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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Kowa M-600A

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
401 products match your search
Product Name
Supplier
Description
HSP Distance: 0.6
Aminoethylenepiperazine (AEP-HP) by Huntsman is a high purity curing agent for epoxy resins. It also functions as a corrosion inhibitor and mineral processing aid. It is clear, colorless, cyclic... view more
HSP Distance: 0.6
N-aminoethylpiperazine (AEP) by Huntsman Advanced Materials is an N-aminoethylpiperazine. It is an epoxy resin curing agent. N-aminoethylpiperazine (AEP) is used to formulate epoxy systems for... view more
HSP Distance: 0.6
Witcolink® AZ-33 by Lanxess is a cross-linker for both aqueous and non-aqueous adhesives. It promotes both physical and chemical properties. This ethylene imine based tri-functional polyaziridine is... view more
PolyAziridine Global
HSP Distance: 0.6
PZE-1000 by PolyAziridine Global is an ethylene imine based tri-functional polyaziridine grade. Acts as a crosslinking agent. Exhibits an amine-like odor and a high level of functionality that... view more
Shanghai Holdenchem
HSP Distance: 0.6
Pentaerythritol tris[3-(1-aziridinyl) propionate]. Acts as a crosslinking agent, adhesion promoter and modifier. Increases the cohesive strength and offers faster cure time. Improves the adhesion to... view more
Tosoh
HSP Distance: 0.6
N-aminoethylpiperazine. Designed to manufacture thermoplastic polyamide resin used for hot-melt adhesives... view more
Kowa
HSP Distance: 1.3
Kowa BzG is a benzyl glycol. It is a diol polyether. Used in adhesives... view more
SHOWA DENKO
HSP Distance: 1.3
Pentaerythritol tetrakis. It acts as a curing agent. Improves curing speed, sensitivity and reactivity, which leads to a reduction in the amount of energy necessary for production and processing... view more
HSP Distance: 1.4
DOWANOL™ PPh Glycol Ether by Dow is a low odor, slow-evaporating, very hydrophobic glycol ether. It is used as a coalescent in acrylic-based latex adhesives. DOWANOL™ PPh Glycol Ether possesses... view more
Huntsman
HSP Distance: 1.4
Aradur® 1167 by Huntsman is a latent modified phenolic accelerator. Exhibits low dust powder and softening temperature. Suitable for heat curing epoxy systems. Provides good glass transition... view more
HSP Distance: 1.4
Kowa BA-2 is an ethoxylated bisphenol A. Used in adhesives... view more
HSP Distance: 1.4
Kowa BA-P2 is a propoxylated bisphenol A. Used in adhesives... view more
HSP Distance: 1.4
Kowa PhFG is a phenyl propylene glycol. It is a diol polyether. Used in adhesives... view more
LANXESS
HSP Distance: 1.5
Solbrol® P by Lanxess is paraben-n-propylester-based preservative. Solbrol® P is used in the manufacture of glues and adhesives... view more
Applications
HSP Distance: 1.5
Solbrol® P Sodium Salt by Lanxess is used as a preservative in the manufacturing of glues and adhesives. Solbrol® P Sodium Salt is a paraben-n-propylester sodium salt... view more
HSP Distance: 1.7
Heat reactive, phenolic resin. Used in the resin curing of butyl rubbers, adhesive systems and sealants. Possesses very good compatibility with chloroprene, nitrile and natural rubbers. Provides... view more
HSP Distance: 1.7
Oil soluble, heat reactive phenolic resin. Used in neoprene solvent type contact cements. Provides high heat resistance, high cohesive strength, shorter open time, and light color. Possesses... view more
HSP Distance: 1.7
Akrochem® P-133 by Akrochem is a thermoplastic, alkyl phenolic resin tackifier. Develops high tack levels in rubber compounds which are used in tire construction and mechanical goods. Provides tack... view more
HSP Distance: 1.7
