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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Products Compatible with KANATOL 4060

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
531 products match your search
Product Name
Supplier
Description
HSP Distance: 0.8
Curamine 33-919 by Bitrez is a specially formulated low viscosity aliphatic ketamine curing agent developed for use in conjunction with liquid epoxy resins in adhesives. It exhibits low viscosity... view more
Applications
Ningbo Actmix Polymer
HSP Distance: 0.8
Actmix® DOTG-75GA F140 is a di-o-tolylguanidine (75%). Acts as a vulcanization accelerator. It can lead to a very slow start of vulcanization and relatively slow vulcanization rate. Improves... view more
Aquaspersions
HSP Distance: 1.1
Dicyclohexyl phthalate (DCHP) dispersion. Used as a non-blocking plasticiser and/or as a delayed action heat sensitive tackifying agent for water-based adhesive systems... view more
AriChem
HSP Distance: 1.1
High purity 1,3-benzene dicarboxylic acid, diphenyl ester. It is a white crystalline solid. Used in production of polymers... view more
HSP Distance: 1.1
Omnirad 4MBZ Flakes by IGM Resins is 4-methyl benzophenone. It is an effective free-radical type II photoinitiator. It is used in combination with tertiary amine synergists to initiate radical... view more
Lambson (Sartomer)
HSP Distance: 1.1
SpeedCure MBP by Lambson (Sartomer) is a 4-methylbenzophenone. Acts as a photoinitiator. Unlike many other benzophenone derivatives it has same curing efficiency & other performance features as... view more
Applications
Lanxess
HSP Distance: 1.1
Unimoll® 66 by Lanxess is a powder-forming plasticizer. It is a dicyclohexyl phthalate (DCHP). Unimoll® 66 offers improved adhesion properties, increased potlife, abnormal crystallisation behavior... view more
HSP Distance: 1.1
Unimol® 66 M by Lanxess is dicyclohexyl phthalate (DCHP). Used as a powder-forming plasticizer in underfloor sealing compounds, heat-sealing paper, heat-bonding and heat-activated paper... view more
Clariant
HSP Distance: 1.2
Monoazo yellow. Is extender-free colorants with high tinctorial strength. Possesses good solubility in most organic solvents, oils, fats and waxes... view more
IGM Resins
HSP Distance: 1.3
Omnirad BP Flakes by IGM Resins is benzophenone based highly effective, free-radical, type II photoinitiator. It is designed for UV radiation curing system. It provides through and surface cure. It... view more
HSP Distance: 1.3
Omnirad BP crystals by IGM Resins is benzophenone based free-radical photoinitiator. Omnirad BP crystals is designed for UV radiation curing system... view more
Lambson (Sartomer)
HSP Distance: 1.3
SpeedCure BP by Lambson (Sartomer) is a benzophenone. Acts as a type II photoinitiator. Has non-yellowing characteristics and helps reduce oxygen inhibition. When used in conjunction with tertiary... view more
Applications
Lanxess
HSP Distance: 1.3
Greatcure BP by Lanxess is a photo-initiator in UV-curable systems. Greatcure BP is suitable for adhesives... view more
HSP Distance: 1.3
High purity, non-cleaving photoinitiator. Used to initiate free-radical polymerization by UV light of acrylates and multifunctional monomers through hydrogen attraction. Used in adhesives. Can be... view more
HSP Distance: 1.3
Benzophenone. It acts as photoinitiator. It complies with following regulations: REACH, TSCA, CEPA, IECSC, METI, ECL and CLP Hazard... view more
Applications
Albemarle
HSP Distance: 1.5
2,2-dimethoxy-2-phenylacetophenone. Used in adhesives. Offers good shelf stability, a fast cure rate and thorough curing... view more
Anyang General Chemical
HSP Distance: 1.5
UV Absorber UV-1 by Anyang General Chemical is N-(ethoxycarbonylphenyl)-N’-methyl-N’-phenylformamidine. It is available in light yellow colored sticky liquid form. It is used in TPU, PU adhesive and... view more
Dalian Richfortune Chemicals
HSP Distance: 1.5
Photoinitiator DETX by Dalian Richfortune Chemicals is a 2,4-Diethylthioxanthone. It is a highly efficient curing light initiator. It is designed for use in adhesives... view more
Applications
Emerald Performance Materials
HSP Distance: 1.5
K-FLEX® PG by Emerald Performance Materials is non-phthalate, low-VOC, propylene glycol dibenzoate plasticizer. It can achieve excellent performance and compatibility in waterborne adhesives, latex... view more
