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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Products Compatible with SIPOMER® WAM II

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
76 products match your search
Product Name
Supplier
Description
HSP Distance: 0.9
TITANOS TGIC JF-77 by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77 is suitable for adhesives applications... view more
Applications
HSP Distance: 0.9
TITANOS TGIC JF-77B by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77B is suitable for adhesives applications... view more
Applications
HSP Distance: 0.9
TITANOS TGIC JF-77H by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent and it offers high purity. TITANOS TGIC JF-77H is suitable for adhesives applications... view more
Applications
HSP Distance: 0.9
TITANOS TGIC JF-78 by Titanos is an anti-allergic, triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-78 is suitable for adhesives applications... view more
Applications
Ashland Specialty Chemical
HSP Distance: 1.7
2-PYROL™ by Ashland Specialty Chemical is a hygroscopic, biodegradable and reactive 2-pyrrolidone. Offers low vapor pressure, high flash point, high dipole moment, ready complex formation and... view more
Applications
Ashland Specialty Chemical
HSP Distance: 1.7
2-PYROL™ Purified by Ashland Specialty Chemical is 2-pyrrolidone. It acts as a coalescent and plasticizer for acrylic resins in adhesives. It is a purified, hygroscopic, biodegradable and reactive... view more
Ningbo Actmix Polymer
HSP Distance: 1.9
Actmix® TBzTD-70GE F140 is a 70 wt% tetrabenzylthiuram disulfide. Acts as a vulcanization accelerator. Addition of thiazoles or sulfenamides accelerators can slow down vulcanization, shorten... view more
Ningbo Actmix Polymer
HSP Distance: 1.9
Curekind® TBzTD Dust free Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 1.9
Curekind® TBzTD Granule is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 1.9
Curekind® TBzTD Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Lemman Laboratories International
HSP Distance: 2.3
Tris(2-chloroethyl) phosphate. Acts as a low viscosity and low acidic flame retardant. It exists as colorless to light yellow viscous liquid. Used in flexible and rigid polyurethane and... view more
Ferro-Plast
HSP Distance: 2.5
FerroFlex PTSA by FerroPlast is a p-toluene sulfonamide grade. Acts as a plasticizer. FerroFlex PTSA by FerroPlast is compatible with thermosetting resins and is suitable for adhesives... view more
Applications
Lanxess
HSP Distance: 2.5
Uniplex 171 by Lanxess is a stable o, p-toluene sulfonamide-based plasticizer for polyamide, melamine, urea and phenolic resins. Imparts good gloss and wetting action improving mixing of filled... view more
HSP Distance: 2.5
N-(2-Ethoxyphenyl)-N'-(2-ethylphenyl)oxamide. It acts as UV absorber. It is low molecular weight, slightly yellowish powder. It shows performance synergy with other light stabilizers such as... view more
TinToll (PCC Group)
HSP Distance: 2.5
PowerSorb™ 312 by TinToll (PCC Group) is a light stabilizer of oxanilide class. It is a N-(2-ethoxyphenyl)-N'-(2-ethylphenyl) oxamide. It offers less discoloring even in alkaline environment and in... view more
HSP Distance: 2.7
Dazomet Technical by BASF is a biocide, 3,5-dimethyl-2H-1,3,5-thiadiazinane-2-thione. Dazomet Technical is used in adhesives... view more
Applications
HSP Distance: 2.7
Myacide™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable. This... view more
HSP Distance: 2.7
Protectol™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione which is used as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable... view more
HSP Distance: 2.7
Kowa NMMA is N-methoxymethyl acrylamide. Used in adhesives... view more
Vertellus Specialties
HSP Distance: 2.7
Surfactol® 318 by Vertellus Specialties is a non-ionic surfactant based on the addition of ethylene oxide to the hydroxyl groups in castor oil. Acts as a non-ionic surfactant, defoamer, wetting and... view more
Vertellus Specialties
HSP Distance: 2.7
Surfactol® 365 by Vertellus Specialties is a PEG-40 water-soluble castor oil, designed for adhesive applications. Acts as a non-ionic surfactant, wetting agent, defoamer and anti-static agent. Shows... view more
Keeneyes Industrial
HSP Distance: 2.8
Maleic anhydride. It is an acid anhydride of maleic acid, usually colorless or white solid in appearance with an acrid odor. Produced industrially on a large scale for use as a raw material in... view more