One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal and vinyl plastics. Provides good... view more
Applications
HSP Distance: 1.7
Akrochem® P-28 by Akrochem is a non-staining, heat reactive alkylphenol-formaldehyde resins resin. Used in neoprene solvent cements. Increases the heat resistance of the adhesive when used with an... view more
HSP Distance: 1.7
One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal, and vinyl plastics. Provides good... view more
Applications
HSP Distance: 1.7
Finely pulverized thermosetting phenolic resin of the two-step type. Used as a hardening and a reinforcing agent for nitrile, nitrile-SBR blends, and polybutadiene polymers. Possesses medium flow... view more
HSP Distance: 1.7
Thermoplastic plenolic novolac resin. Compatible in nitrile rubber. Possesses better compatibility and dispersibility with NBR when a cashew nut oil is added. Recommended for use where scorching or... view more
Arakawa Chemical
HSP Distance: 1.7
Pure phenolic resin. Used as a tackifier in NBR adhesives. Provides addition of hardness... view more
Arakawa Chemical
HSP Distance: 1.7
Pure phenolic resin. Used as a tackifier in IC sealing. Provides very good electronic characteristics under high temperature and high moisture conditions... view more
Applications
Arakawa Chemical
HSP Distance: 1.7
Pure phenolic resin. Used as a tackifier in IC sealing. Provides very good electronic characteristics under high temperature and high moisture conditions... view more
Applications
Shanghai Xin Hua
HSP Distance: 1.7
Phenol formaldehyde resin. Used in adhesives... view more
Applications
Shanghai Xin Hua
HSP Distance: 1.7
Phenol formaldehyde resin. Used in adhesives... view more
Applications
HSP Distance: 1.8
Bis (2-methacryloyloxyethyl) pyromellitate [pyromellitic dimethacrylate ]. Possesses the ability to bond various substrates when used alone or in conjunction with our sodium or magnesium (NTG-GMA)... view more
HSP Distance: 1.8
Kowa A-9300(S)(NK-Ester) is an ethoxylated isocyanuric acid triacrylate. It is a multi-functional monomer. It is an excellent high density crosslinking monomer for high temperature resistance and... view more
Kyoeisha Chemical
HSP Distance: 1.8
2-Acryloyloxy ethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
HSP Distance: 1.8
Tris(2-hydroxy Ethyl)isocyanurate diacrylate. It is difunctional. Offers good adhesion and abrasion resistance... view more
HSP Distance: 1.8
Tris(2-hydroxy Ethyl)isocyanurate triacrylate. It is trifunctional. Offers high reactivity, good scratch resistance, good adhesion... view more
HSP Distance: 1.8
Tris(2-hydroxy Ethyl)isocyanurate triacrylate with trimethylolpropane triacrylate. Offers good adhesion, abrasion resistance, and chemical resistance... view more
Nagase Specialty Materials
HSP Distance: 1.8
NAM- A9300 by Nagase Specialty Materials is a tris(2-acryloxyethyl) isocyanurate. Provides good abrasion resistance, good adhesion and fast cure speed. It is registered in TSCA... view more
Nagase Specialty Materials
HSP Distance: 1.8
NAM- HOAMPL by Nagase Specialty Materials is a 2-acryloyloxy ethyl phthalate. Offers good adhesion. It is registered in TSCA... view more
Ningbo Actmix Polymer
HSP Distance: 1.8
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
Sartomer (Arkema Group)
HSP Distance: 1.8
SR 368 NS by Sartomer Arkema Group is a tris (2-hydroxy ethyl) isocyanurate triacrylate. It is trifunctional. It is a white, crystalline, solid triazin compound with a melt point of 52-54°C which... view more
Sartomer (Arkema Group)
HSP Distance: 1.8
SR 368D NS by Sartomer Arkema Group is a tris (2-hydroxy ethyl) isocyanurate triacrylate. It is trifunctional. It is a clear liquid triazin compound which is used in free radical polymerization... view more
