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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Kowa TEMPIC

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
91 products match your search
Product Name
Supplier
Description
IGM Resins
HSP Distance: 1.3
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.6
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
HSP Distance: 1.6
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 1.6
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.6
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.6
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
A&C Catalysts
HSP Distance: 1.8
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
A&C Catalysts
HSP Distance: 1.8
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
HSP Distance: 1.8
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
HSP Distance: 1.8
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
Everkem
HSP Distance: 1.9
AP 400-DIOL by Everkem is a tetrabromophthalic diol grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the registration... view more
Applications
HSP Distance: 2.0
N-(2-Hydroxypropyl)methacrylamide. It is a hydrolytically stable hydrophilic monomer in form of white solid. It complies with FDA 40 CFR 720.36 regulation... view more
HSP Distance: 2.1
Dazomet Technical by BASF is a biocide, 3,5-dimethyl-2H-1,3,5-thiadiazinane-2-thione. Dazomet Technical is used in adhesives... view more
Applications
HSP Distance: 2.1
Myacide™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable. This... view more
HSP Distance: 2.1
Protectol™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione which is used as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable... view more
HSP Distance: 2.2
Tris (4-aminophenyl) thiophosphate . It is a multifunctional monomer specifically developed for PU. Imparts inherent flame retardency due to presence of P, N and S elements... view more
HSP Distance: 2.2
Kowa DPMP is a dipentaerythritol-hexakis-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 2.2
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are... view more
HSP Distance: 2.3
Methacryloyl-L-lysine. It is a white powder. Used as a building block for producing custom made polymers with pendant amine functionality. It complies with FDA 40 CFR 720.36 regulation... view more
HSP Distance: 2.3
Methacryloyl-L-Lysine. Can be used as a building block for producing custom made polymers with pendant amine functionality... view more
Vertellus Specialties
HSP Distance: 2.3
Surfactol® 318 by Vertellus Specialties is a non-ionic surfactant based on the addition of ethylene oxide to the hydroxyl groups in castor oil. Acts as a non-ionic surfactant, defoamer, wetting and... view more
Vertellus Specialties
HSP Distance: 2.3
Surfactol® 365 by Vertellus Specialties is a PEG-40 water-soluble castor oil, designed for adhesive applications. Acts as a non-ionic surfactant, wetting agent, defoamer and anti-static agent. Shows... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.3
4-((6-(Acryloyloxy)hexyl)oxy)phenol is an acrylate monomer. Used in adhesives... view more
Double Bond Chemical
HSP Distance: 2.4
1,6-Hexamethylene bis(N,N-dimethyl semicarbazide). Acts as an antioxidant. It is a white crystalline powder. Used in adhesives... view more
HSP Distance: 2.5
ZOLDINE® ZT-55 by Dow is a low viscosity 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane used as crosslinking and curing agent. Imparts great flexibility and elongation characteristics, and... view more
HSP Distance: 2.5
ZOLDINE® ZT-65 by Dow is a low viscosity, formaldehyde-free oxazolidine, 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane. Used as a curing agent for phenolic/resorcinol adhesive resins and for... view more
Ashland Specialty Chemical
HSP Distance: 2.8
2-PYROL™ by Ashland Specialty Chemical is a hygroscopic, biodegradable and reactive 2-pyrrolidone. Offers low vapor pressure, high flash point, high dipole moment, ready complex formation and... view more
Applications
Ashland Specialty Chemical
HSP Distance: 2.8
2-PYROL™ Purified by Ashland Specialty Chemical is 2-pyrrolidone. It acts as a coalescent and plasticizer for acrylic resins in adhesives. It is a purified, hygroscopic, biodegradable and reactive... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.8
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP is based on mercaptocarboxylic acids. It is solvent free and exhibits high reactivity, low viscosity as... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.8
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP l.o. is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity, low... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.8
