propylester-based preservative. Solbrol® P is used in the manufacture of glues and adhesives... view more
Applications
HSP Distance: 3.1
Solbrol® P Sodium Salt by Lanxess is used as a preservative in the manufacturing of glues and adhesives. Solbrol® P Sodium Salt is a paraben-n-propylester sodium salt... view more
HSP Distance: 3.2
Dazomet Technical by BASF is a biocide, 3,5-dimethyl-2H-1,3,5-thiadiazinane-2-thione. Dazomet Technical is used in adhesives... view more
Applications
HSP Distance: 3.2
Myacide™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable. This... view more
HSP Distance: 3.2
Protectol™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione which is used as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable... view more
HSP Distance: 3.2
Kowa MTHPA is a methyl tetra hydro phthalic anhydride monomer. Used in adhesives... view more
HSP Distance: 3.2
Kowa THPA is a tetra hydro phthalic anhydride monomer. Used in adhesives... view more
Nan Ya Plastics
HSP Distance: 3.2
Tetra hydro-phthalic anhydride. Acts as a curing agent. It is produced by diels-alder condensation with maleic anhydride and 1, 3-butadiene. It improves the quality of resins and their reactivity in... view more
Ningbo Actmix Polymer
HSP Distance: 3.2
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
Shanghai Deborn
HSP Distance: 3.2
THPA by Shanghai Deborn is an epoxy resin-based curing agent. It is available in white-colored flake form. It is suitable for adhesives. THPA is partly soluble in petroleum ether and miscible in... view more
HSP Distance: 3.2
Methyl terephthalaldehydate. Used in production of polymers and chemical intermediates... view more
Wilshire Technologies (Evonik)
HSP Distance: 3.2
1,3-Adamantanediol is a diol monomer. Used in adhesives... view more
A&C Catalysts
HSP Distance: 3.3
Technicure® DCMU by A&C Catalysts is a 3-(3,4-dichlorophenyl)-1,1-dimethylurea, is a substituted urea. Technicure® DCMU is a dicyandiamide (DICY) accelerator. Provides good formulation shelf... view more
HSP Distance: 3.3
Lapox® ARTF-37 by Atul is a low viscosity, unmodified trifunctional epoxy resin based on meta-aminophenol. Exhibits high glass transition temperature, outstanding heat resistance, high chemical... view more
Applications
HSP Distance: 3.3
Lapox® ARTF-38 by Atul is a high purity, distilled, low viscosity, unmodified trifunctional epoxy resin based on meta-aminophenol. Exhibits high glass transition temperature, outstanding heat... view more
Applications
HSP Distance: 3.3
Araldite® MY 0600 by Huntsman is a triglycidyl meta-aminophenol. It is a high functionality amine based epoxy resin. After curing it produces products having high stiffness, high hot–wet performance... view more
Applications
HSP Distance: 3.3
Araldite® MY 0610 by Huntsman is a trifunctional epoxy resin chemically based on triglycidyl meta-aminophenol. Exhibits medium viscosity, high purity and relatively good storage stability. Provides... view more
Huntsman
HSP Distance: 3.3
ERISYS™ RDGE by Huntsman is resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It can be used as the sole resin in an epoxy formulation or as a reactive modifier in... view more
HSP Distance: 3.3
ERISYS™ RDGE-H by Huntsman is a high purity resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It is used in conductive adhesives. It possesses compatibility with all... view more
Applications
HSP Distance: 3.3
Kowa NMMA is N-methoxymethyl acrylamide. Used in adhesives... view more
Lambiotte & Cie
HSP Distance: 3.3
1,3-dioxacyclopentane. It acts as a solvent. It is produced by reactions between alcohols and aldehydes. It shows very good profiles for health and environment with regard to toxicity and... view more
HSP Distance: 3.4
2-Hydroxy-2-methyl-1-phenyl-1-propane-one. Used in adhesives. Offers non-yellowing properties and good shelf stability... view more
HSP Distance: 3.4
Irgacure® 1173 (Old name: Darocur® 1173) by BASF is a photoinitiator composed of 2-Hydroxy-2-methyl-1-phenyl-propan-1-one grade. Used in reactive and radiation curing adhesives. Irgacure® 1173... view more
HSP Distance: 3.4
Ureido Methacrylate 25 % in Methyl Methacrylate (UMA 25 %) by BASF is an ureido funcional methacrylate monomer. It imparts properties such as crosslinking, adhesion and rheological modification to... view more
HSP Distance: 3.4
VISIOMER® MEEU 25 M by Evonik is N-(2-Methacryloyloxyethyl) ethylene urea (25% in methyl methacrylate) grade. It is used to impart wet adhesion and wet scrub resistance to polymers. VISIOMER® MEEU... view more
HSP Distance: 3.4
VISIOMER® MEEU 50 W by Evonik is an N-(2-Methacryloyloxyethyl) ethylene urea (50% in water) grade. It is designed to improve wet adhesion properties of emulsion polymers and wet scrub resistance of... view more
IGM Resins
HSP Distance: 3.4
Esacure KL 200 by IGM Resins is 2-hydroxy-2-methyl-1-phenyl-1-propanone based photoinitiator. It provides high reactivity and low yellowing properties. It is used for photopolymerization of UV... view more
IGM Resins
HSP Distance: 3.4
Omnirad 1173 (Old name: Irgacure 1173) by IGM Resins is a highly efficient, low yellwoing type I photoinitiator. It provides surface-, through-, LED and high speed cure. Omnirad 1173 is used to... view more
IGM Resins
HSP Distance: 3.4
Omnirad 127 (Old name: Irgacure 127) by IGM Resins is a free-radical type I photoinitiator. It provides LED-, through- and surface cure. Omnirad 127 applications include clear system, white system... view more
IGM Resins
HSP Distance: 3.4
Omnirad 73 by IGM Resins acts as a free-radical type I photoinitiator. It is designed for UV radiation curing system. It provides through-, surface- and LED cure. Omnirad 73 is suitable for clear... view more
HSP Distance: 3.4
Kowa NMMM is N-methoxymethyl methacrylamide. Used in adhesives... view more
Lambson (Sartomer)
HSP Distance: 3.4
SpeedCure 73 by Lambson (Sartomer) is a 2-hydroxy-2-methyl-1-phenylpropanone. Acts as a highly efficient, widely used, Type I photoinitiator. Radicals are formed by an α cleavage mechanism and as... view more
Applications
HSP Distance: 3.4
Greatcure 1173 by Lanxess is a highly efficient photo-initiator in UV-curable systems. Greatcure 1173 is used in adhesives... view more
HSP Distance: 3.4
Photoinitiator used for the photopolymerization of UV Curable systems based on acrylic unsaturated oligomers and monomers. Very good compatibility with acrylate chemistries, exhibits low odor in... view more
HSP Distance: 3.4
Methacryloyl-L-lysine. It is a white powder. Used as a building block for producing custom made polymers with pendant amine functionality. It complies with FDA 40 CFR 720.36 regulation... view more
Eastman
Back to Top