Sartomer (Arkema Group)
HSP Distance: 1.8
SR368 by Sartomer (Arkema Group) is tris (2-hydroxy ethyl) isocyanurate triacrylate designed for adhesives. Offers fast cure response, adhesion, weatherability, high impact strength, low shrinkage... view more
Shin-Nakamura Chemicals
HSP Distance: 1.8
A-9300 is a tris(2-acryloxyethyl) isocyanulate. It is a multifunctional acrylate... view more
HSP Distance: 1.8
2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane is an amino monomer. It is a microcrystalline solid. Used in adhesives... view more
HSP Distance: 1.9
2-Hydroxy-2-methyl-1-phenyl-1-propane-one. Used in adhesives. Offers non-yellowing properties and good shelf stability... view more
HSP Distance: 1.9
Irgacure® 1173 (Old name: Darocur® 1173) by BASF is a photoinitiator composed of 2-Hydroxy-2-methyl-1-phenyl-propan-1-one grade. Used in reactive and radiation curing adhesives. Irgacure® 1173... view more
HSP Distance: 1.9
AEROTHANE MM by Dow is used as a solvent in adhesives. AEROTHANE MM possesses non-flammable and volatile properties... view more
Applications
HSP Distance: 1.9
Methylene Chloride Technical E is used as a solvent in adhesives. Methylene Chloride Technical E offers high purity, high quality, non-flammability and volatility... view more
Applications
HSP Distance: 1.9
Methylene Chloride Technical Grade by Dow is used as a solvent in adhesives. Methylene Chloride Technical Grade possesses non-flammability and volatility... view more
Applications
HSP Distance: 1.9
Methylene Chloride™ Technical Grade Cyclohexane Inhibited by Dow is a clear, colorless, volatile liquid, chlorinated solvent. It contains cyclohexane for applications sensitive to amylene. Methylene... view more
Applications
IGM Resins
HSP Distance: 1.9
Esacure KL 200 by IGM Resins is 2-hydroxy-2-methyl-1-phenyl-1-propanone based photoinitiator. It provides high reactivity and low yellowing properties. It is used for photopolymerization of UV... view more
IGM Resins
HSP Distance: 1.9
Omnirad 1173 (Old name: Irgacure 1173) by IGM Resins is a highly efficient, low yellwoing type I photoinitiator. It provides surface-, through-, LED and high speed cure. Omnirad 1173 is used to... view more
IGM Resins
HSP Distance: 1.9
Omnirad 73 by IGM Resins acts as a free-radical type I photoinitiator. It is designed for UV radiation curing system. It provides through-, surface- and LED cure. Omnirad 73 is suitable for clear... view more
HSP Distance: 1.9
Kowa Topolene M is 3-chloro-2-hydroxy-propyl methacrylate. It is mono-functional monomer... view more
HSP Distance: 1.9
Greatcure 1173 by Lanxess is a highly efficient photo-initiator in UV-curable systems. Greatcure 1173 is used in adhesives... view more
Lambson (Sartomer)
HSP Distance: 1.9
SpeedCure 73 by Lambson (Sartomer) is a 2-hydroxy-2-methyl-1-phenylpropanone. Acts as a highly efficient, widely used, Type I photoinitiator. Radicals are formed by an α cleavage mechanism and as... view more
Applications
HSP Distance: 1.9
Photoinitiator used for the photopolymerization of UV Curable systems based on acrylic unsaturated oligomers and monomers. Very good compatibility with acrylate chemistries, exhibits low odor in... view more
Runtec Chemical
HSP Distance: 1.9
1-Hydroxy-2-methylpheny-propane-1-one. Acts as a photoinitiator. It is a colorless or slightly yellow liquid with 164.2 molecular weight... view more
Applications
Suny Chem
HSP Distance: 1.9
Sunitor 1173 by Suny Chem is a 2-hydroxy-2-methyl-1-phenyl propanone grade. Sunitor 1173 is used in adhesives... view more
Applications
Bruno Bock chemische Fabrik
HSP Distance: 2.0
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.0
Trimethylolpropane tri (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMP is solvent free and exhibits high reactivity, low viscosity as... view more