Emerald Performance Materials
HSP Distance: 1.5
Kalama® VITROFLEX® A99 by Emerald Performance Materials is a non-phthalate, benzoate plasticizer. It has excellent safety and regulatory profiles. It enables the formulators to eliminate... view more
Eutec Chemical
HSP Distance: 1.5
2,4-Diethylthioxanthone. Acts as a highly efficient photoinitiator... view more
Applications
IGM Resins
HSP Distance: 1.5
Esacure KB 45 by IGM Resins is solution of benzildimethylketal in acetone. It is used as a highly reactive photoinitiator for photopolymerization of UV-curable systems based on acrylated oligomers... view more
IGM Resins
HSP Distance: 1.5
Esacure KB 60 by IGM Resins is solution of benzildimethylketal in methylene chloride. It is used as a highly reactive photoinitiator for photopolymerization of UV-curable systems based on acrylated... view more
IGM Resins
HSP Distance: 1.5
Esacure KB1 by IGM Resins is benzil dimethyl ketal based photoinitiator. It provides very good cure rate, dark storage stability (shelf life) even at high dosage rate, minimal variation in color and... view more
IGM Resins
HSP Distance: 1.5
Omnirad 651 (Old name: Irgacure 651) by IGM Resins is 2,2-dimethoxy-2-phenylacetophenone based photoinitiator. Omnirad 651 is recommended for use in reactive and radiation curing adhesives... view more
IGM Resins
HSP Distance: 1.5
Omnirad BDK by IGM Resins is a highly efficient, type I photoinitiator. It is used to initiate radical polymerization of unsaturated oligomers such as acrylates after exposure to UV light. It can be... view more
Lambson (Sartomer)
HSP Distance: 1.5
SpeedCure BKL by Lambson (Sartomer) is a 2,2-dimethoxy-1,2-phenylacetophenone. Acts as a highly efficient, widely used, general purpose, Type I photoinitiator. The radicals formed by an α cleavage... view more
Applications
Lambson (Sartomer)
HSP Distance: 1.5
SpeedCure DETX by Lambson (Sartomer) is a 2,4-diethylthioxanthone. Acts as a highly efficient photoinitiator. When used in conjunction with tertiary amine synergists, it initiates the rapid... view more
Applications
MPI Chemie
HSP Distance: 1.5
UV-1 by MPI Chemie is liquid formamidine UV absorber. It is ethyl 4-[[(methylphenylamino) methylene] amino] benzoate. It is highly effective for the light stabilization of PUR in applications such... view more
HSP Distance: 1.5
Photoinitiator used to initiate the photopolymerization by UV or visible light of unsaturated polyesters and acrylates, in combination with mono- or multifunctional monomers. Exhibits low odor in... view more
HSP Distance: 1.6
Benzyl Alcohol by Miami Chemical is a phenylmethanol. It is a VOC-exempt solvent. Benzyl Alcohol is applicable for adhesives. It is clear, transparent liquid. It has sharp and pungent smell... view more
HSP Distance: 1.7
Methyl-o-benzoylbenzoate. Used in adhesives... view more
HSP Distance: 1.7
Curekind® DPG(D) Dust free Powder is a dephenyl guanidine. Acts as a middle-speed accelerator. Also as activator for thiazole, thiuram and sulfenamide accelerator as well as a plasticizer and... view more
Ningbo Actmix Polymer
HSP Distance: 1.7
Curekind® DPG(D) Powder is a dephenyl guanidine. Acts as a middle-speed accelerator. Also as activator for thiazole, thiuram and sulfenamide accelerator as well as a plasticizer and plastic-divider... view more
HSP Distance: 1.8
AKPEROX BP15 PASTE by AKPA Kimya is dibenzoyl peroxide. It can be used as a hardener for polyester putties. The shelf life of AKPEROX BP15 PASTE is 3 months. It complies with REACH regulation EC No... view more
HSP Distance: 1.8
AKPEROX BP17 PASTE by AKPA Kimya is dibenzoyl peroxide. It is recommended for curing unsaturated polyester (UP) resin-based putties, marble and stone adhesives. The shelf life of AKPEROX BP17 PASTE... view more
HSP Distance: 1.8
AKPEROX BP20 PASTE by AKPA Kimya is dibenzoyl peroxide. It is recommended for curing unsaturated polyester (UP) resin-based putties, marble and stone adhesives. The shelf life of AKPEROX BP20 PASTE... view more
HSP Distance: 1.8
AKPEROX BP25 PASTE by AKPA Kimya is dibenzoyl peroxide. It is recommended for curing unsaturated polyester (UP) resin-based putties, marble and stone adhesives. The shelf life of AKPEROX BP25 PASTE... view more
HSP Distance: 1.8
