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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Dioxolane

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
459 products match your search
Product Name
Supplier
Description
Bimax
HSP Distance: 1.0
N-Acryloyl sarcosine methyl ester. It reacts with a full range of acrylates & methacrylates and has high refractive index. It is used for the production of resins for solid phase peptide synthesis... view more
Kowa
HSP Distance: 1.2
Kowa MPM is a methyl-3-mercaptopropionate. It is a sulfur-based monomer. Used in adhesives... view more
Nagase ChemteX
HSP Distance: 1.3
Denacol® EX-811 is a bi-functional ethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-811 is recommended for adhesives. It offers viscosity adjustment. It... view more
Applications
Nagase ChemteX
HSP Distance: 1.3
Denacol® EX-821 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-821 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Nagase ChemteX
HSP Distance: 1.3
Denacol® EX-830 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment and flexibility. Denacol® EX-830 is recommended... view more
Applications
Nagase ChemteX
HSP Distance: 1.3
Denacol® EX-832 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-832 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 1.5
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
Kyoeisha Chemical
HSP Distance: 1.5
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase ChemteX
HSP Distance: 1.5
Denacol® EX-850 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-850 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
HSP Distance: 1.5
Denacol® EX-851 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It provides 99% water solubility. It offers viscosity adjustment. Denacol®... view more
Applications
Nagase Specialty Materials
HSP Distance: 1.5
NAM- HOAMPE by Nagase Specialty Materials is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
HSP Distance: 1.6
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 1.6
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 1.6
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
HSP Distance: 1.6
Solbrol® ICG by Lanxess is an in-can preservative in adhesives and animal, plant and synthetic glues. It is 3-iodo-2-propynylbutylcarbamate (IPBC). It offers efficiency against mold fungi, yeast and... view more
Applications
HSP Distance: 1.6
Omacide™ IPBC 100 Fungicide by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. It is a broad spectrum antimicrobial additive, preventing dry film fungal growth such as yeast and molds... view more
HSP Distance: 1.6
Omacide™ IPBC 20 by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants... view more
HSP Distance: 1.6
Omacide™ IPBC 30 by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. Broad spectrum fungicide additive. Prevents dry film fungal growth. Irreversible yellowing of the dry film may occur soon... view more
HSP Distance: 1.6
Omacide™ IPBC 30 DPG by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is designed for adhesives, caulks and... view more
HSP Distance: 1.6
Omacide™ IPBC 40 by Lonza is iodopropynyl butyl carbamate(IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants. Omacide™... view more
Ningbo Actmix Polymer
HSP Distance: 1.6
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
A&C Catalysts
HSP Distance: 1.7
Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 1.7
Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 1.7
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in adhesives... view more
A&C Catalysts
HSP Distance: 1.7
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It is low viscosity amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.7
Trimethylolpropane tri (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMP is solvent free and exhibits high reactivity, low viscosity as... view more
HSP Distance: 1.7
Kowa NBMA is N-n-butoxymethyl acrylamide. Used in adhesives... view more
HSP Distance: 1.7
Kowa DPMP is a trimethylolpropane-tris-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 1.8
N-Vinyl-N-Methylacetamide (VIMA) by BASF is the best choice for a wide range of syntheses including polymerization, addition and electro cyclic reactions. Shows high reactivity, exceptional quality... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.8