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP sl is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity as well... view more
HSP Distance: 2.8
Kowa PEMP is a pentaerythritol tetrakis(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Everkem
HSP Distance: 2.9
AP 729 by Everkem is a tris(2,3-dibromoisopropyil) isocianurate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
HSP Distance: 2.9
CUREZOL® 2E4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. CUREZOL® 2E4MZ is recommended for structural adhesives... view more
HSP Distance: 2.9
CUREZOL® 2MZ Azine by Evonik acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives. The shelf life of... view more
HSP Distance: 2.9
CUREZOL® 2P4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3 years. Recommended... view more
HSP Distance: 2.9
CUREZOL® C17Z by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures. CUREZOL® C17Z is... view more
A&C Catalysts
HSP Distance: 3.1
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.1
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 3.1
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 3.1
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
HSP Distance: 3.1
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
HSP Distance: 3.1
Bis(2-methacryloxyethyl) phosphate is a phosphorus-based monomer. Can be used as crosslinking monomer and adhesion promoter. Promotes adhesion through free phosphoric acid group... view more
HSP Distance: 3.1
SIPOMER® WAM II by Solvay is a methacrylic monomer based on 46-50% methacrylamidoethyl ethylene urea (MAEEU). It promotes adhesion of polymer resins to metal, glass, concrete and other inorganic... view more
HSP Distance: 3.1
TITANOS TGIC JF-77 by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77 is suitable for adhesives applications... view more
Applications
HSP Distance: 3.1
TITANOS TGIC JF-77B by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77B is suitable for adhesives applications... view more
Applications
HSP Distance: 3.1
TITANOS TGIC JF-77H by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent and it offers high purity. TITANOS TGIC JF-77H is suitable for adhesives applications... view more
Applications
HSP Distance: 3.1
TITANOS TGIC JF-78 by Titanos is an anti-allergic, triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-78 is suitable for adhesives applications... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 3.2
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
Lanxess
HSP Distance: 3.2
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
GFBiochemicals
HSP Distance: 3.3
Levulinic acid. It is a carbon-based compound (C5H8O3) derived directly from biomass. Its high conversion yields improve efficiency, while reducing waste and cost. Synthetic versatility allows for... view more
HSP Distance: 3.3
AQUIS - RW 3125 by Heubach is a toluidine. It is a red liquid pigment preparation based on nonionic and anionic wetting and dispersing agent. AQUIS - RW 3125 is free of binders and solvents. Offers... view more
HSP Distance: 3.3
Kowa NMMA is N-methoxymethyl acrylamide. Used in adhesives... view more
HSP Distance: 3.3
Toluidine (Pigment Red-3). It is a water-based pigment dispersion. Exhibits very good light fastness in masstone. Used for padding pastes, carpet backing, adhesive caulks and a variety of other... view more
HSP Distance: 3.3
Toluidine (Pigment Red-3). It is a resin containing, water-based pigment dispersion. Exhibits very good light fastness in masstone. Used for padding pastes, carpet backing, adhesive caulks and a... view more
Wilshire Technologies (Evonik)
HSP Distance: 3.3
1,3-Adamantanediol is a diol monomer. Used in adhesives... view more
Alfa Chemistry
HSP Distance: 3.4
Methacrylamide by Alfa Chemistry is an acid monomer. It increases the hydrophilicity in polymers. It is used in adhesive industry... view more
HSP Distance: 3.4
VISIOMER® MAAmide by Evonik is a methacrylamide grade. Itbis registered and listed within REACH... view more
Ningbo Actmix Polymer
HSP Distance: 3.4
Actmix® OTOS-80GE F200 is a morpholin-4-yl morpholine-4-carbodithioate. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is an activator which has... view more
Zeon Chemical
HSP Distance: 3.4
Hydrin® H45 by Zeon Chemical is a polyepichlorohydrin elastomer. It offers outstanding heat resistance. It provides notable low-temperature flexibility and adjustable dampening characteristics in... view more
Zeon Chemical
HSP Distance: 3.4
Hydrin® H55 by Zeon Chemical is a polyepichlorohydrin elastomer. It possesses excellent permeation resistance to helium, hydrogen, nitrogen, air, and carbon dioxide. It exhibits notable... view more
Zeon Chemical
HSP Distance: 3.4
Hydrin® H65 by Zeon Chemical is a polyepichlorohydrin elastomer. It offers notable low-temperature flexibility and adjustable dampening characteristics in addition to heat-, oil- and fuel... view more