AKPEROX BP50 PASTE by AKPA Kimya is dibenzoyl peroxide. It is recommended for curing unsaturated polyester (UP) resin-based putties, marble and stone adhesives. The shelf life of AKPEROX BP50 PASTE... view more
HSP Distance: 1.8
AKPEROX BP50 PF PASTE by AKPA Kimya is phthalate-free, dibenzoyl peroxide. It is recommended for curing unsaturated polyester (UP) resin-based putties, marble and stone adhesives. The shelf life of... view more
HSP Distance: 1.8
Isopropylthioxanthone. Used in adhesives. Acts as a sensitizer when used with cationic photoinitiators. Also used with an amine synergist such as ethyl-p-dimethyl amine benzoate (EDAB) or... view more
HSP Distance: 1.8
Lupranat® M 10 R by BASF is diphenylmethane-4,4'-diisocyanate (MDI) with lower functionality and higher reactivity. Its average functionality is about 2.6. It is solvent-free. Lupranat® M 10 R is... view more
HSP Distance: 1.8
Lupranat® M 20 FB by BASF is a solvent-free grade based on 4,4'-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. Used as a wood binder. The average... view more
HSP Distance: 1.8
Lupranat® M 20 R is a solvent free 4,4'-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. It has relatively low reactivity. Its average functionality is... view more
HSP Distance: 1.8
Lupranat® M 20 S by BASF is a solvent-free product based on diphenylmethane-4,4'-diisocyanate (MDI) containing oligomers of high functionality and isomers. Used for the production of adhesives... view more
HSP Distance: 1.8
Lupranat® M 20 SB by BASF is solvent-free product based on 4,4'-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. Used for binders (for wood, sand, rock)... view more
HSP Distance: 1.8
Lupranat® M 20 W by BASF is solvent-free product based on diphenylmethane-4,4'-diisocyanate (MDI) containing oligomers of high functionality and isomers... view more
HSP Distance: 1.8
Lupranat® M 50 by BASF is a 4,4’-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. It is solvent-free. Its average functionality is about 2.7. Lupranat® M 50... view more
HSP Distance: 1.8
Lupranat® M 70 R by BASF is 4,4'-diphenylmethane diisocyanate (MDI). It is solvent-free and contains oligomers of high functionality and isomers. Its average functionality is about 2.9... view more
HSP Distance: 1.8
Lupranat® ME by BASF is 4,4'-diphenylmethane diisocyanate (MDI). It has low acidity. Used for the manufacture of thermoplastic polyurethanes. Lupranat® ME is also used for the production of... view more
HSP Distance: 1.8
Lupranat® MEB by BASF is a pure monomeric diphenylmethane-4,4'-diisocyanate (MDI) with low acidity. It is stabilized against yellowing. Lupranat® MEB is used for the production of adhesives and... view more
HSP Distance: 1.8
Lupranat® MES by BASF is 4,4'-diphenylmethane diisocyanate (MDI) with low acidity, stabilized against yellowing. Used for the production of adhesives and elastomers and thermoplastic polyurethanes... view more
HSP Distance: 1.8
Lupranat® MP 100/1 by BASF is a diphenylmethan-diisocyanate monomer. Used for the production of rebonded foam with superheated steam... view more
HSP Distance: 1.8
Lupranat® MR by BASF is diphenylmethane-4,4'-diisocyanate (MDI) with high acidity. Used for the manufacture of prepolymers and adhesives... view more
HSP Distance: 1.8
Lupranat® MRS by BASF is diphenylmethane-4,4'-diisocyanate (MDI) with high acidity. It contains a stabilizer in order to prevent yellowing. Lupranat® MRS is used for manufacture of prepolymers and... view more
HSP Distance: 1.8
Lupranat® VP 9252 by BASF is solvent-free product based on 4,4'-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. Used for the production of adhesives... view more
HSP Distance: 1.8
Lupranat® VP 9276 by BASF is solvent-free product based on 4,4'-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. Used as the base prepolymer for the... view more
HSP Distance: 1.8
Lupranat® VP 9283 by BASF is solvent-free product based on 4,4'-diphenylmethane diisocyanate (MDI) containing oligomers of high functionality and isomers. Used for the production of adhesives... view more
HSP Distance: 1.8