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Chemsfield
HSP Distance: 1.8
N, N-Dimethylaniline. It is a colorless clear liquid. It can be co-polymerized with other vinyl monomers to obtain polymers. It performs solution polymerization, emulsification polymerization... view more
HSP Distance: 1.8
Houchi Chemical N,N-dimethylacrylamide(DMAA) is an acrylamide monomer. Used in adhesives... view more
Jarchem Industries
HSP Distance: 1.8
Monofunctional N,N-Dimethylacrylamide. Offers increased hydrolytic stability, improved UV as well as impact resistance and excellent optical properties. Improves hydrolytic resistance in water... view more
HSP Distance: 1.8
Kohshylmer® DMAA™ (N,N -Dimethyl acrylamide) is an adhesive raw material by KJ Chemicals. Suggested for UV curable applications. Shows excellent compatibility and readily copolymerizes with other... view more
HSP Distance: 1.8
Kowa DMAA is a N,N-dimethyl acrylamide monomer. Used in adhesives... view more
HSP Distance: 1.8
Dimethyl acrylamide. It is a clear colorless liquid with slight odor. Mainly used as a chemical for making adhesives... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.9
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP is based on mercaptocarboxylic acids. It is solvent free and exhibits high reactivity, low viscosity as... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.9
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP l.o. is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity, low... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.9
Pentaerythritol tetra (3-mercaptopropionate). Acts as a cross linking agent. THIOCURE® PETMP sl is based on mercaptocarboxylic acids. It is slow and exhibits high reactivity, low viscosity as well... view more
HSP Distance: 1.9
Kowa PEMP is a pentaerythritol tetrakis(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.0
Ureido Methacrylate 25 % in Methyl Methacrylate (UMA 25 %) by BASF is an ureido funcional methacrylate monomer. It imparts properties such as crosslinking, adhesion and rheological modification to... view more
HSP Distance: 2.0
VISIOMER® MEEU 25 M by Evonik is N-(2-Methacryloyloxyethyl) ethylene urea (25% in methyl methacrylate) grade. It is used to impart wet adhesion and wet scrub resistance to polymers. VISIOMER® MEEU... view more
HSP Distance: 2.0
VISIOMER® MEEU 50 W by Evonik is an N-(2-Methacryloyloxyethyl) ethylene urea (50% in water) grade. It is designed to improve wet adhesion properties of emulsion polymers and wet scrub resistance of... view more
Jarchem Industries
HSP Distance: 2.0
N,N-Dimethylaminopropylacrylamide. It has a stronger stability against hydrolysis and a stronger base strength due to its amino type structure compared to other ester type methacrylates and... view more
HSP Distance: 2.0
Kowa NBMM is N-butoxymethyl methacrylamide. Used in adhesives... view more
HSP Distance: 2.0
Lonzamon™ AATMP by Lonza is a low viscous, toxicologically friendly, propane-1,1,1-triyltrimethyl tris (acetoacetate) grade. Used as an adhesion promoter to metallic, mineral and wood surfaces... view more
HSP Distance: 2.0
N-methyl-2-pyrrolidone (NMP) by LyondellBasell is a powerful solvent. It offers exceptional performance, broad solubility for resins, high chemical and thermal stability. Due to its high solvency... view more
Gelest
HSP Distance: 2.1
Bis(n-mehylbenzamide)ethoxymethylsilane. Used as neutral crosslinker for silicone RTVs... view more
IGM Resins
HSP Distance: 2.1
Photomer® 4184 by IGM Resins is a monofunctional urethane acrylate which can be used as a reactive diluent for radiation curable adhesives. It offers good reactivity, flexibility and adhesion. It... view more
HSP Distance: 2.2
2-Cyanoethyl acrylate. It is a clear yellow liquid. Used as an adhesion promoter and suitable for photocurable resists for liquid crystal devices. It complies with TSCA regulation... view more
HSP Distance: 2.3
Kowa DPMP is a dipentaerythritol-hexakis-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
SHOWA DENKO
HSP Distance: 2.4
AOI-VM™ by Showa Denko, is a high-performance, multipurpose 2-acryloyloxyethylisocyanate (AOI) versatile monomer (VM). It contains not only an isocyanate group, which easily binds to various... view more
SHOWA DENKO
HSP Distance: 2.4
