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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Denacol® EX-941

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
664 products match your search
Product Name
Supplier
Description
Nagase ChemteX
Hsp Distance: 0.0
Denacol® EX-911 is a bi-functional propylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-911 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
Hsp Distance: 0.0
Denacol® EX-920 is a bi-functional polypropylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. It shows good compatibility and... view more
Applications
Emerald Performance Materials
Hsp Distance: 0.6
ERISYS™ GE-21 by Emerald Performance Materials is low viscosity, aliphatic, diepoxide, epoxidized butanediol. Used as a reactive diluent for high viscosity epoxy resins in adhesives. Possesses... view more
Hsp Distance: 0.6
HELOXY™ Modifier 67 by Momentive is 1, 4-butanediol diglycidyl ether. Acts primarily as a reactive diluent or viscosity reducer. It is compatible with bisphenol based epoxy resins, peroxidized... view more
Hsp Distance: 0.6
Diglycidyl ether of 1,4-butanediol. Acts as a reactive diluent or viscosity reducer for liquid epoxy resins. Improves the wetting characteristics and facilitates the air release. Reduces the... view more
Hubei Green Home Chemical
Hsp Distance: 0.6
1,4-Butanediol diglycidyl ether. Acts as a solvent and curing agent. It has low virulence, slight color and low viscosity. It is well miscible with all kinds of epoxy resins, used in epoxy resin... view more
Hsp Distance: 0.6
Araldite® DY 026 by Huntsman is a diglycidylether of butanediol. Acts as a monofunctional reactive diluent for epoxy resins. Araldite® DY 026 is an aero and electronic grade... view more
Hsp Distance: 0.6
Araldite® DY-D is a difunctional reactive diluent for epoxy resins by Huntsman. Chemically based on diglycidylether of butanediol. Shows a fair to good reduction of viscosity, elimination of... view more
Hsp Distance: 0.6
Lonzamon™ AATMP by Lonza is a low viscous, toxicologically friendly, propane-1,1,1-triyltrimethyl tris (acetoacetate) grade. Used as an adhesion promoter to metallic, mineral and wood surfaces... view more
Emerald Performance Materials
Hsp Distance: 0.9
Diepoxidized polyglycol. Used as a reactive diluent of uncured high viscosity epoxy resins in adhesives. Reduces viscosity. Improves impact and thermal shock resistance, adhesion and flexibility... view more
Emerald Performance Materials
Hsp Distance: 0.9
Diepoxidized polyglycol. Used as a reactive diluent of uncured high viscosity epoxy resins in adhesives. Reduces viscosity. Improves impact and thermal shock resistance, adhesion and flexibility... view more
Hsp Distance: 1.1
N-[3-(dimethylamino)propyl]-2- methacrylamide. It is manufactured in industrial settings in closed systems and used by industry for manufacture of polymers in closed and semi-closed systems. It is... view more
Hsp Distance: 1.1
Kowa DMAPMA is dimethyl amino propyl methacrylamide. Used in adhesives... view more
Nagase ChemteX
Hsp Distance: 1.1
Denacol® EX-850 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-850 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
Hsp Distance: 1.1
Denacol® EX-851 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It provides 99% water solubility. It offers viscosity adjustment. Denacol®... view more
Applications
Gelest
Hsp Distance: 1.2
Bis(n-mehylbenzamide)ethoxymethylsilane. Used as neutral crosslinker for silicone RTVs... view more
Nagase ChemteX
Hsp Distance: 1.2
Denacol® EX-811 is a bi-functional ethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-811 is recommended for adhesives. It offers viscosity adjustment. It... view more
Applications
Nagase ChemteX
Hsp Distance: 1.2
Denacol® EX-821 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-821 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Nagase ChemteX
Hsp Distance: 1.2
Denacol® EX-830 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment and flexibility. Denacol® EX-830 is recommended... view more
Applications
Nagase ChemteX
Hsp Distance: 1.2
