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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Surfactol® 365

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
216 products match your search
Product Name
Supplier
Description
HSP Distance: 1.1
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
New Japan Chemical
HSP Distance: 1.1
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.1
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.1
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
New Japan Chemical
HSP Distance: 1.3
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are... view more
Ashland Specialty Chemical
HSP Distance: 1.6
2-PYROL™ by Ashland Specialty Chemical is a hygroscopic, biodegradable and reactive 2-pyrrolidone. Offers low vapor pressure, high flash point, high dipole moment, ready complex formation and... view more
Applications
Ashland Specialty Chemical
HSP Distance: 1.6
2-PYROL™ Purified by Ashland Specialty Chemical is 2-pyrrolidone. It acts as a coalescent and plasticizer for acrylic resins in adhesives. It is a purified, hygroscopic, biodegradable and reactive... view more
A&C Catalysts
HSP Distance: 1.7
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
HSP Distance: 1.7
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
HSP Distance: 1.8
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 1.8
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 1.8
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
HSP Distance: 1.8
Kowa DPMP is a dipentaerythritol-hexakis-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 1.8
Solbrol® ICG by Lanxess is an in-can preservative in adhesives and animal, plant and synthetic glues. It is 3-iodo-2-propynylbutylcarbamate (IPBC). It offers efficiency against mold fungi, yeast and... view more
Applications
HSP Distance: 1.8
Omacide™ IPBC 100 Fungicide by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. It is a broad spectrum antimicrobial additive, preventing dry film fungal growth such as yeast and molds... view more
HSP Distance: 1.8
Omacide™ IPBC 20 by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants... view more
HSP Distance: 1.8
Omacide™ IPBC 30 by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. Broad spectrum fungicide additive. Prevents dry film fungal growth. Irreversible yellowing of the dry film may occur soon... view more
HSP Distance: 1.8
Omacide™ IPBC 30 DPG by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is designed for adhesives, caulks and... view more
HSP Distance: 1.8
Omacide™ IPBC 40 by Lonza is iodopropynyl butyl carbamate(IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants. Omacide™... view more
Bimax
HSP Distance: 1.9
N-Acryloyl sarcosine methyl ester. It reacts with a full range of acrylates & methacrylates and has high refractive index. It is used for the production of resins for solid phase peptide synthesis... view more
HSP Distance: 2.1
Kowa NMMM is N-methoxymethyl methacrylamide. Used in adhesives... view more
LANXESS
HSP Distance: 2.1
Uniplex 214 by Lanxess is a stable n-butylbenzenesulfonamide-based plasticizer for polyamides especially nylon, in adhesives for nonwoven interlinings. Possesses good heat stability to 80°C and... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.2
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP is based on mercaptocarboxylic acids. It is solvent free and exhibits high reactivity, low viscosity as... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.2
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP l.o. is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity, low... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.2
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP sl is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity as well... view more
HSP Distance: 2.2
Kowa NMMA is N-methoxymethyl acrylamide. Used in adhesives... view more
HSP Distance: 2.2
Kowa PEMP is a pentaerythritol tetrakis(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.3
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.3
Tris [2-(3-mercaptopropionyloxy) ethyl] isocyanurate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TEMPIC is solvent free and exhibits high reactivity, low... view more
HSP Distance: 2.3
Kowa TEMPIC is a tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate. It is a sulfur-based monomer. Used in adhesives... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.4
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
HSP Distance: 2.4
Kowa NEMA is a N-ethoxymethyl acrylamide monomer. Used in adhesives... view more
HSP Distance: 2.5
N-methyl-2-pyrrolidone (NMP) by LyondellBasell is a powerful solvent. It offers exceptional performance, broad solubility for resins, high chemical and thermal stability. Due to its high solvency... view more
Double Bond Chemical
HSP Distance: 2.6
1,6-Hexamethylene bis(N,N-dimethyl semicarbazide). Acts as an antioxidant. It is a white crystalline powder. Used in adhesives... view more
Lambiotte & Cie
HSP Distance: 2.6
1,3-dioxacyclopentane. It acts as a solvent. It is produced by reactions between alcohols and aldehydes. It shows very good profiles for health and environment with regard to toxicity and... view more
Kyoeisha Chemical
HSP Distance: 2.7