2-Isocyanatoethyl acrylate. It is a clear, colorless or slightly yellowish liquid. It has high reactivity and is very effective in UV curing. Shows a higher curing rate in comparison to standard... view more
HSP Distance: 2.4
Disponil® SUS IC 875 by BASF is an anionic di-2-ethylhexyl sulphosuccinate, sodium salt. Used as emulsifier for the emulsion polymerization of practically all types of monomers used in adhesives... view more
Applications
HSP Distance: 2.4
It is an alcohol alkoxylates. Acts as silicone-free surface additives. It reduces surface tension, improves substrate wetting and stabilizes the curtain. Used for aqueous adhesives and sealants. Its... view more
HSP Distance: 2.4
Kowa Topolene M is 3-chloro-2-hydroxy-propyl methacrylate. It is mono-functional monomer... view more
HSP Distance: 2.5
VISIOMER® DMAPMA by Evonik is dimethylaminopropyl methacrylamide. It is manufactured in industrial settings in closed systems and used by industry for manufacture of polymers in closed and... view more
HSP Distance: 2.5
Long-chain aliphatic triglycidyl ether. It is trifunctional and aliphatic. Suitable for use both as a flexibilizer and as a reactive diluent. Exhibits moderate lowering of viscosity, very marked... view more
HSP Distance: 2.5
ERISYS™ GE-36 by Huntsman is triglycidyl ether of propoxylated glycerin. It is a flexibilizing diluent for epoxy resins. It is compatible with standard Bisphenol-A, Bisphenol-F and epoxy phenol... view more
HSP Distance: 2.5
Kowa DMAPMA is dimethyl amino propyl methacrylamide. Used in adhesives... view more
LANXESS
HSP Distance: 2.5
Solbrol® P by Lanxess is paraben-n-propylester-based preservative. Solbrol® P is used in the manufacture of glues and adhesives... view more
Applications
HSP Distance: 2.5
Solbrol® P Sodium Salt by Lanxess is used as a preservative in the manufacturing of glues and adhesives. Solbrol® P Sodium Salt is a paraben-n-propylester sodium salt... view more
Bimax
HSP Distance: 2.6
Dimethyl maleate. It is a clear liquid monomer. Improves hardness & toughness of polymer films and anti-blocking properties of copolymers of vinyl acetate. Used in internal modifier to increase the... view more
Jarchem Industries
HSP Distance: 2.6
N-Isopropylacrylamide. Introduces a polar amido group into a hydrophobic polymer by emulsification, polymerization, or suspended polymerization. Used in temperature sensitive polymers... view more
HSP Distance: 2.6
Kohshylmer® NIPAM™ (N -Isopropyl acrylamide) by KJ Chemicals is a UV curable adhesive raw material with distinctive solubility behavior in water. It is useful in introducing strong polar amide group... view more
Nagase ChemteX
HSP Distance: 2.6
Denacol® EX-911 is a bi-functional propylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-911 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
HSP Distance: 2.6
Denacol® EX-920 is a bi-functional polypropylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. It shows good compatibility and... view more
Applications
Nagase ChemteX
HSP Distance: 2.6
Denacol® EX-941 is a bi-functional polypropylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-941 is recommended for adhesives... view more
Applications
HSP Distance: 2.7
Kowa NMMM is N-methoxymethyl methacrylamide. Used in adhesives... view more
Kyoeisha Chemical
HSP Distance: 2.7
2-Acryloyloxy ethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
LANXESS
HSP Distance: 2.7
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
Nagase Specialty Materials
HSP Distance: 2.7
NAM- HOAMPL by Nagase Specialty Materials is a 2-acryloyloxy ethyl phthalate. Offers good adhesion. It is registered in TSCA... view more
Polysciences
HSP Distance: 2.7
Acrylic anhydride is an anhydride monomer. Forms cyclic anhydrides on polymerization and does not produce crosslinks in polymers. Used to prepare specialty acrylate, acrylamide monomers... view more
HSP Distance: 2.8
2-Hydroxy-2-methyl-1-phenyl-1-propane-one. Used in adhesives. Offers non-yellowing properties and good shelf stability... view more
HSP Distance: 2.8
Irgacure® 1173 (Old name: Darocur® 1173) by BASF is a photoinitiator composed of 2-Hydroxy-2-methyl-1-phenyl-propan-1-one grade. Used in reactive and radiation curing adhesives. Irgacure® 1173... view more
HSP Distance: 2.8