Denacol® EX-832 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-832 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Emerald Performance Materials
Hsp Distance: 1.3
ERISYS™ GE-22 by Emerald Performance Materials is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. Used as a reactive diluent for high viscosity epoxy resins in... view more
Hsp Distance: 1.3
It is the cyclohexane dimethanol diglycidyl ether. Acts as viscosity reducing modifier. It is fully compatible with the entire bisphenol A based series of epoxy resins as well as higher... view more
Hsp Distance: 1.3
HELOXY™ Modifier HD by Hexion is diglycidyl ether of 1,6-hexanediol. It functions as a reactive diluent or viscosity reducer for liquid epoxy resins. It reduces the viscosity while maintaining most... view more
Hsp Distance: 1.3
Araldite® DY-C is a difunctional, aliphatic, reactive diluent for epoxy resins. Offers moderate to low viscosity and improved processability. It has less tendency to turn yellow. Provides virtually... view more
Hsp Distance: 1.3
Araldite® DY-H by Huntsman is based on Diglycidylether of 1.6-hexanediol with low molecular weight and high vapor pressure. It is a difunctional, aliphatic, reactive diluent that may be mixed with... view more
Applications
New Japan Chemical
Hsp Distance: 1.3
1,4-cyclohexane dimethanol diglycidylether. It has less viscosity and less Tg deterioration. It has excellent in weather resistance, mechanical characteristics and electric characteristics. It... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
PVP K-90 by Ashland Specialty Chemical is a hygroscopic, amorphous polyvinylpyrrolidone designed for adhesive applications. Offers high polarity, dispersancy, hydrophilicity, adhesion, low order of... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
Hygroscopic, amorphous polyvinylpyrrolidone. Used in adhesives. Offers high polarity, dispersancy, hydrophilicity, adhesion, cohesivity and high glass transition temperature. Can be plasticized with... view more
Applications
Ashland Specialty Chemical
Hsp Distance: 1.4
N-vinyl-2-pyrrolidone. It is a clear liquid stabilized with insoluble sodium hydroxide or soluble N,N’-di-sec-butyl-p-phenylenediamine. It accelerates UV curing rates as the reactive diluent. It... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible, skin-adhesive pads. Possesses film forming and solubilizing properties. Offers... view more
Hsp Distance: 1.4
Luviskol® K 30 powder is a non toxic polyvinylpyrrolidone. Exhibits good adhesion and water solubility. Possesses film forming and solubilizing properties. Used in glue sticks, remoistenable and... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible, skin-adhesive pads. Possesses film forming and solubilizing properties. Offers... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible, skin-adhesive pads. Possesses film forming and solubilizing properties. Offers... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible, skin-adhesive pads. Possesses film forming and solubilizing properties. Offers... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible, skin-adhesive pads. Possesses film forming and solubilizing properties. Offers... view more
Hsp Distance: 1.4
Luviskol® K 90 powder is a polyvinylpyrrolidone. It is non toxic and exhibits good adhesion and water solubility. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in glue sticks, remoistenable and watersoluble hot-melt adhesives and flexible, skin-adhesive pads. Possesses film forming and solubilizing properties. Offers... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Luvitec® K 17 powder is polyvinylpyrrolidone (PVP) by BASF. Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade... view more
Hsp Distance: 1.4