New Japan Chemical
HSP Distance: 2.8
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are... view more
A&C Catalysts
HSP Distance: 2.9
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
HSP Distance: 2.9
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
HSP Distance: 2.9
N,N'-Cystaminebisacrylamide. It is a reversible crosslinking monomer in form of white powder. It can be used to introduce mercaptan groups into polymers by reducing to mercaptan after... view more
HSP Distance: 2.9
N,N’-Hexamethylenebisacrylamide. It occurs in form of white powder. It is a crosslinking amide monomer and possesses greater hydrolytic stability than corresponding esters. It complies with FDA 40... view more
Ningbo Actmix Polymer
HSP Distance: 3.0
Actmix® OTOS-80GE F200 is a morpholin-4-yl morpholine-4-carbodithioate. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is an activator which has... view more
HSP Distance: 3.0
Acticide® M10S by Thor is a 2-Methyl-4-isothiazolin-3-one (9.5%) grade. Acts as an industrial microbiocide and algicide & fungicide. It controls the growth of bacteria and fungi. Used in water... view more
Vink Chemicals
HSP Distance: 3.0
Vinkocide MIT 10 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Vink Chemicals
HSP Distance: 3.0
Vinkocide MIT 50 by Vink Chemicals is MIT. It is a broad spectrum preservative exhibiting excellent long-term efficacy. It is free of organic solvents, formaldehyde and VOC. Suitable for use in... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 3.1
Tris [2-(3-mercaptopropionyloxy) ethyl] isocyanurate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TEMPIC is solvent free and exhibits high reactivity, low... view more
Double Bond Chemical
HSP Distance: 3.1
1,6-Hexamethylene bis(N,N-dimethyl semicarbazide). Acts as an antioxidant. It is a white crystalline powder. Used in adhesives... view more
HSP Distance: 3.1
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
HSP Distance: 3.1
Kowa TEMPIC is a tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate. It is a sulfur-based monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 3.1
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 3.1
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 3.1
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
Ningbo Actmix Polymer
HSP Distance: 3.1
Actmix® MTT-80GE F500 is a 3-methylthiazolidine-2-thione. Acts as an accelerator. It is a thiazole heterocycles chemical, contained active sulfur atoms, can be crosslinked with a polymer containing... view more
Wilshire Technologies (Evonik)
HSP Distance: 3.1
Bisphenol S Diglycidyl Ether is a bisphenol monomer. Used in adhesives... view more
Chromaflo Technologies
HSP Distance: 3.2
PLASTICOLORS® DTP-80827 by Chromaflo Technologies is a yellow color benzimidazolone-based (43%) non-phthalate plasticizer pigment. Its low viscosity makes it exceptionally easy to handle and reduces... view more
HSP Distance: 3.2
CUREZOL® 2E4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. CUREZOL® 2E4MZ is recommended for structural adhesives... view more
HSP Distance: 3.2
CUREZOL® 2MZ Azine by Evonik acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives. The shelf life of... view more
HSP Distance: 3.2
CUREZOL® 2P4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3 years. Recommended... view more
HSP Distance: 3.2
CUREZOL® C17Z by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures. CUREZOL® C17Z is... view more
HSP Distance: 3.3
Preventol® DBDCB 100 (Old Name: TEKTAMER® 38) by Lanxess is a biocide, in-can preservative. It shows broad-spectrum activity and has excellent long-term preservation. It is a good alternative for... view more
Applications
Lanxess
HSP Distance: 3.3
Uniplex 214 by Lanxess is a stable n-butylbenzenesulfonamide-based plasticizer for polyamides especially nylon, in adhesives for nonwoven interlinings. Possesses good heat stability to 80°C and... view more
HSP Distance: 3.4
N, N' Ethylene bisacrylamide. It occurs as white to off-white powder. It is a crosslinking monomer used in the preparation of polyacrylamide resins. It complies with TSCA regulation... view more
Lemman Laboratories International
HSP Distance: 3.5
Tris(1,3-dichloro-2-propyl) phosphate. Acts as a low viscosity and low acidic flame retardant additive. Used in flexible and rigid polyurethane and polyisocyanurate foam, unsaturated polyester... view more
Janssen (Johnson & Johnson Group)