HSP Distance: 2.0
Methacroyloxyethyl phthalate (HEMA phthalate). It is an aromatic, carboxylic acid-containing monomer which lends itself to many adhesive applications where functionality of a methacrylate is needed... view more
HSP Distance: 2.0
Kowa DPMP is a trimethylolpropane-tris-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Shin-Nakamura Chemicals
HSP Distance: 2.0
β-Methacryloyloxyethyl hydrogen phthalate. It is a monofunctional methacrylate... view more
Albemarle
HSP Distance: 2.1
Amine curing agent for polyurethanes and epoxies. Can be used as a chain extender for polyurethane and polyurea elastomers and as an antioxidant for elastomers, lubricants and industrial oils... view more
HSP Distance: 2.1
Low-color aromatic amine curing agent for polyurethanes and epoxies. Can be used as a chain extender for polyurethane and polyurea elastomers and as an antioxidant for elastomers, lubricants and... view more
Bimax
HSP Distance: 2.1
Dimethyl maleate. It is a clear liquid monomer. Improves hardness & toughness of polymer films and anti-blocking properties of copolymers of vinyl acetate. Used in internal modifier to increase the... view more
HSP Distance: 2.1
Lonzacure® DETDA 80 by Lonza is a diethyltoluenediamine grade. Used as a chain extender for elastomeric polyurethanes and as a curing agent for epoxides. Provides low viscosity, hydrolytic stability... view more
Ningbo Actmix Polymer
HSP Distance: 2.1
Actmix® HEXA-80GE F500 is a hexamethylenetetramine. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is a weak alkaline accelerator for slow... view more
Polysciences
HSP Distance: 2.1
4-Vinylbenzoic acid is a carboxylic acid monomer. All usage of this product must comply with 40 CFR 720.36... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.1
(1R,2R,3S,5R)-(-)-Pinanediol is a diol monomer. Used in adhesives... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.1
(1S,2S,3R,5S)-(+)-Pinanediol is a diol monomer. Used in adhesives... view more
Kyoeisha Chemical
HSP Distance: 2.2
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
LANXESS
HSP Distance: 2.2
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
Nagase Specialty Materials
HSP Distance: 2.2
NAM- HOAMPE by Nagase Specialty Materials is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
Planet Chemicals
HSP Distance: 2.2
4-Chloro-3-methylphenol. Acts as a highly effective germicide as well as fungicide biocide. It controls the growth of a wide spectrum of micro-organisms for example bacteria and molds. Used for... view more
Bimax
HSP Distance: 2.3
Ortho-allylphenol. It is a colorless to yellow liquid. Used to produce allyl substituted phenolic and polyester resins. Also used to produce silanes which can be polymerized into polyolefines via... view more
HSP Distance: 2.3
Methacroyloxyethyl maleate (HEMA maleate). It is a carboxylic acid-containing methacrylate that can function as an alternative to PMDM. Used in anaerobic adhesive applications. Complies with TSCA... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.3
1,3-Adamantanediol is a diol monomer. Used in adhesives... view more
HSP Distance: 2.4
Lupragen® N 106 by BASF acts as catalyst. It is soluble in water and hygroscopic in nature. Lupragen® N 106 is used for polyurethane adhesives and sealants... view more
HSP Distance: 2.4
HYDROGRAL P by DRT is pentaerythritol ester of partially hydrogenated rosin-based tackifier. It is compatible with copolymers, ethylene, vinyl acetate and natural or synthetic rubbers (SIS, SBS, SBR... view more
HSP Distance: 2.4
2-Hydroxyethyl methacrylate/ succinate (methacryloyloxyethyl succinate). It is a yellow to milky white liquid with mild pleasant odor. Offers reactivity of succinic acid along with the adhesive... view more