Luvitec® K 30 powder by BASF is a polyvinylpyrrolidone (PVP). Exhibits film forming and solubilizing properties. Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone. Used in glue stick... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone. Used in glue stick... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in glue stick... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Luvitec® K 90 powder by BASF is a water-soluble polyvinylpyrrolidone (PVP). Exhibit good adhesion and non-toxicity. Used in adhesive sticks, wettable gums for postage stamps, envelopes and in... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone. Used in glue sticks... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone (PVP). Used in adhesive sticks, wettable gums for postage stamps, envelopes and in pick-up adhesives for bonds that can be broken and remade several times. Can also be used as... view more
Hsp Distance: 1.4
Polyvinylpyrrolidone. Used in glue sticks... view more
Hsp Distance: 1.4
Vinylpyrrolidone homopolymer. Used in adhesives for technical applications... view more
Applications
Hsp Distance: 1.4
Luvitec® VA 64 by BASF is vinylpyrrolidone homopolymer. Luvitec® VA 64 is used in adhesives for technical applications... view more
Applications
Hsp Distance: 1.4
N-Vinyl-imidazole by BASF is a monomer designed for UV curing adhesives. Exhibits high reactivity, exceptional quality and good consistency. It is the best choice for a wide range of synthesis... view more
Hsp Distance: 1.4
N-Vinyl pyrrolidone. With high reactivity, exceptional quality and good consistency, it is the best choice for a wide range of syntheses including polymerization, addition and electro cyclic... view more
Hsp Distance: 1.4
Butanoic acid, 3-oxo-, 2-[(2-methyl-1-oxo-2-propenyl) oxy] ethyl ester. Provides improved adhesion to metal substrates, outstanding flexibility and corrosion resistance. Offers reaction with... view more
Emerald Performance Materials
Hsp Distance: 1.4
ERISYS™ GA-240 by Emerald Performance Materials is a tetraglycidyl meta-xylenediamine grade. It is a tetrafunctional epoxy resin. Due to its high epoxy functionality, cured formulations possess high... view more
Applications
Hsp Distance: 1.4
Acetoacetoxyethyl methacrylate. It is a low viscosity, monofunctional methacrylate. The two ketone groups in its backbone can chelate various cations allowing for adhesion between methacrylate... view more
Hsp Distance: 1.4
Houchi Chemical N-Vinyl-2-Pyrrolidone (NVP) is pyrrolidone monomer. Used in adhesives... view more
Huangshan Bonsun Pharmaceuticals
Hsp Distance: 1.4
N-vinyl-2-pyrrolidone monomer. It is colorless to slightly yellowish transparent liquid. Reactive and susceptible to hydrolyzation and polymerization. Soluble in water and a variety of organic... view more
IGM Resins
Hsp Distance: 1.4
2-[[(Butylamino) carbonyl] oxy] ethyl acrylate. It is a monofunctional urethane acrylate which can be used as a reactive diluent for radiation curable adhesives. Exhibits non-yellowing and low odor... view more
Jarchem Industries
Hsp Distance: 1.4
N-vinyl-2-pyrrolidone. It is a UV/EB reactive monomer. Used in the manufacture of adhesives... view more
Hsp Distance: 1.4
Lonzamon™ AAEMA by Lonza is a 2-(Acetoacetoxy)ethyl methacrylate grade. Used as a copolymer with acrylates and styrene acrylates in adhesives and sealants. Provides improved mechanical and solvent... view more
Hsp Distance: 1.4
Lonzamon™ AAEMA-PQ by Lonza is a 2-(Acetoacetoxy)ethyl methacrylate copolymer, used with acrylates and styrene acrylates in adhesives. Acts as an adhesion promotor to metallic, mineral and wood... view more
Emerald Performance Materials
Hsp Distance: 1.5
Triglycidyl ether of propoxylated glycerin. Used as a flexibilizing diluent for epoxy resins in adhesives and joint sealants. Reduces viscosity. Improves surface wetting properties of uncured... view more
Hsp Distance: 1.5
Long-chain aliphatic triglycidyl ether. It is trifunctional and aliphatic. Suitable for use both as a flexibilizer and as a reactive diluent. Exhibits moderate lowering of viscosity, very marked... view more
Jarchem Industries
Hsp Distance: 1.6
N,N-Dimethylaminopropylacrylamide. It has a stronger stability against hydrolysis and a stronger base strength due to its amino type structure compared to other ester type methacrylates and... view more
Hsp Distance: 1.6
Kowa IBMM is N-iso-butoxymethyl methacrylamide. Used in adhesives... view more
Kowa
Hsp Distance: 1.7
Kowa GMA is a glycidyl methacrylate. It is a mono-functional monomer... view more
Kyoeisha Chemical