Lupranat® VP 9515 by BASF is solvent-free prepolymer based on 4,4'-diphenylmethane diisocyanate (MDI). Used for the production of moisture cured adhesives and adhesives for bonding various materials... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 1100 by BorsodChem is a 4-methyl-m-phenylene diisocyanate. Offers water and stain resistance, hardness, excellent adhesion, high gloss and durability in end products... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 1101 by BorsodChem is a 4-methyl-m-phenylene diisocyanate. It has elevated acidity and shows controlled reactivity... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 2100 by BorsodChem is a solvent-free, low viscosity polymeric MDI (methylene diphenyl diisocyanate). It has an average functionality of 2.6-2.7. Exhibits low thermal conductivity... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
Oligomeric MDI (methylene diphenyl diisocyanate). Suitable for versatile, cost effective and sustainable construction... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 2500 by BorsodChem is an oligomeric methylene diphenyl diisocyanate(MDI). It is a solvent free dark-brown middle viscosity liquid at room temperature... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 2700 by BorsodChem is an oligomeric methylene diphenyl diisocyanate(MDI). It is a solvent free dark-brown high viscosity liquid at room temperature. Offers weather and water resistance... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 3000 by BorsodChem is a general pure, 4, 4’-Methylene diphenyl diisocyanate (MDI). It exhibits weather-, abrasion- and chemical resistance. Offers flexibility, high strength, durability... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 3020 by BorsodChem is a 4,4'-methylene diphenyl diisocyanate. Exhibits high strength and resistance to weather, chemicals & abrasion. Offers flexibility, comfort and durability. It is... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® 3045 by BorsodChem is a 4,4'-methylene diphenyl diisocyanate. Exhibits weather-, chemical- and abrasion resistance. Possesses high strength and offers flexibility, comfort & durability... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® CO 2150 by BorsodChem is a oligomeric methylene diphenyl diisocyanate (MDI). Exhibits high durability and high insulation & energy efficiency. Offers prevention of air & moisture... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® CO 2160 by BorsodChem is a oligomeric methylene diphenyl diisocyanate (MDI). Exhibits mechanical & chemical resistance, controlled surface temperature, ease of application, fire retardancy... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® CO 2170 by BorsodChem is a polymeric methylene diphenyl diisocyanate (MDI) with elevated acidity. It is a solvent-free dark brown low viscosity liquid at room temperature. Used in... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® CO 4070 by BorsodChem is an oligomeric methylene diphenyl diisocyanate (MDI). Exhibits efficient thermal insulation and flowability. ONGRONAT® CO 4070 by BorsodChem is a solvent-free, dark... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® FB 2450 by BorsodChem is an oligomeric MDI with controlled reactivity. It is a solvent-free, low viscosity liquid at room temperature. ONGRONAT® FB 2450 provides enhanced consistency... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® TR 2000 by BorsodChem is an oligomeric MDI with controlled reactivity. It is a solvent-free, low viscosity liquid at room temperature. ONGRONAT® TR 2000 provides light weight, efficient... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® TR 2010 by BorsodChem is an oligomeric MDI with controlled low reactivity. It is a solvent-free, low viscosity liquid at room temperature. ONGRONAT® TR 2010 provides efficient use of... view more
BorsodChem (Wanhua)
HSP Distance: 1.8
ONGRONAT® WO 2750 by BorsodChem is an oligomeric MDI with enhanced reactivity. It is a solvent-free, low viscosity liquid at room temperature with no added formaldehyde. ONGRONAT® WO 2750 provides... view more
HSP Distance: 1.8
VORANATE™ M 220 Polymeric MDI by Dow is a low viscosity mixture of diphenylmethane-4,4’-diisocyanate with isomers and homologues of higher functionality. It offers balanced viscosity and tailored... view more
Applications
HSP Distance: 1.8
VORANATE™ M 229 by Dow is a low viscosity, liquid polymethylene polyphenylisocyanate, MDI. It produces light colored rigid foams which provide excellent flow into complex shaped molds. The shelf... view more
HSP Distance: 1.8
VORANATE™ M 2940 Polymeric MDI by Dow is a low viscosity mixture of monomeric methylene diphenyl diisocyanate isomers and homologues. It offers balanced functionality and viscosity. It enables the... view more