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 2.7
NAM- HOAMPE by Nagase Specialty Materials is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
HSP Distance: 2.7
N-ethylmethacrylamide. It is a solvent-soluble, polymerizable amide... view more
HSP Distance: 2.7
SIPOMER® WAM II by Solvay is a methacrylic monomer based on 46-50% methacrylamidoethyl ethylene urea (MAEEU). It promotes adhesion of polymer resins to metal, glass, concrete and other inorganic... view more
HSP Distance: 2.8
N-Vinyl-N-Methylacetamide (VIMA) by BASF is the best choice for a wide range of syntheses including polymerization, addition and electro cyclic reactions. Shows high reactivity, exceptional quality... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.8
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Chemsfield
HSP Distance: 2.8
N, N-Dimethylaniline. It is a colorless clear liquid. It can be co-polymerized with other vinyl monomers to obtain polymers. It performs solution polymerization, emulsification polymerization... view more
HSP Distance: 2.8
Houchi Chemical N,N-dimethylacrylamide(DMAA) is an acrylamide monomer. Used in adhesives... view more
Jarchem Industries
HSP Distance: 2.8
Monofunctional N,N-Dimethylacrylamide. Offers increased hydrolytic stability, improved UV as well as impact resistance and excellent optical properties. Improves hydrolytic resistance in water... view more
HSP Distance: 2.8
Kohshylmer® DMAA™ (N,N -Dimethyl acrylamide) is an adhesive raw material by KJ Chemicals. Suggested for UV curable applications. Shows excellent compatibility and readily copolymerizes with other... view more
HSP Distance: 2.8
Kowa DMAA is a N,N-dimethyl acrylamide monomer. Used in adhesives... view more
HSP Distance: 2.8
Kowa NBMA is N-n-butoxymethyl acrylamide. Used in adhesives... view more
HSP Distance: 2.8
Dimethyl acrylamide. It is a clear colorless liquid with slight odor. Mainly used as a chemical for making adhesives... view more
Lemman Laboratories International
HSP Distance: 2.8
Tris(2-chloroethyl) phosphate. Acts as a flame retardant. It exists as colorless or light yellow transparent liquid. Used in flexible and rigid polyurethane and polyisocyanurate foam, unsaturated... view more
HSP Distance: 2.8
General purpose chlorinated phosphate ester. Acts as a flame retardant... view more
HSP Distance: 2.8
Methacryloyl-L-lysine. It is a white powder. Used as a building block for producing custom made polymers with pendant amine functionality. It complies with FDA 40 CFR 720.36 regulation... view more
HSP Distance: 2.8
N, N-Dimethylacrylamide is a chemically stable clear, colorless liquid. It is water-soluble, hydrolytically stable acrylamide derivative used in chromatographic resins. It complies with TSCA... view more
HSP Distance: 2.8
N-Acryloxysuccinimide. It is a white solid. It complies with FDA 40 CFR 720.36 regulation... view more
HSP Distance: 2.8
Methacryloyl-L-Lysine. Can be used as a building block for producing custom made polymers with pendant amine functionality... view more
A&C Catalysts
HSP Distance: 2.9
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
HSP Distance: 2.9
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
LANXESS
HSP Distance: 2.9
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
HSP Distance: 2.9
Methyl 2-cyanoacrylate. It is a colorless liquid. It can be copolymerized with conventional monomers by using free radical initiators. It complies with TSCA regulation... view more
HSP Distance: 2.9
N,N’-Hexamethylenebisacrylamide. It occurs in form of white powder. It is a crosslinking amide monomer and possesses greater hydrolytic stability than corresponding esters. It complies with FDA 40... view more
A&C Catalysts
HSP Distance: 3.0
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.0
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 3.0
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 3.0
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
HSP Distance: 3.0
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
Advanced Polymer
HSP Distance: 3.1
VOC free, low toxicity, oxazoline resin emulsion. Used as an effective waterborne crosslinking agent for polymer emulsions containing carboxyl functionality. Provides very good adhesion to... view more
Advanced Polymer
HSP Distance: 3.1
VOC free, low toxicity, oxazoline resin emulsion. Used as an effective waterborne crosslinking agent for polymer emulsions containing carboxyl functionality. Provides very good adhesion to... view more
Advanced Polymer
HSP Distance: 3.1
Oxazoline functional polymer solution. Used as an effective waterborne crosslinking agent for polymer emulsions containing carboxyl functionality. Provides very good adhesion to polyester... view more
HSP Distance: 3.1
Tris (4-aminophenyl) thiophosphate . It is a multifunctional monomer specifically developed for PU. Imparts inherent flame retardency due to presence of P, N and S elements... view more
IGM Resins
HSP Distance: 3.1
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
Ningbo Actmix Polymer
HSP Distance: 3.2
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
HSP Distance: 3.2
2-Cyanoethyl acrylate. It is a clear yellow liquid. Used as an adhesion promoter and suitable for photocurable resists for liquid crystal devices. It complies with TSCA regulation... view more