Hsp Distance: 1.7
Glycidyl methacrylate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Hsp Distance: 1.8
Kowa NBMM is N-butoxymethyl methacrylamide. Used in adhesives... view more
Hsp Distance: 1.9
AMINE™ CS-1246 by Dow is 5-Ethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane. Used as a crosslinking and curing agent for adhesive applications. Imparts great flexibility and elongation characteristics... view more
Hsp Distance: 1.9
Broad-spectrum bactericide based on oxazolidine (1-aza- 3,7-dioxa-5-ethylbicyclo (3.3.0) octane). Used in adhesives based on starch, protein, gums and latex. Offers protection from microbial... view more
Applications
Emerald Performance Materials
Hsp Distance: 1.9
ERISYS™ GE-20 by Emerald Performance Materials is a low viscosity, aliphatic, diepoxide, epoxidized neopentyl glycol. Used as a reactive diluent for high viscosity epoxy resins in adhesives... view more
Evermore Chemical Industry
Hsp Distance: 1.9
SC-7100NY by Evermore Chemical Industry is a free hexamethylene diisocyanate (HDI). It is a crosslinking agent. SC-7100NY is a solvent-free grade, used in adhesive applications... view more
Applications
Evermore Chemical Industry
Hsp Distance: 1.9
SC-7175NY by Evermore Chemical Industry is a free hexamethylene diisocyanate (HDI) grade. It is a crosslinking agent. SC-7175NY can be diluted with butyl acetate solvent. Designed for adhesives... view more
Applications
Evermore Chemical Industry
Hsp Distance: 1.9
SC-7190NY by Evermore Chemical Industry is a free hexamethylene diisocyanate (HDI) grade. Used in adhesives. It is a crosslinking agent. SC-7190NY can be diluted with butyl acetate solvent... view more
Applications
Evermore Chemical Industry
Hsp Distance: 1.9
SC-7500NY by Evermore Chemical Industry is a free hexamethylene diisocyanate (HDI). It is a crosslinking agent. Designed for adhesive applications. SC-7500NY is a solvent-free grade... view more
Applications
Evermore Chemical Industry
Hsp Distance: 1.9
SC-75NY by Evermore Chemical Industry is a free hexamethylene diisocyanate (HDI) grade. It is a crosslinking agent. It can be diluted with butyl acetate solvent. SC-75NY is used in adhesives... view more
Applications
Evermore Chemical Industry
Hsp Distance: 1.9
SC-75NYH by Evermore Chemical Industry is a free hexamethylene diisocyanates (HDI) grade. It is a crosslinking agent. Used in the manufacture of adhesives. SC-75NYH can be diluted with PMA and... view more
Applications
Hsp Distance: 1.9
It is the neopentyl glycol diglycidyl ether. Acts as viscosity reducing modifier. It is compatible with bisphenol based epoxy resins, peroxidized olefins, and higher functionality epoxy resins. It... view more
Hsp Distance: 2.0
Kowa TBAA is tert-butyl acrylamide. Used in adhesives... view more
Hsp Distance: 2.1
Ureido Methacrylate 25 % in Methyl Methacrylate (UMA 25 %) is an acrylate monomer. It imparts properties such as crosslinking, adhesion and rheological modification to polymers. It forms... view more
Hsp Distance: 2.1
VISIOMER® MEEU 25 M by Evonik is an N-(2-Methacryloyloxyethyl) ethylene urea (25% in methyl methacrylate) grade. VISIOMER® MEEU 25 M by Evonik is registered and listed within REACH (Registration... view more
Hsp Distance: 2.1
VISIOMER® MEEU 50 W by Evonik is an N-(2-Methacryloyloxyethyl) ethylene urea (50% in water) grade. VISIOMER® MEEU 50 W by Evonik is registered and listed within REACH (Registration, Evaluation... view more
Kowa
Hsp Distance: 2.1
Kowa AGE is allyl glycidyl ether. It is a diol polyether. Used in adhesives... view more
Kowa
Hsp Distance: 2.2
Kowa TDM is a dimethyl-3,3‘-thiodipropionate. It is a sulfur-based monomer. Used in adhesives... view more
Hsp Distance: 2.3
N-vinyl-n-methylacetamide. With high reactivity, exceptional quality and good consistency, it is the best choice for a wide range of syntheses including polymerization, addition and electro cyclic... view more
Hsp Distance: 2.3
Alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no halogen... view more
Applications
Nagase Water Soluble Epoxy Compounds
Naphthenic oils for better adhesion
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