Applications
HSP Distance: 1.8
VORANATE™ M 580 Polymeric MDI by Dow is a high-functional MDI. VORANATE™ M 580 Polymeric MDI is developed to produce PUR and PIR continuous laminates... view more
HSP Distance: 1.8
VORANATE™ M 595 Polymeric MDI by Dow is a mixture of diphenylmethane-4,4’-diisocyanate with isomers and homologues of higher functionality. It provides improved foam cure, excellent strength... view more
HSP Distance: 1.8
VORANATE™ M 600 by Dow is an intermediate viscosity, polymethylene polyphenylisocyanate. It offers improved foam cure, good strength properties and better dimensional stability. It is ideal for... view more
Eutec Chemical
HSP Distance: 1.8
2-Isopropylthioxanthone. Acts as a highly efficient photoinitiator... view more
Applications
Everkem
HSP Distance: 1.8
EVERFOS 1350 by Everkem is an isopropylated triaryl phosphate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
Everkem
HSP Distance: 1.8
EVERFOS 1500 by Everkem is an isopropylated triaryl phosphate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
Everkem
HSP Distance: 1.8
EVERFOS 1650 by Everkem is an isopropylated triaryl phosphate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
Everkem
HSP Distance: 1.8
EVERFOS 1950 by Everkem is an isopropylated triaryl phosphate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
Everkem
HSP Distance: 1.8
EVERFOS 4000 by Everkem is an isopropylated triaryl phosphate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
Evermore Chemical Industry
HSP Distance: 1.8
AU-5T by Evermore Chemical Industry is a MDI grade. It is a moisture-curing cross-linker with good resistance properties. Used in adhesives. AU-5T can be diluted with toluene solvent... view more
Applications
Evermore Chemical Industry
HSP Distance: 1.8
AU-8F by Evermore Chemical Industry is a MDI grade. It is a moisture-curing cross-linker with good resistance properties. AU-8F can be diluted with toluene solvent. Used in adhesives... view more
Applications
HSP Distance: 1.8
2-Isopropylthioxanthone. Acts as a highly efficient free radical type II photoinitiator. It is used to initiate the photopolymerization of chemically unsaturated prepolymers, e.g. acrylates, in... view more
HSP Distance: 1.8
Suprasec® 1306 by Huntsman is a 4,4' diphenylmethane diisocyanate (MDI). Used in the production of industrial adhesives and sealants. Suprasec® 1306 is supplied as frozen solid in drums or in liquid... view more
HSP Distance: 1.8
Suprasec® 2008 by Huntsman is a prepolymerized diphenyl methane diisocyanate (MDI) with low functionality. Used in industrial adhesives. Suprasec® 2008 product is designed to have a small change is... view more
Applications
HSP Distance: 1.8
Suprasec® 2010 by Huntsman is a prepolymerized diphenyl methane diisocyanate (MDI). Suprasec® 2010 is used in industrial adhesives... view more
Applications
HSP Distance: 1.8
Suprasec® 2021 by Huntsman is a low-functionality MDI based prepolymer. Used in the formulation of adhesives and in cast polyurethanes with engineering requirements. Suprasec® 2021 has an average... view more
Applications
HSP Distance: 1.8
Suprasec® 2030 is a pre-polymerized diphenyl methane diisocyanate (MDI). Used in industrial adhesives. Suprasec® 2030 gives a wide compatibility... view more
Applications
HSP Distance: 1.8
Suprasec® 2050 by Huntsman is a MDI based prepolymer with mid-functionality. Suprasec® 2050 is used in the formulation of adhesives and in high performance elastomeric applications... view more
Applications
HSP Distance: 1.8
Suprasec® 2054 is a low-functionality MDI based prepolymer for polyurea systems by Huntsman. Used in the formulation of adhesives. Suprasec® 2054 provides very good tear strength and good E-modulus... view more
Applications
HSP Distance: 1.8
Suprasec® 2067 by Huntsman is a diphenylmethane diisocyanate (MDI)-based higher functional prepolymer. The versatility of this polyurethane provides formulators with a particularly wide choice when... view more
Applications
HSP Distance: 1.8
Suprasec® 2085 by Huntsman is a high functionality polymeric MDI. Used in industrial adhesives. It has an average functionality of 2.9. Suprasec® 2085 yields early crosslinking for fast cure... view more
Applications
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