AEROTHANE MM by Dow is used as a solvent in adhesives. AEROTHANE MM possesses non-flammable and volatile properties... view more
Applications
HSP Distance: 2.8
Methylene Chloride Technical E is used as a solvent in adhesives. Methylene Chloride Technical E offers high purity, high quality, non-flammability and volatility... view more
Applications
HSP Distance: 2.8
Methylene Chloride Technical Grade by Dow is used as a solvent in adhesives. Methylene Chloride Technical Grade possesses non-flammability and volatility... view more
Applications
HSP Distance: 2.8
Methylene Chloride™ Technical Grade Cyclohexane Inhibited by Dow is a clear, colorless, volatile liquid, chlorinated solvent. It contains cyclohexane for applications sensitive to amylene. Methylene... view more
Applications
HSP Distance: 2.8
Methacroyloxyethyl phthalate (HEMA phthalate). It is an aromatic, carboxylic acid-containing monomer which lends itself to many adhesive applications where functionality of a methacrylate is needed... view more
IGM Resins
HSP Distance: 2.8
Esacure KL 200 by IGM Resins is 2-hydroxy-2-methyl-1-phenyl-1-propanone based photoinitiator. It provides high reactivity and low yellowing properties. It is used for photopolymerization of UV... view more
IGM Resins
HSP Distance: 2.8
Omnirad 1173 (Old name: Irgacure 1173) by IGM Resins is a highly efficient, low yellwoing type I photoinitiator. It provides surface-, through-, LED and high speed cure. Omnirad 1173 is used to... view more
IGM Resins
HSP Distance: 2.8
Omnirad 73 by IGM Resins acts as a free-radical type I photoinitiator. It is designed for UV radiation curing system. It provides through-, surface- and LED cure. Omnirad 73 is suitable for clear... view more
HSP Distance: 2.8
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
HSP Distance: 2.8
Greatcure 1173 by Lanxess is a highly efficient photo-initiator in UV-curable systems. Greatcure 1173 is used in adhesives... view more
Lambson (Sartomer)
HSP Distance: 2.8
SpeedCure 73 by Lambson (Sartomer) is a 2-hydroxy-2-methyl-1-phenylpropanone. Acts as a highly efficient, widely used, Type I photoinitiator. Radicals are formed by an α cleavage mechanism and as... view more
Applications
HSP Distance: 2.8
Photoinitiator used for the photopolymerization of UV Curable systems based on acrylic unsaturated oligomers and monomers. Very good compatibility with acrylate chemistries, exhibits low odor in... view more
New Japan Chemical
HSP Distance: 2.8
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 2.8
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 2.8
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
HSP Distance: 2.9
ERISYS™ GA-240 by Huntsman is a tetrafunctional epoxy resin based on meta-Xylenediamine. It is a nitrogen containing highly reactive resin with a very low viscosity. It suggested for use in... view more
Miami Chemical
HSP Distance: 2.9
ACETYLACETONE by Miami Chemical is a 2, 4 pentanedione. It is a VOC-exempt solvent. ACETYLACETONE is used for adhesives. It is a colorless, transparent liquid and exhibits an obnoxious odor... view more
Bruno Bock chemische Fabrik
HSP Distance: 3.0
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
HSP Distance: 3.0
Span™ 20 by Croda is a 100% bio-based, non-ionic, easy to handle surfactant. Acts as a pigment dispersant and carrier liquid. It can be used for particle morphology control in S-PVC. It also acts as... view more
HSP Distance: 3.0
Polyfunctional glycidyl ether of trimethylolpropane. Acts as a reactive diluent or viscosity reducer with high reactivity for liquid epoxy resins. Has low viscosity and low temperature curing. Its... view more
HSP Distance: 3.0
Araldite® DY-T by Huntsman is a trifunctional reactive diluent for epoxy resins. It has a low molecular weight, slight reduction of viscosity, maintained high reactivity, fair to good improvement of... view more
HSP Distance: 3.0
ERISYS™ GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured... view more
HSP Distance: 3.0
Kowa IBMM is N-iso-butoxymethyl methacrylamide. Used in adhesives... view more
HSP Distance: 3.0
Kowa NEMA is a N-ethoxymethyl acrylamide monomer. Used in adhesives... view more
Kowa
HSP Distance: 3.0
Kowa TDM is a dimethyl-3,3‘-thiodipropionate. It is a sulfur-based monomer. Used in adhesives... view more
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