HSP Distance: 3.6
Metal-free, halogen-free, non volatile bethoxazin. Used as a fungicide and an algicide for stains, moulds and algae control in adhesives and sealants. Offers broadspectrum mouldicide and algaecide... view more
HSP Distance: 3.6
Kowa THPA is a tetra hydro phthalic anhydride monomer. Used in adhesives... view more
Nan Ya Plastics
HSP Distance: 3.6
Tetra hydro-phthalic anhydride. Acts as a curing agent. It is produced by diels-alder condensation with maleic anhydride and 1, 3-butadiene. It improves the quality of resins and their reactivity in... view more
HSP Distance: 3.6
N-Acryloxysuccinimide. It is a white solid. It complies with FDA 40 CFR 720.36 regulation... view more
Shanghai Deborn
HSP Distance: 3.6
THPA by Shanghai Deborn is an epoxy resin-based curing agent. It is available in white-colored flake form. It is suitable for adhesives. THPA is partly soluble in petroleum ether and miscible in... view more
A&C Catalysts
HSP Distance: 3.7
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.7
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 3.7
Lapox® ASH-11 by Atul is a white to brownish, odorless, non-volatile crystalline powder. It is used as curing agent with epoxy resins specially to obtain faster reactivity than 4,4’-DDS. Exhibits... view more
Applications
HSP Distance: 3.7
Lapox® ASH-11 MIC by Atul is an aromatic amine curing agent with fast reactivity than 4,4’-DDS. It is off-white to yellowish-brown, odorless, non-volatile micronised powder suitable to disperse... view more
Applications
HSP Distance: 3.7
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 3.7
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
Gabriel Chemical
HSP Distance: 3.7
It is a 3, 3- diamino dephenyl sulfone. Acts as curing agents. It provides excellent thermal stability, outstanding chemical resistance, and excellent high temperature properties. Gabepro Gps-331 is... view more
HSP Distance: 3.7
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
HSP Distance: 3.7
Kowa NMMM is N-methoxymethyl methacrylamide. Used in adhesives... view more
Lemman Laboratories International
HSP Distance: 3.7
Tris(2-chloroethyl) phosphate. Acts as a flame retardant. It exists as colorless or light yellow transparent liquid. Used in flexible and rigid polyurethane and polyisocyanurate foam, unsaturated... view more
HSP Distance: 3.7
3,3'-Diaminodiphenylsulfone by Mitsui Chemicals is a curing agent. SO2 offers better performance in bonding carbon-fibers. Used for a heat-resistant epoxy resin. It offers flexibility... view more
HSP Distance: 3.7
3, 3’-Diaminodiphenylsulfone by Mitsui Chemicals is an aromatic sulfone diamine. It acts as a curing agent for epoxy resin. Offers excellent heat resistance and flexibility. SO2 shows better... view more
HSP Distance: 3.7
General purpose chlorinated phosphate ester. Acts as a flame retardant... view more
Zhejiang Wansheng
HSP Distance: 3.7
Low Odor Tris(1-chloro-2-propyl) phosphate. Acts as a general purpose chlorinated phosphate ester flame retardant. Exhibits low odor, high heat stability, excellent hydrolysis stability, low... view more
Ashland Specialty Chemical
HSP Distance: 3.8
BLO™ butyrolactone by Ashland Specialty Chemical is a hygroscopic, biodegradable and reactive butyrolactone. Used as a polar solvent for ionic substrates and as an acid donor in aqueous media at... view more
Applications
HSP Distance: 3.8
Vinylphosphonic acid dimethyl ester (VPADME) by BASF can be used as adhesion promotion and anti-corrosion agent. Exhibits high reactivity, exceptional quality and good consistency. It is suitable... view more
Applications
Everkem
HSP Distance: 3.8
AP 400-DIOL by Everkem is a tetrabromophthalic diol grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the registration... view more
Applications
HSP Distance: 3.8
Kowa MTHPA is a methyl tetra hydro phthalic anhydride monomer. Used in adhesives... view more
HSP Distance: 3.8
Kowa NEMA is a N-ethoxymethyl acrylamide monomer. Used in adhesives... view more
HSP Distance: 3.8
Methyl terephthalaldehydate. Used in production of polymers and chemical intermediates... view more
Double Bond Chemical
HSP Distance: 3.9
1,1,1’,1’-Tetramethyl-4,4'-(methylene-di-p-phenylene) di-semicarbazide. Acts as an UV absorber. Used in adhesives... view more
IGM Resins
HSP Distance: 4.0
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
Eastman
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