HSP Distance: 3.3
Lapox® ARTF-35 by Atul is a low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition temperature, outstanding heat... view more
Applications
HSP Distance: 3.3
Lapox® ARTF-36 by Atul is a high purity, distilled, low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition... view more
Applications
HSP Distance: 3.3
Araldite® MY 0500 by Huntsman is a low viscosity, high functionality amine based epoxy resin. It is an aero-grade. It cures very rapidly to produce products having exceptionally high heat deflection... view more
Applications
HSP Distance: 3.3
Araldite® MY 0510 is a triglycidylized para-amino-phenol by Huntsman. It is a very low viscosity, high functionality amine-based, high purity resin with relatively good storage stability. It cures... view more
IGM Resins
HSP Distance: 3.3
Esacure KIP 160 by IGM Resins is a difunctional alpha hydroxy ketone based type I photoinitiator. It exhibits excellent reactivity. Provides through and surface cure. Esacure KIP 160 is designed for... view more
HSP Distance: 3.3
Kowa HHPA is a hexa hydro phthalic anhydride monomer. Used in adhesives... view more
HSP Distance: 3.3
Kowa MTHPA is a methyl tetra hydro phthalic anhydride monomer. Used in adhesives... view more
Nagase ChemteX
HSP Distance: 3.3
Denacol® EX-811 is a bi-functional ethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-811 is recommended for adhesives. It offers viscosity adjustment. It... view more
Applications
Nagase ChemteX
HSP Distance: 3.3
Denacol® EX-821 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-821 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Nagase ChemteX
HSP Distance: 3.3
Denacol® EX-830 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment and flexibility. Denacol® EX-830 is recommended... view more
Applications
Nagase ChemteX
HSP Distance: 3.3
Denacol® EX-832 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-832 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Nan Ya Plastics
HSP Distance: 3.3
Hexa hydro-phthalic anhydride. Acts as a curing agent. It improves the quality of resins and their reactivity in the presence of air & their light fastness. It is compatible with epoxy resins. Used... view more
Ningbo Actmix Polymer
HSP Distance: 3.3
Actmix® TBzTD-70GE F140 is a 70 wt% tetrabenzylthiuram disulfide. Acts as a vulcanization accelerator. Addition of thiazoles or sulfenamides accelerators can slow down vulcanization, shorten... view more
Ningbo Actmix Polymer
HSP Distance: 3.3
Curekind® TBzTD Dust free Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 3.3
Curekind® TBzTD Granule is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Ningbo Actmix Polymer
HSP Distance: 3.3
Curekind® TBzTD Powder is a tetrabenzylthiuram disulfide. Acts as an accelerator. It is a safety secondary amine accelerator and can be substitute to the thiuram accelerator... view more
Shanghai Deborn
HSP Distance: 3.3
HHPA by Shanghai Deborn is hexahydrophthalic anhydride-based curing agent. It is available in white-colored solid form. It finds application in adhesives. HHPA is partly soluble in petroleum ether... view more
Solvay
HSP Distance: 3.3
Epicerol® by Solvay is bio-based epichlorohydrin (ECH). It acts as a chemical intermediate mainly used in the manufacture of epoxy resins. It is recommended for production of adhesives and sealants... view more
Teda Golone Chemical
HSP Distance: 3.3
GL205 by Teda Golone Chemical is a polyethylene glycol diglycidyl ether grade. Acts as a bifunctional reactive diluent of epoxy resin and a tougheneing agent. Exhibits flexibility, improved impact... view more
Teda Golone Chemical
HSP Distance: 3.3
GL215 by Teda Golone Chemical is a polyethylene glycol diglycidyl ether grade. Acts as a bifunctional reactive diluent of epoxy resin and a toughening agent. Offers flexibility, improved impact... view more
Teda Golone Chemical
HSP Distance: 3.3
GL669 by Teda Golone Chemical is an ethylene glycol diglycidyl ether grade. Acts as a reactive diluent. It is soluble in water and most organic solvents. It is a small molecule containing two... view more
HSP Distance: 3.3
Methyl terephthalaldehydate. Used in production of polymers and chemical intermediates... view more
HSP Distance: 3.3
TITANOS TGIC JF-77 by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77 is suitable for adhesives applications... view more
Applications
HSP Distance: 3.3
TITANOS TGIC JF-77B by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent. TITANOS TGIC JF-77B is suitable for adhesives applications... view more
Applications
HSP Distance: 3.3
TITANOS TGIC JF-77H by Titanos is a triglycidyl isocyanurate grade. Acts as a curing agent and it offers high purity. TITANOS TGIC JF-77H is suitable for adhesives applications... view more
Applications
A&C Catalysts
HSP Distance: 3.4
Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 3.4
Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 3.4
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in adhesives... view more
A&C Catalysts
HSP Distance: 3.4
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It is low viscosity amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in... view more
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