HSP Distance: 2.4
Amicure® TEDA by Evonik is a high-purity catalyst. It is designed for polyurethane applications. Amicure® TEDA consists of minimum 99.95% of triethylenediamine on a water-free, amine-base. It is... view more
Guangzhou Flying Dragon
HSP Distance: 2.4
Hydrogenated pentaerythritol rosin ester. Acts as a tackifier. Used for various types of polymer- and elastomer-based adhesives. It is a pentaerythritol ester of a rosin that has been stabilized by... view more
Guangzhou Flying Dragon
HSP Distance: 2.4
Hydrogenated pentaerythritol rosin ester. Acts as a tackifier. Used for for various types of polymer- and elastomer-based adhesives. It is a pentaerythritol ester of a rosin that has been stabilized... view more
Kowa
HSP Distance: 2.4
Kowa SA is a β-methacryloyl oxyethyl hydrogen succinate monomer... view more
Kyoeisha Chemical
HSP Distance: 2.4
2-Methacryloyloxyethyl succinic acid. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Pinova (DRT)
HSP Distance: 2.4
Foral® 105 by Pinova is a low odor pentaerythritol ester of highly hydrogenated refined wood rosin. Acts as a tackifier. It is a pale, thermoplastic resin. It exhibits outstanding resistance to... view more
Pinova (DRT)
HSP Distance: 2.4
Pentalyn® H by Pinova is a pentaerythritol ester of wood rosin that has been stabilized by hydrogenation. Acts as a tackifier. It is a synthetic, hard, pale amber, thermoplastic resin designed... view more
Pinova (DRT)
HSP Distance: 2.4
Pentaerythritol ester of wood rosin that has been stabilized by hydrogenation. Acts as a synthetic resin, a hard, pale amber, thermoplastic resin designed primarily as a tackifying resin. It... view more
Shin-Nakamura Chemicals
HSP Distance: 2.4
2-Methacryloyloxyethyl succinate. It is a monofunctional methacrylate... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.5
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
HSP Distance: 2.5
Kowa HBPA is a hydrogenated bisphenol A. Used in adhesives... view more
Kowa
HSP Distance: 2.5
Kowa MPM is a methyl-3-mercaptopropionate. It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.5
2,2'-Bis(trifluoromethyl)-4,4'-diaminobiphenyl by Mitsui Chemicals is an aromatic diamine. 2,2' Bis(trifluoromethyl)-4,4'-diaminobiphenyl is used in polyamide and polyimide applications. Offers heat... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.5
2,2'-Bis(trifluoromethyl)benzidine is a polyimide monomer. It is a microcrystalline solid. Used in adhesives... view more
Wilshire Technologies (Evonik)
HSP Distance: 2.5
Bisphenol AF is a bisphenol monomer. Used in adhesives... view more
HSP Distance: 2.6
Loxanol® PL 5031 (Old Name: Plastilit 3431) by BASF is a plasticizer for resins and aqueous polymer dispersions. It is used in tackifying additives for dispersion adhesives such as flooring... view more
HSP Distance: 2.6
Protectol™ PE by BASF is a phenoxyethanol. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. Protectol™ PE is used in water-based adhesives... view more
HSP Distance: 2.6
Protectol™ PE S by BASF is a phenoxyethanol. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. Protectol™ PE S is used in water based adhesives... view more
HSP Distance: 2.6
Ureido Methacrylate 25 % in Methyl Methacrylate (UMA 25 %) by BASF is an ureido funcional methacrylate monomer. It imparts properties such as crosslinking, adhesion and rheological modification to... view more
HSP Distance: 2.6
DALPAD A by Dow is a slow-evaporating glycol ether-based coalescing agent. This low odor, hydrophilic additive is used in latex adhesives. DALPAD A exhibits high polymer solvency... view more
Applications
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