Zeon Chemical
HSP Distance: 3.4
Hydrin® H75 by Zeon Chemical is an epichlorohydrin homopolymer. It possesses high oil, fuel-, solvent resistance and low hysteresis. It provides good heat-, ozone resistance, gas impermeability... view more
HSP Distance: 3.5
Irgamod™ 195 by BASF is calcium phosphonate used in adhesives. Acts as a high molecular weight stabilizer, (trans) esterification catalyst, property modifier and antioxidant for rubber applications... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.5
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Guangzhou Flying Dragon
HSP Distance: 3.5
Calciumdiethylbis(((3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl)methyl)phosphonate. Acts as an anti-oxidant. It is a high molecular weitht phenolic antioxidant containing phosphorus. It is a highly... view more
Applications
Keeneyes Industrial
HSP Distance: 3.5
Calcium bis (0-ethyl-3, 5-di-t-butyl-4-hydroxyphosphonate). It is derived from phosphonic acids which are organophosphorus compounds. Used as a raw material for synthetic resins... view more
Kyoeisha Chemical
HSP Distance: 3.6
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase America
HSP Distance: 3.6
NAM- HOAMPE by Nagase America is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
Ningbo Actmix Polymer
HSP Distance: 3.6
Actmix® MTT-80GE F500 is a 3-methylthiazolidine-2-thione. Acts as an accelerator. It is a thiazole heterocycles chemical, contained active sulfur atoms, can be crosslinked with a polymer containing... view more
Ningbo Actmix Polymer
HSP Distance: 3.6
Actmix® TBzTD-70GE F140 is a 70 wt% tetrabenzylthiuram disulfide. Acts as a vulcanization accelerator. Addition of thiazoles or sulfenamides accelerators can slow down vulcanization, shorten... view more
Ningbo Actmix Polymer
HSP Distance: 3.6
Curekind® TBzTD Dust free Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 3.6
Curekind® TBzTD Granule is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 3.6
Curekind® TBzTD Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
HSP Distance: 3.7
Disponil® SUS IC 680 by BASF is an anionic dihexyl sulphosuccinate, sodium salt. Provides stabilizing properties. Used as emulsifier in polymer emulsions for adhesives. Disponil® SUS IC 680 is also... view more
Applications
HSP Distance: 3.7
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 3.7
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 3.7
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
HSP Distance: 3.7
Solbrol® ICG by Lanxess is an in-can preservative in adhesives and animal, plant and synthetic glues. It is 3-iodo-2-propynylbutylcarbamate (IPBC). It offers efficiency against mold fungi, yeast and... view more
Applications
HSP Distance: 3.7
Omacide™ IPBC 100 Fungicide by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. It is a broad spectrum antimicrobial additive, preventing dry film fungal growth such as yeast and molds... view more
HSP Distance: 3.7
Omacide™ IPBC 20 by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants... view more
HSP Distance: 3.7
Omacide™ IPBC 30 by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. Broad spectrum fungicide additive. Prevents dry film fungal growth. Irreversible yellowing of the dry film may occur soon... view more
HSP Distance: 3.7
Omacide™ IPBC 30 DPG by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is designed for adhesives, caulks and... view more
HSP Distance: 3.7
Omacide™ IPBC 40 by Lonza is iodopropynyl butyl carbamate(IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants. Omacide™... view more
HSP Distance: 3.7
Acticide® M10S by Thor is a 2-Methyl-4-isothiazolin-3-one (9.5%) grade. Acts as an industrial microbiocide and algicide & fungicide. It controls the growth of bacteria and fungi. Used in water... view more
Vink Chemicals
HSP Distance: 3.7
Vinkocide MIT 10 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Vink Chemicals
HSP Distance: 3.7
Vinkocide MIT 50 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Bimax
HSP Distance: 3.8
N-Acryloyl sarcosine methyl ester. It reacts with a full range of acrylates & methacrylates and has high refractive index. It is used for the production of resins for solid phase peptide synthesis... view more
HSP Distance: 3.9
Furfuryl alcohol. Acts as an intermediate. Contact with furfuryl alcohol should be avoided because of its toxic effects. Furfuryl alcohol is very unstable when contacted with even low levels of... view more
HSP Distance: 4.0
Kowa NMMM is N-methoxymethyl methacrylamide. Used in adhesives... view more
Ningbo Actmix Polymer
HSP Distance: 4.0
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
For stronger adhesives stick to Nynas
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